-

Publications of E Bosman

Journal papers

  1. Jeroen Missinne, Sandeep Kalathimekkad, Bram Van Hoe, Erwin Bosman, Jan Vanfleteren and Geert Van Steenberge Stretchable optical waveguides OPTICS EXPRESS, Vol. 22(4), pp. 4168-4179 (2014)
  2. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Two axis optoelectronic tactile shear stress sensor SENSORS AND ACTUATORS A-PHYSICAL, Vol. 186, pp. 63-68 (2012)
  3. Bram Van Hoe, Graham Lee, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Oliver Maskery, David J Webb, Kate Sugden, Peter Van Daele and Geert Van Steenberge Ultra small integrated optical fiber sensing system SENSORS, Vol. 12(9), pp. 12052-12069 (2012)
  4. Bram Van Hoe, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Giuseppe Melpignano, Tom De Geyter, Greetje Godier, Peter Van Daele and Geert Van Steenberge Photonic incremental pressure sensor based on optical feedback in a Polymer embedded VCSEL IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 24(13), pp. 1151-1153 (2012)
  5. Erwin Bosman, Jeroen Missinne, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Jurgen Van Erps, Ivaylo Milenkov, Krassimir Panajotov, Tim Van Gijseghem, Peter Dubruel, Hugo Thienpont and Peter Van Daele Ultrathin optoelectronic device packaging in flexible carriers IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Vol. 17(3), pp. 617-628 (2011)
  6. Erwin Bosman Toward flexible optoelectronics packaging SPIE NEWSROOM, pp. 3 (2011)
  7. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Flexible shear sensor based on embedded optoelectronic components IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 23(12), pp. 771-773 (2011)
  8. Erwin Bosman, Geert Van Steenberge, Bram Van Hoe, Jeroen Missinne, Jan Vanfleteren and Peter Van Daele Highly reliable flexible active optical links IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 22(5), pp. 287-289 (2010)
  9. Wim Christiaens, Erwin Bosman and Jan Vanfleteren UTCP : a novel polyimide-based ultra-thin chip packaging technology IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 33(4), pp. 754-760 (2010)
  10. Jonathan Govaerts, Erwin Bosman, Wim Christiaens and Jan Vanfleteren Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 33(1), pp. 72-78 (2010)
  11. Erwin Bosman, Geert Van Steenberge, Ivaylo Milenkov, Krassimir Panajotov, Hugo Thienpont, Johan Bauwelinck and Peter Van Daele Fully flexible optoelectronic foil IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, Vol. 16(5), pp. 1355-1362 (2010)
  12. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates IEEE Transactions on Advanced Packaging, Vol. 32(1), pp. 77-83 (2009)
  13. Nina Hendrickx, Jurgen Van Erps, Erwin Bosman, Christof Debaes, Hugo Thienpont and Peter Van Daele Embedded micromirror inserts for optical Printed Circuit Boards IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 20(17-20), pp. 1727-1729 (2008)
  14. Geert Van Steenberge, Nina Hendrickx, Erwin Bosman, J Van Erps, Hugo Thienpont and P Van Daele Laser ablation of parallel optical interconnect waveguides IEEE Photonics Technology Letters, Vol. 18(9), pp. 1106-1108 (2006)
  15. W Christiaens, E Bosman and J Vanfleteren Ultra-thin chip package using embedding in spin-on polyimides GOOD-DIE newsletter(19), pp. 41-44 (2006)

