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Fri, 2007-01-12 20:08 — mronsse

Publications of Wim Christiaens

Journal papers

  1. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis and PHM Timmermans Design and implementation of flexible and stretchable systems MICROELECTRONICS RELIABILITY, Vol. 51(6), pp. 1069-1076 (2011)
  2. Wim Christiaens, Erwin Bosman and Jan Vanfleteren UTCP : a novel polyimide-based ultra-thin chip packaging technology IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 33(4), pp. 754-760 (2010)
  3. Jonathan Govaerts, Erwin Bosman, Wim Christiaens and Jan Vanfleteren Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 33(1), pp. 72-78 (2010)
  4. Els Parton, Wim Christiaens and Jan Vanfleteren Embedded chips redefine miniaturization PRINTED CIRCUIT DESIGN & FAB, Vol. 26(7), pp. 37-39 (2009)
  5. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne and Jan Vanfleteren Improved passive-matrix multiplexability with a modular display and UTCP technology DISPLAYS, Vol. 30(2), pp. 71-76 (2009)
  6. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne and Jan Vanfleteren Improved Passive-Matrix Multiplexability with a Modular Display and UTCP Technology Displays, Vol. 30(2), pp. 71-76 (2009)
  7. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates IEEE Transactions on Advanced Packaging, Vol. 32(1), pp. 77-83 (2009)
  8. Wim Christiaens, Thomas Loeher, Barbare Pahl, Michael Feil, Bart Vandevelde and Jan Vanfleteren Embedding and Assembly of Ultrathin Chips in Multilayer Flex Boards Circuit World, Vol. 34(3), pp. 3-8 (2008)
  9. Els Patron and Wim Christiaens New Packaging Concept for Ultra-thin Chips Advanced Packaging: the International Magazine for Electronic Packaging, pp. 20 (2006)

Conference publications

  1. Tom Sterken, Filip Vermeiren, Piers Tremlett, Wim Christiaens and Jan Vanfleteren Embedding thinned chip in flexible PCBs ESTC 2012 : 4th electronics system integration technologies conference, pp. 4 (2012)
  2. Tom Sterken, Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Yung-yu Hsu, Tom Torfs and Maaike Opdebeeck A Reliable and comfortable package for wearable medical devices Microelectronic packaging for medical and Hi-Rel devices, Abstracts, pp. (2011)
  3. Swarnakamal Priyabadini, An Gielen, Kristof Dhaenens, Wim Christiaens, Steven Van Put, Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren 3D-stacking of UTCPs as a module miniaturization technology 44th International Symposium on Microelectronics, Proceedings, pp. 463-468 (2011)
  4. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung Yu Hsu, Francois Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf Van der Sluis and Pieter Timmermans Thermo-mechanical analysis of flexible and stretchable systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings, pp. 7 (2010)
  5. Thomas Loeher, David Schuetze, Wim Christiaens, Kristof Dhaenens, Swarnakamal Priyabadini, Andreas Ostmann and Jan Vanfleteren Module miniaturization by ultra thin package stacking 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 1-5 (2010)
  6. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren 3D Integration of ultra-thin functional devices inside standard multilayer flex laminates European Microelectronics and Packaging Conference, Abstracts, pp. ? (2009)
  7. Jonathan Govaerts, Wim Christiaens and Jan Vanfleteren Ultra thin chip packaging (UTCP) : a promising technology for future flexible display interconnection 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, pp. 202-205 (2009)
  8. Tom Torfs, Wim Christiaens, Jan Vanfleteren, Wim Huwel, Wim Perdu, RF Yazicioglu, Steven Brebels and Chris Van Hoof Flexible wireless biopotential system with embedded ultra-thin chip Smart Systems Integration Conference, 3rd, Abstracts, pp. ? (2009)
  9. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren 3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems International Semiconductor Technology Conference and China Semiconductor Technology International Conference, Abstracts, pp. ? (2009)
  10. Erwin Bosman, Geert Van Steenberge, Wim Christiaens, Nina Hendrickx, Jan Vanfleteren and Peter Van Daele Active optical links embedded in flexible substrates ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, pp. 1150-1157 (2008)
  11. Erwin Bosman, Geert Van Steenberge, Nina Hendrickx, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Flexible embedded active optical link PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6992, pp. 69920V-1-69920V-10 (2008)
  12. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Multiple Chip Integration for Flat Flexible Electronics Proceedings of the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. 1-5 (digitaal) (2008)
  13. Wim Christiaens, Tom Torfs, Wim Huwel and Jan Vanfleteren Functionality and Reliability Testing of Bendable Ultrathin Chip Packages Proceedings of IMAPS Nordic, pp. 230 (2008)
  14. Wim Christiaens, Erwin Bosman, Wim Huwel, Wim Perdu and Jan Vanfleteren Flexible polyimide based ultra-thin chip package (UTCP) International workshop on Flexible and Stretchable Electronics, 1st, Abstracts, pp. ? (2007)
  15. W. Christiaens, H. Burkard, J. Link and J. Vanfleteren Integration of thin flexible RF structures into flexible PCB Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 621-626 (2007)
  16. B. Vandevelde, L. Chen, S. Brebels, W. Christiaens and J. Vanfleteren Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 25-30 (2007)
  17. W. Christiaens, T. Loeher, M. Feil, B. Vandevelde and J. Vanfleteren Embedding of active components in multilayer flex boards Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  18. W. Christiaens, B. Vandevelde, S. Brebels and J. Vanfleteren Polyimide based embedding technology for RF structures and active components Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 22-29 (2007)
  19. Erwin Bosman, Wim Christiaens, Peter Geerinck, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical interconnections embedded in flexible substrates Proceedings of the 7th UGent PhD symposium, pp. 69- (2006)
  20. Wim Christiaens, Bart Vandevelde and Jan Vanfleteren (Flat) Ultra-thin chip package Meeting of the Symposium on Polymers for Microelectronics, 12th, Abstracts, pp. ? (2006)
  21. Wim Christiaens, Bart Vandevelde, Erwin Bosman and Jan Vanfleteren UTCP : 60 ��m thick bendable package International Wafer-Level Packaging Conference, 3rd, Proceedings, pp. 114-119 (2006)
  22. Wim Christiaens, Erwin Bosman and J VANFLETEREN Ultra-thin chip package using embedding in spin-on polyimides Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 125-128 (2006)
  23. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates - art. no. 618506 MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, pp. 18506-18506 (2006)
  24. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Optical Interconnections embedded in flexible substrates Proceedings Symposium IEEE/LEOS Benelux Chapter, pp. 229-232 (2006)
  25. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates Proceedings of SPIE Photonics Europe Conference, Vol. 6185, pp. 618506/1-618506/8 (2006)
  26. Wim Christiaens Flexible Embedded Components for Polyimide Substrates Proceedings 6e Ugent-FirW doctoraatssymposium, pp. (2006)
  27. Wim Christiaens, Michael Feil, Thomas Loeher and Jan Vanfleteren Embedded ultra-thin chips in flex Flexible Electronic Systems Forum, Abstracts, pp. ? (2005)

Other publications

  1. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman and Johan De Baets System-in-foil technology Ultra-thin chip technology and applications, pp. 141-157 (2011)
  2. Wim Christiaens Active and passive component integration in polyimide interconnection substrates pp. (2009)
  3. W. Christiaens and J. Govaerts Biocompatibele, flexibele elektronische schakelingen voor medische toepassingen. Afstudeerwerk FTW, UGent, pp. (2004)