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Publications of V Baukens

Journal papers

  1. C. Debaes, M. Vervaeke, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, B. Volckaerts, W. Meeus, M. Brunfaut, J. Van Campenhout, A. Hermanne and H. Thienpont Low-Cost Microoptical Modules for MCM Level Optical Interconnections IEEE Journal of selected topics in quantum electronics, Vol. 9(2), pp. 518-530 (2003)
  2. H. Thienpont, V. Baukens, B. Volckaerts, H. Ottevaere, C. Debaes, M. Vervaeke, P. Tuteleers, P. Vynck, A. Hermanne, M. Hanney, M. Brunfaut, J.M. Van Campenhout and I. Veretennicoff Free-space micro-optical modules: the missing link for photonic interconnects to silicon chips Opto-Electronics Review, Vol. 9(3), pp. 238-247 (2001)

Conference publications

  1. C DEBAES, M VERVAEKE, V BAUKENS, Heidi Ottevaere, P VYNCK, Pascal Tuteleers, B VOLCKAERTS, Wim Meeus, Marnik Brunfaut, Jan Van Campenhout, A HERMANNE and Hugo Thienpont Photonic interconnects to silicon chips. QUANTUM SENSING AND NANOPHOTONIC DEVICES, Vol. 5359, pp. 337-351 (2004)
  2. C DEBAES, M VERVAEKE, V BAUKENS, Wim Meeus, Pascal Tuteleers, Marnik Brunfaut, Jan Van Campenhout and Hugo Thienpont Multi-channel free-space intra-chip optical interconnections: Combining plastic micro-optical modules and VCSEL based OE-FPGA. OPTOELECTRONIC INTERCONNECTS, INTEGRATED CIRCUITS, AND PACKAGING, Vol. 4652, pp. 177-185 (2002)
  3. C. Debaes, M. Vervaeke, H. Ottevaere, W. Meeus, P. Tuteleers, M. Brunfaut, V. Baukens, J. Van Campenhout and H. Thienpont Demonstration of manufacturable free-space modules for multi-channel intra-chip optical interconnects 2002 IEEE/LEOS Annual Meeting Conference Proceedings, pp. 63-64 (2002)
  4. C. Debaes, M. Vervaeke, V. Baukens, W. Meeus, P. Tuteleers, M. Brunfaut, J. Van Campenhout and H. Thienpont Demonstrator Testbed for Intra-Chip Optical Interconnections: Combining Multi-Channel Free-Space Plastic Micro-Optical Modules and VCSEL Based OE-FPGAs Proceedings of the Second Annual IEEE Photonic Devices and Systems Packaging Symposium (PhoPack 2002), pp. 41-47 (2002)
  5. Hugo Thienpont, V BAUKENS, B VOLCKAERTS, Heidi Ottevaere, C DEBAES, M VERVAEKE, Pascal Tuteleers, P VYNCK, A HERMANNE, M HANNEY, Marnik Brunfaut, Jan Van Campenhout and Irina Veretennicoff Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001, Vol. 4408, pp. 6-18 (2001)

Other publications

  1. J. Van Campenhout, H. Neefs, A. Vander Vorst, G. Torrese, H. Pauwels, R. Vounckx, L. Sheng, R. Baets, T. Coosemans, P. Modak, H. De Pauw, H. Thienpont, P. Vynck and V. Baukens Seminar and IUAP13-meeting : collection of presented slides IUAP13 Photonic Technologies for Advanced Information Systems, pp. (1999)