Conference publications

  1. Erwin Bosman, Kamalpreet Kaur, Jeroen Missinne, Bram Van Hoe and Geert Van Steenberge Assembly of optoelectronics for efficient chip-to-waveguide coupling 15th Electronics Packaging Technology Conference, Proceedings, pp. 630-634 (2013)
  2. Geert Van Steenberge, Erwin Bosman, Jeroen Missinne, Bram Van Hoe, Kamalpreet Kaur, Sandeep Kalathimekkad, Nuria Teigell Beneitez and Ahmed Gamal Mosad Abuelmoaty Elmogi Optoelectronics packaging for efficient chip-to-waveguide coupling European Conference and Exhibition on Optical Communication : European Cluster in Optical Interconnects Workshop, Abstracts, pp. (2013)
  3. Bram Van Hoe, Jeroen Missinne, Erwin Bosman and Geert Van Steenberge Photonic skins for pressure, shear and strain sensing 1st International Workshop on Embedded Optical Sensor for Composite Materials, Abstracts, pp. (2013)
  4. Jeroen Missinne, Plamen Kostov, Bram Van Hoe, Erwin Bosman, Wolfgang Gaberl, Horst Zimmermann and Geert Van Steenberge Ultra-thin multi-axial shear stress sensor based on a segmented photodiode 2013 IEEE Photonics Conference (IPC), pp. 606-607 (2013)
  5. Jeroen Missinne, Stefano Beri, Mamoni Dash, Erwin Bosman, Peter Dubruel, Jan Watté and Geert Van Steenberge Self-written waveguides for field-installable fiber connectors OSA Technical Digest, pp. 3 (2013)
  6. Ahmed Gamal Mosad Abuelmoaty Elmogi, Erwin Bosman, Sandeep Kalathimekkad, Nuria Teigell Beneitez, Jeroen Missinne, Rafik Guindi and Geert Van Steenberge Board-level single-mode polymer optical waveguides Annual Symposium of the IEEE Photonics Benelux Chapter, Proceedings, pp. 1-4 (2013)
  7. Bram Van Hoe, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Geert Van Steenberge and Peter Van Daele Novel coupling and packaging approaches for optical interconnects PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8267, pp. 11 (2012)
  8. Jeroen Missinne, Bram Van Hoe, Erwin Bosman, Sandeep Kalathimekkad, Geert Van Steenberge and Peter Van Daele Compact coupling and packaging concepts for flexible and stretchable polymer optical interconnects 2012 IEEE Optical Interconnects Conference, pp. 129-130 (2012)
  9. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge and Jan Vanfleteren Fluorescence-based optochemical sensor on flexible foils PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8439(0Y-1), pp. 84390Y-1-84390Y-9 (2012)
  10. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge and Jan Vanfleteren Foil-based optical technology platform for optochemical sensors PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8264(0R-1), pp. 82640R-1-82640R-9 (2012)
  11. Bram Van Hoe, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, G Lee, Z Yan, K Sugden, DJ Webb, Geert Van Steenberge and Peter Van Daele Low-cost fully integrated fiber Bragg grating interrogation system PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8351, pp. 8 (2012)
  12. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Ultra thin optical tactile shear sensor PROCEDIA ENGINEERING, Vol. 25, pp. 1393-1396 (2012)
  13. Erwin Bosman, Bram Van Hoe, Jeroen Missinne, Geert Van Steenberge, Sandeep Kalathimekkad and Peter Van Daele Unobtrusive packaging of optoelectronic devices for optical tactile and shear sensors PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY, pp. 504-509 (2011)
  14. Bram Van Hoe, Erwin Bosman, Jeroen Missinne, Geert Van Steenberge, Peter Van Daele, Wei Zhang, Ian Johnson, Kate Sugden, David J Webb and Kyriacos Kalli Embedded multiplexed polymer optical fiber sensor for esophageal manometry 2011 IEEE Sensors, pp. 1499-1502 (2011)
  15. Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad and Peter Van Daele Packaging technology enabling flexible optical interconnections Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7944, pp. 9 (2011)
  16. Bram Van Hoe, Geert Van Steenberge, Erwin Bosman, Jeroen Missinne, Thomas Geernaert, Francis Berghmans, David J. Webb and Peter Van Daele Optical fiber sensors embedded in polymer flexible foils PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 7726(Optical Sensing and Detection), pp. 10 (2010)
