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Fri, 2007-01-12 20:08 — mronsse

Publications of Jan Vanfleteren

Journal papers

  1. Swarnakamal Priyabadini, Tom Sterken, Luc Van Hoorebeke and Jan Vanfleteren 3D stacking of ultra-thin chip packages : an innovative packaging and interconnection technology IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY(99), pp. 1-9 (2013)
  2. Benoît Huyghe, Pietro Salvo, Jan Doutreloigne and Jan Vanfleteren Feasibility study and performance analysis of a gyroless orientation tracker IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, Vol. 61(8), pp. 2274-2282 (2012)
  3. Maarten Rockelé, Duy-Vu Pham, Jürgen Steiger, Silviu Botnaras, Dennis Weber, Jan Vanfleteren, Tom Sterken, Dieter Cuypers, Soeren Steudel, Kris Myny, Sarah Schols, Bas van der Putten, Jan Genoe and Paul Heremans Solution-processed and low-temperature metal oxide n-channel thin-film transistors and low-voltage complementary circuitry on large-area flexible polyimide foil JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, Vol. 20(9), pp. 499-507 (2012)
  4. Pietro Salvo, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu and Jan Vanfleteren Adhesive bonding by SU-8 transfer for assembling microfluidic devices MICROFLUIDICS AND NANOFLUIDICS, Vol. 13(6), pp. 987-991 (2012)
  5. Tom De Nies, Thomas Vervust, Michiel Demey, Marc Leman, Jan Vanfleteren and Rik Van de Walle Synchronizing music and movement with BeatLED : an interactive musical social game JOURNAL OF NEW MUSIC RESEARCH, Vol. 41(4), pp. 351-363 (2012)
  6. Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf and Michal Jablonski SCB and SMI : two stretchable circuit technologies, based on standard printed circuit board processes CIRCUIT WORLD, Vol. 38(4), pp. 232-242 (2012)
  7. Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, Yung-Yu Hsu, Thomas Vervust, Ingrid De Wolf and Michal Jablonski Printed circuit board technology inspired stretchable circuits MRS BULLETIN, Vol. 37(3), pp. 254-260 (2012)
  8. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Two axis optoelectronic tactile shear stress sensor SENSORS AND ACTUATORS A-PHYSICAL, Vol. 186, pp. 63-68 (2012)
  9. Rik Verplancke, Frederick Bossuyt, Dieter Cuypers and Jan Vanfleteren Thin-film stretchable electronics technology based on meandering interconnections : fabrication and mechanical performance JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 22(1), pp. 9 (2012)
  10. Amir Jahanshahi, Fabrice Axisa and Jan Vanfleteren Fabrication of a biocompatible flexible electroosmosis micropump MICROFLUIDICS AND NANOFLUIDICS, pp. (2012)
  11. Pietro Salvo, Robrecht Raedt, Evelien Carrette, David Schaubroeck, Jan Vanfleteren and Ludwig Cardon A 3D printed dry electrode for ECG-EEG recording SENSORS AND ACTUATORS A-PHYSICAL, pp. (2012)
  12. Amir Jahanshahi, Pietro Salvo and Jan Vanfleteren Reliable stretchable gold interconnects in biocompatible elastomers JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, Vol. 50(11), pp. 773-776 (2012)
  13. Liang Wang, Tom Sterken, Maarten Cauwe, Dieter Cuypers and Jan Vanfleteren Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, Vol. 2(7), pp. 1099-1106 (2012)
  14. Divya Kurup, Maria Lucia Scarpello, Günter Vermeeren, Wout Joseph, Kristof Dhaenens, Fabrice Axisa, Luc Martens, Dries Vande Ginste, Hendrik Rogier and Jan Vanfleteren In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING, pp. 9 (2011)
  15. Maria Lucia Scarpello, Divya Kurup, Hendrik Rogier, Dries Vande Ginste, Fabrice Axisa, Jan Vanfleteren, Wout Joseph, Luc Martens and Günter Vermeeren Design of an implantable slot dipole conformal flexible antenna for biomedical applications IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, Vol. 59(10), pp. 3556-3564 (2011)
