Publications of P Kawka

Journal papers

1. Piotr Kawka, Gilbert De Mey and Bjorn Vermeersch Thermal Characterization of Electronic Packages using the Nyquist Plot of the Thermal Impedance IEEE Transactions on Components and Packaging Technologies, Vol. 30(4), pp. 660-665 (2007)
2. P. Kawka, G. De Mey and A. Napieralski Pomier termiznego stanu przejsciowego jako metoda obliczania aktywnej powierzchni krzemu Elektronika, Vol. 2004(1), pp. 33-35 (2004)

Conference publications

1. Jedrzej Banaszczyk, Gilbert De Mey, Marcin Janicki, Andrzej Napieralski, Bjorn Vermeersch and Piotr Kawka Dynamic thermal analysis of a power amplifier Proceedings of the 12th International Workshop on Thermal Investigation of ICs and Systems (Therminic 2006), Vol. 1, pp. 128-132 (2006)
2. Gilbert De Mey, Bjorn Vermeersch and Piotr Kawka Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance IMAPS 1st European Advanced Technology Workshop on Micropackaging & Thermal Management, 1-2 Feb 2006, La Rochelle (France): Technical Presentations CD-ROM, pp. (2006)
3. Gilbert De Mey, Bjorn Vermeersch and Piotr Kawka Thermal Impedance Simulations of Electronic Packages Proceedings of the 12th International Conference on Mixed Design and Integrated Circuits and Systems (MIXDES 2005), Vol. 1, pp. 267-269 (2005)
4. Piotr Kawka, Gilbert De Mey and A. Napieralski Electronic Package Thermal Description By Dielectric Polarization Theory Proceedings of the 11th International Conference Mixed Design of Integrated Circuits and Systems MIXDES 2004, pp. 287-290 (2004)
5. P. Kawka, G. De Mey and A. Napieralski Transient Thermal Measurement for Silicon Active Area Calculations Proceedings of the 10th International Conference Mixed Design of Integrated Circuits and Systems MIXDES, Vol. 10, pp. 383-386 (2003)
6. P. Kawka, G. De Mey and A. Napieralski Transient Thermal Measurement as a Tool for Packages Thermal Description ANCME 2003 The 2nd International Workshop on Advances in Numerical Computation Methods in Electromagnetism, Vol. 2, pp. 53-58 (2003)
7. P. Kawka, G. De Mey and A. Napieralski Transient thermal measurement as a non-invasive method for electronic chip layout investigation 6th National Congress on Theoretical and Applied Mechanics, Vol. 6, pp. op CD-ROM (2003)
8. P. Kawka, G. De Mey and A. Napieralski Transient thermal measurements of integrated circuits based on inverse heating MIXDES 2002 conference proceedings, pp. (2002)
9. G. De Mey, P. Kawka and A. Napieralski Thermal characterisation of packages by inverse heating IMAPS Symposium proceedings, pp. 105-108 (2002)
10. M JANICKI, P KAWKA, Gilbert De Mey and A NAPIERALSKI Thermal measurements of IGBT power module EXPERIENCE OF DESIGNING AND APPLICATION OF CAD SYSTEMS IN MICROELECTRONICS, pp. 37-40 (2001)
11. P. Kawka, R. Suciu and G. De Mey Finding Values of Thermal Capacity and Thermal Conductivity of Materials Used in Electronic with Thermographic Camera Proceedings of the 8th International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2001, Vol. 8, pp. 245-248 (2001)
12. P. Kawka, R. Suciu and G. De Mey Finding values of thermal capacity and thermal conductivity of materials used in electronics with a thermographic camera MIXDES 2001 conference proceedings, pp. 245-248 (2001)
13. M. Janicki, P. Kawka, G. De Mey and A. Napieralski IGBT Hybrid Module Thermal Measurements and Simulations Proceedings of the 8th International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2001, Vol. 8, pp. 249-252 (2001)

Other publications

1. Piotr Kawka Thermal Impedance Measurements and Dynamic Modeling of Electronic Packages Doctoraatsproefschrift Faculteit Toegepaste Wetenschappen, Universiteit Gent, pp. 1-148 (2005)