  17. Erwin Bosman, Johan Bauwelinck, Krassimir Panajotov, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe and Peter Van Daele Characterization of flexible fully embedded optical links PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 7716, pp. 12 (2010)
  18. Jeroen Missinne, Geert Van Steenberge, Bram Van Hoe, Erwin Bosman, Christof Debaes, Jurgen Van Erps, Chunxiao Yan, Eleonora Ferraris, Peter Van Daele, Jan Vanfleteren, Hugo Thienpont and Dominiek Reynaerts High density optical pressure sensor foil based on arrays of crossing flexible waveguides PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 7716, pp. 12 (2010)
  19. Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe and Peter Van Daele Packaging of opto-electronic devices for flexible applications PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 7607, pp. 10 (2010)
  20. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Peter Van Daele and Jan Vanfleteren Embedded flexible optical shear sensor IEEE Sensors, pp. 987-990 (2010)
  21. Jürgen Van Erps, Nina Hendrickx, Erwin Bosman, Peter Van Daele, Christof Debaes and Hugo Thienpont Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB-level optical interconnections Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7716, pp. 10 (2010)
  22. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Jan Vanfleteren and Peter Van Daele Fully embedded optical and electrical interconnections in flexible foils 2009 European Microelectronics and Packaging Conference (EMPC), pp. 5 (2009)
  23. N. Hendrickx, J. Van Erps, Erwin Bosman, H. Thienpont and Peter Van Daele Coupling structures for out-of-plane coupling in optical PCBs MICRO-OPTICS 2008, Vol. 6992, pp. R9920-R9920 (2008)
  24. Geert Van Steenberge, Erwin Bosman, Jeroen Missinne, Bram Van Hoe and Peter Van Daele Flexible optical interconnects Proceedings of the 2nd International Symposium on Photonic Packaging, pp. 3 (2008)
  25. Peter Van Daele, Nina Hendrickx, Geert Van Steenberge and Erwin Bosman Coupling light to and from optical boards Proceedings of the 2nd International Symposium on Photonic Packaging, pp. 5 (2008)
  26. Nina Hendrickx, J. Van Erps, Erwin Bosman, C. Debaes, H. Thienpont and Peter Van Daele Embedded 45° micro-mirror for out-of-plane coupling in optical PCBs Proceedings of the 14th MicroOptics Conference (MOC'08), pp. 2 (2008)
  27. Tim Van Gijseghem, Erwin Bosman, Peter Van Daele, T. Geernaert, T. Nasilowski, H. Ottevaere, H. Thienpont, M. Devolder, D. Reynaerts, E. Schacht and P. Dubruel Development of flexible materials for photonic optical skins Proceedings of the Polymer Processing Society 24th Annual Meeting, PPS-24, pp. S02-666- (2008)
  28. Tim Van Gijseghem, Veerle Boterberg, Erwin Bosman, Peter Van Daele, T GEERNAERT, T NASILOWSKI, Heidi Ottevaere, Hugo Thienpont, E FERRARIS, D REYNAERTS, Etienne Schacht and Peter Dubruel Flexible materials for optical applications Book of Abstracts of the BPG Annual Meeting 2008, Sunparks De Haan, 22-23 May, pp. 100-100 (2008)
  29. Nina Hendrickx, Geert Van Steenberge, Erwin Bosman, J Van Erps, H Thienpont and Peter Van Daele Towards flexible routing schemes for polymer optical interconnections on Printed Circuit Boards PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6897, pp. XXXI-XXXVII (2008)
  30. Erwin Bosman, Geert Van Steenberge, Wim Christiaens, Nina Hendrickx, Jan Vanfleteren and Peter Van Daele Active optical links embedded in flexible substrates ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, pp. 1150-1157 (2008)
  31. Erwin Bosman, Geert Van Steenberge, Nina Hendrickx, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Flexible embedded active optical link PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6992, pp. 69920V-1-69920V-10 (2008)
  32. Nina Hendrickx, Geert Van Steenberge, Erwin Bosman, J Van Erps, H Thienpont and Peter Van Daele Towards flexible routing schemes for polymer optical interconnections on printed circuit boards PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6899, pp. 689904-1-689904-7 (2008)
  33. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Multiple Chip Integration for Flat Flexible Electronics Proceedings of the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. 1-5 (digitaal) (2008)