  16. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren and Ingrid De Wolf Polyimide-enhanced stretchable interconnects : design, fabrication, and characterization IEEE TRANSACTIONS ON ELECTRON DEVICES, Vol. 58(8), pp. 2680-2688 (2011)
  17. Iaci M Pereira, Fabrice Axisa, Rodrigo L Oréfice, Jan Vanfleteren and Hercules P Neves Shape-memory anchoring system for bladder sensors JOURNAL OF BIOMEDICAL MATERIALS RESEARCH PART B-APPLIED BIOMATERIALS, Vol. 96B(2), pp. 369-375 (2011)
  18. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren and Ingrid De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects THIN SOLID FILMS, Vol. 519(7), pp. 2225-2234 (2011)
  19. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis and PHM Timmermans Design and implementation of flexible and stretchable systems MICROELECTRONICS RELIABILITY, Vol. 51(6), pp. 1069-1076 (2011)
  20. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Flexible shear sensor based on embedded optoelectronic components IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 23(12), pp. 771-773 (2011)
  21. André Van Calster and Jan Vanfleteren 3-D simulation of compound thin-film transistors JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, Vol. 18(12), pp. 1021-1028 (2010)
  22. Erwin Bosman, Geert Van Steenberge, Bram Van Hoe, Jeroen Missinne, Jan Vanfleteren and Peter Van Daele Highly reliable flexible active optical links IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 22(5), pp. 287-289 (2010)
  23. Wim Christiaens, Erwin Bosman and Jan Vanfleteren UTCP : a novel polyimide-based ultra-thin chip packaging technology IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 33(4), pp. 754-760 (2010)
  24. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde and Ingrid De Wolf Design and analysis of a novel fine pitch and highly stretchable interconnect MICROELECTRONICS INTERNATIONAL, Vol. 27(1), pp. 33-38 (2010)
  25. Jonathan Govaerts, Erwin Bosman, Wim Christiaens and Jan Vanfleteren Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 33(1), pp. 72-78 (2010)
  26. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren and Ingrid De Wolf The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 20(7), pp. 11 (2010)
  27. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne and Jan Vanfleteren Improved passive-matrix multiplexability with a modular display and UTCP technology DISPLAYS, Vol. 30(2), pp. 71-76 (2009)
  28. Nathalie De Geyter, Rino Morent, Tinneke Jacobs, Fabrice Axisa, Leon Gengembre, Christophe Leys, Jan Vanfleteren and Edmond Payen Remote atmospheric pressure DC glow discharge treatment for adhesion improvement of PDMS PLASMA PROCESSES AND POLYMERS, Vol. 6(suppl. 1), pp. S406-S411 (2009)
  29. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren and Ingrid De Wolf In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect JOURNAL OF MATERIALS RESEARCH, Vol. 24(12), pp. 3573-3582 (2009)
  30. Els Parton, Wim Christiaens and Jan Vanfleteren Embedded chips redefine miniaturization PRINTED CIRCUIT DESIGN & FAB, Vol. 26(7), pp. 37-39 (2009)
  31. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne and Jan Vanfleteren Improved Passive-Matrix Multiplexability with a Modular Display and UTCP Technology Displays, Vol. 30(2), pp. 71-76 (2009)
  32. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates IEEE Transactions on Advanced Packaging, Vol. 32(1), pp. 77-83 (2009)
  33. Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde and Jan Vanfleteren Design of metal interconnects for stretchable electronic circuits MICROELECTRONICS RELIABILITY, Vol. 48(6), pp. 825-832 (2008)
