B. Vandecasteele, T. Podprocky, J. Vanfleteren and J. MaattanenLow temperature flip chip with adhesives on PES Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 319-324 (2003)
T. Podprocky, B. Vandecasteele, J. De Baets and A. Van CalsterIntegration of Thick Film resistors in a multilayer structure Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 137-140 (2003)
J. Vanfleteren, B. Vandecasteele and T. PodprockyLow temperature flip-chip process using ICA and NCA (Isotropically and Non-Conductive Adhesive) for flexible displays application Proceedings of the 4th Electronics Packaging Technology Conference, pp. 139-143 (2002)
B. Vandecasteele, T. Podprocky and J. VanfleterenHigh density flip chip with adhesives on ceramics Proceedings of the European Microelectronics Packaging an Interconnection Symposium (IMAPS), pp. 175-180 (2002)
J. Vanfleteren, B. Vandecasteele and T. PodprockyLow cost adhesive flip-chip assembly technology using a combination of ICA and NCA Presented at GOOD-DIE International Workshop, pp. (2002)
J. Vanfleteren, B. Vandecasteele, T. Podprocky and P. JacobsLow temperatue flip-chip assembly for biomedical applications Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, pp. 213-216 (2001)