  34. Wim Christiaens, Erwin Bosman, Wim Huwel, Wim Perdu and Jan Vanfleteren Flexible polyimide based ultra-thin chip package (UTCP) International workshop on Flexible and Stretchable Electronics, 1st, Abstracts, pp. ? (2007)
  35. Geert Van Steenberge, Nina Hendrickx, Erwin Bosman, Steven Van Put, Peter Geerinck and Peter Van Daele Laser Ablation: a Versatile Micro-Machining Technology NEMO`s 2nd general scientific networking meeting, pp. (2007)
  36. E Bosman, P Geerinck, W Christiaens, G Van Steenberge, J Vanfleteren and P Van Daele Multimode optical interconnections embedded in flexible electronics Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 155-160 (2007)
  37. E Bosman, G Van Steenberge, P Geerinck, W Christiaens, J Vanfleteren and P Van Daele Embedding of optical interconnections in flexible electronics Proceedings of the 57th Electronic Components and Technology Conference (ECTC), pp. 1281-1287 (2007)
  38. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates - art. no. 618506 MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, pp. 18506-18506 (2006)
  39. Wim Christiaens, Bart Vandevelde, Erwin Bosman and Jan Vanfleteren UTCP : 60 µm thick bendable package International Wafer-Level Packaging Conference, 3rd, Proceedings, pp. 114-119 (2006)
  40. Wim Christiaens, Erwin Bosman and J VANFLETEREN Ultra-thin chip package using embedding in spin-on polyimides Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 125-128 (2006)
  41. Erwin Bosman, Wim Christiaens, Peter Geerinck, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical interconnections embedded in flexible substrates Proceedings of the 7th UGent PhD symposium, pp. 69- (2006)
  42. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Optical Interconnections embedded in flexible substrates Proceedings Symposium IEEE/LEOS Benelux Chapter, pp. 229-232 (2006)
  43. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates Proceedings of SPIE Photonics Europe Conference, Vol. 6185, pp. 618506/1-618506/8 (2006)
  44. Geert Van Steenberge, Nina Hendrickx, Peter Geerinck, Erwin Bosman, Steven Van Put and Peter Van Daele Development of a technology for fabricating low cost parallel optical interconnects Proceedings of SPIE Photonics Europe Conference, pp. 618507/1-618507/8 (2006)
  45. Geert Van Steenberge, Nina Hendrickx, Peter Geerinck, Erwin Bosman, Steven Van Put, J Van Erps, Hugo Thienpont and Peter Van Daele Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board Proceedings of SPIE Photonics West Conference, Vol. 6126, pp. 612603/1-612603/9 (2006)
  46. W Christiaens, E Bosman and J Vanfleteren Ultra-thin chip package using embedding in spin-on polyimides Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 125-128 (2006)
  47. Geert Van Steenberge, Steven Van Put, Nina Hendrickx, Erwin Bosman, Peter Geerinck, Peter Van Daele, H SUYAL and M TAGHIZADEH Laser patterning (invited paper) Workshop on Micro-optics - Benefits for Industry, NEMO - FP6 - Project (www.micro-optics.org) Abstract and presentation available on CD-ROM (Paper 6), pp. (2005)
  48. Nina Hendrickx, Geert Van Steenberge, Peter Geerinck, Steven Van Put, Erwin Bosman and Peter Van Daele Multilayer Optical Interconnections Integrated on a Printed Circuit Board Proceedings 15th European Microelectronics and Packaging Conference, pp. 329-333 (2005)
  49. Geert Van Steenberge, Peter Geerinck, Steven Van Put, Nina Hendrickx, Erwin Bosman, Heidi Ottevaere, Hugo Thienpont and Peter Van Daele 45° Out-of-Plane Turning Mirrors for Optical Printed Circuit Boards Proceedings 15th European Microelectronics and Packaging Conference, pp. 557-560 (2005)

Other publications

  1. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman and Johan De Baets System-in-foil technology Ultra-thin chip technology and applications, pp. 141-157 (2011)
  2. Erwin Bosman Integration of optical interconnections and optoelectronic components in flexible substrates pp. XXXIV, 284 (2010)
  3. Erwin Bosman Fabricage van eindfacetten aan polymere optische vezels met behulp van laserablatie pp. II, 87 (2004)