  34. Beno��t Huyghe, Hendrik Rogier, Jan Vanfleteren and Fabrice Axisa Design and Manufacturing of Stretchable High-Frequency Interconnects IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31(4), pp. 802-808 (2008)
  35. Jonathan Govaerts, Bjorn Vandecasteele and Jan Vanfleteren Interconnecting drivers to flexible displays Journal of the SID, Vol. 16(7), pp. 765-775 (2008)
  36. Wim Christiaens, Thomas Loeher, Barbare Pahl, Michael Feil, Bart Vandevelde and Jan Vanfleteren Embedding and Assembly of Ultrathin Chips in Multilayer Flex Boards Circuit World, Vol. 34(3), pp. 3-8 (2008)
  37. Rino Morent, Nathalie De Geyter, Fabrice Axisa, Nele De Smet, L GENGEMBRE, Eva De Leersnyder, Christophe Leys, Jan Vanfleteren, Monika Rymarczyk-Machal, Etienne Schacht and E PAYEN Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics JOURNAL OF PHYSICS D-APPLIED PHYSICS, Vol. 40(23), pp. 7392-7401 (2007)
  38. Dominique Brosteaux, Fabrice Axisa, Mario Gonzalez and Jan Vanfleteren Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits IEEE Electron Device Letters, Vol. 28(7), pp. 552-554 (2007)
  39. E. Parton, M. Gonzalez, R. Labie, B. Vandevelde, J. Vanfleteren and P. Ratchev Packaging research goes lead-free Printed Circuit Europe, pp. 38-41 (2003)
  40. F. Bruyneel, H. De Smet, J. Vanfleteren and A. Van Calster Response to Comment on the paper `Method for Measuring the cell gap in liquid-crystal displays` Optical Engineering, Vol. 42(8), pp. 2466 (2003)
  41. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren and B. Vandecasteele Comparison of different flex materials in high density flip chip on flex applications Microelectronics Reliability, Vol. 43(3), pp. 445-451 (2003)
  42. F. Bruyneel, H. De Smet, J. Vanfleteren and A. Van Calster Cell gap optimization and alignment effects in reflective PDLC microdisplays Liquid Crystals, Vol. 40(28), pp. 1245-1252 (2001)
  43. F. Bruyneel, H. De Smet, J. Vanfleteren and A. Van Calster Method for measuring the cell gap in liquid-crystal displays Optical Engineering, Vol. 40(2), pp. 259-267 (2001)
  44. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam and K. Allaert Mixed assembly on PCB using a novel flip-chip technology Advancing Microelectronics, Vol. 27(5), pp. 28-30 (2000)
  45. H. De Pauw, H. De Smet, J. Vanfleteren, J. Lernout and A. Van Calster Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities Microelectronics Reliability, Vol. 40, pp. 163-170 (2000)
  46. J. Lernout, J. Vanfleteren, A. Van Calster and G. Schols A five-layer thin film MCM-Si design using oxynitride dielectrics Microelectronics International, Vol. 15(1), pp. 39-42 (1998)
  47. H. De Smet, J. De Baets, A.M. De Cubber, J. De Vos, A. Van Calster and J. Vanfleteren New model for the characterization and simulation of TFTs in all operating regions Journal of the Society for Information Display, Vol. 3(3), pp. 119-125 (1995)
  48. J. Capon, J. De Baets, A.M. De Cubber, H. De Smet, A. Van Calster and J. Vanfleteren Analysis of Transient Photoconductivity in CdSe:Cu:Cl Thin Films Physica Status Solidi A-Applied Research, Vol. 142(1), pp. (1994)
  49. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa and H. Takatsu A Polymer-Network Liquid-Crystal Poly-CdSe-TFT Active-Matrix Display Journal of the Society for Information Display, Vol. 1(2), pp. 189-194 (1993)
  50. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren A Lensless Contact-type Image Sensor Based on a CdSe Photoconductive Array Sensors and Actuators A-Physical, Vol. 37-38, pp. 546-551 (1993)
  51. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren Geometric Design of Lensless Photoconductive Cotact-type Image Sensors Journal of the Society for Information Display, Vol. 1(2), pp. 233-241 (1993)
  52. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster and J. Vanfleteren Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge Journal of the Society for Information Display, Vol. 1/4(4), pp. 423-428 (1993)
  53. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Sensors and Actuators A-Physical, Vol. 32(1-3), pp. 437-441 (1992)
  54. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Thin Film Transistors for the Adressing of Liquid Crystal Displays Molecular Materials, Vol. 1, pp. 189-301 (1992)
  55. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster and J. Vanfleteren The Electrical Performance of a Complementary CdSe:In/Ge:Cu Thin Film Transistor Technology for Flat Panel Displays Solid-State Electronics, Vol. 34(2), pp. 143-147 (1990)
  56. A. Van Calster, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Transistori a Film Sottile per Indicatori a Schermo Piatto Alta Frequenza Riv. di. Elett., Vol. II(1), pp. 3 - 8 (1990)
  57. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster and J. Vanfleteren The Influence of Low Copper-Doping Concentrations on the Recrystallisation Process in and the Electrical Properties of Germanium in Ge:Cu Thin Film Transistors Thin Solid Films(189), pp. 235-245 (1990)
  58. I. De Rycke, A. Van Calster, J. Vanfleteren, J. De Baets, J. Doutreloigne, H. De Smet and P. Vetter 2-MHz Clocked LCD Drivers on Glass IEEE Journal of Solid-State Circuits, Vol. 25(2), pp. 531-538 (1989)
  59. J. De Baets, J. Vanfleteren, I. De Rycke, J. Doutreloigne, A. Van Calster and P. De Visschere High-Voltage Polycrystalline CdSe Thin-Film Transistors IEEE Transactions on Electron Devices, Vol. 37(3), pp. 636-639 (1989)
  60. A. Van Calster, J. Vanfleteren, I. De Rycke and J. De Baets On the Field Effect in Polycristalline Thin-Film Transistors Applied Physics, Vol. 64(6), pp. 3282-3286 (1988)
  61. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets and J. Vanfleteren Polycrystalline CdSe films for thin film transistors Journal of Crystal Growth, Vol. 86, pp. 924-928 (1988)
  62. A. Van Calster, I. De Rycke, A. Vervaet, J. De Baets and J. Vanfleteren A New Technology for Fast Switching Circuits on Glass IEEE Electron Device Letters, Vol. EDL-8(10), pp. 477-479 (1987)
  63. J. Vanfleteren and A. Van Calster A Comparative Study of Evaporated Al2O3, SiO2 and SiO2:Al2O3 Thin Films Thin Solid Films, Vol. 139, pp. 89-94 (1985)
  64. J. Vanfleteren and A. Van Calster A Four-Vacuum-Cycle Lift-Off Process for the Polycristalline CdSe Thin-Film Transistor IEEE Electron Device Letters, Vol. EDL-6(1), pp. 11-13 (1984)

Conference publications

  1. Rik Verplancke, Amir Jahanshahi, Tom Sterken, Dieter Cuypers and Jan Vanfleteren Thin-film based stretchable electronics technologies Smart systems integration 2013, pp. 8 (2013)
  2. Swarnakamal Priyabadini, Tom Sterken, Maaike Op de Beeck and Jan Vanfleteren Photo-definable polyimide-based flat UTCP technology for 3D-stacking application Smart systems integration 2013, pp. 8 (2013)
  3. Amir Jahanshahi, Pietro Salvo and Jan Vanfleteren Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers 34th Annual International Conference of the Engineering in Medicine and Biology Society, Proceedings, pp. 6007-6010 (2012)
  4. Sanjeev Naithani, Rajesh Mandamparambil, Ferdie van Assche, David Schaubroeck, Henri Fleddreus, An Prenen, Geert Van Steenberge and Jan Vanfleteren Influence of barrier absorption properties on laser patterning thin organic films PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8435, pp. 843505-1-843505-9 (2012)
  5. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge and Jan Vanfleteren Fluorescence-based optochemical sensor on flexible foils PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8439(0Y-1), pp. 84390Y-1-84390Y-9 (2012)
  6. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge and Jan Vanfleteren Foil-based optical technology platform for optochemical sensors PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8264(0R-1), pp. 82640R-1-82640R-9 (2012)
  7. Tom Sterken, Filip Vermeiren, Piers Tremlett, Wim Christiaens and Jan Vanfleteren Embedding thinned chip in flexible PCBs ESTC 2012 : 4th electronics system integration technologies conference, pp. 4 (2012)
  8. Michal Jablonski, Jan Vanfleteren, Thomas Vervust and Frederick Bossuyt Short, stretchable molded interconnect reliability under 10% cyclic elongation 4th Electronics System Integration Technology Conferences, Proceedings, pp. 4 (2012)
  9. Swarnakamal Priyabadini, Tom Sterken, Liang Wang, Kristof Dhaenens, BART VANDECASTEELE, Steven Van Put, Andreas Erik Petersen and Jan Vanfleteren An approach to produce a stack of photo definable polyimide based flat UTCPs 4th Electronics System Integration Technologies Conference 2012, Proceedings, pp. PA6_2-1-PA6_2-4 (2012)
  10. Rik Verplancke, Tom Sterken, Dieter Cuypers and Jan Vanfleteren Thinned dies in a stretchable package ESTC 2012 : 4th electronics system integration technologies conference, pp. 5 (2012)
  11. Tom Sterken, Maaike Op de Beeck, Filip Vermeiren, Tom Torfs, Liang Wang, Swarnakamal Priyabadini, Kristof Dhaenens, Dieter Cuypers and Jan Vanfleteren High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP) IMAPS 2012 : proceedings of the 45th international symposium on microelectronics, pp. 940-945 (2012)
  12. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele and Jan Vanfleteren Ultra thin optical tactile shear sensor PROCEDIA ENGINEERING, Vol. 25, pp. 1393-1396 (2012)
  13. Tom De Nies, Thomas Vervust, Michiel Demey, Rik Van de Walle, Jan Vanfleteren and Marc Leman beatLED : the social gaming partyshirt Sound and music computing conference, proceedings, pp. 526-532 (2011)
  14. Amir Jahanshahi, Fabrice Axisa and Jan Vanfleteren Fabrication of an implantable stretchable electro-osmosis pump Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7929, pp. 8 (2011)
  15. Tom Sterken, Jan Vanfleteren, Tom Torfs, Maaike Op de Beeck, Frederick Bossuyt and Chris Van Hoof Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system 2011 Annual international conference of the IEEE Engineering in Medicine and Biology Society (EMBS), pp. 6886-6889 (2011)
  16. Swarnakamal Priyabadini, An Gielen, Kristof Dhaenens, Wim Christiaens, Steven Van Put, Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren 3D-stacking of UTCPs as a module miniaturization technology 44th International Symposium on Microelectronics, Proceedings, pp. 463-468 (2011)
  17. Maarten Rockelé, Duy-Vu Pham, Jürgen Steiger, Silviu Botnaras, Dennis Weber, Jan Vanfleteren, Tom Sterken, Dieter Cuypers, Soeren Steudel, Kris Myny, Sarah Schols, Bas van der Putten, Jan Genoe and Paul Heremans Low-temperature and low-voltage, solution-processed metal oxide n-TFTs and flexible circuitry on large-area polyimide foil IDW : proceedings of the international display workshops, pp. 1267-1270 (2011)
  18. Tom Sterken, Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Yung-yu Hsu, Tom Torfs and Maaike Opdebeeck A Reliable and comfortable package for wearable medical devices Microelectronic packaging for medical and Hi-Rel devices, Abstracts, pp. (2011)
  19. Thomas Vervust, Frederick Bossuyt, Fabrice Axisa and Jan Vanfleteren Stretchable and washable electronics for embedding in textiles MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, Vol. 1271E, pp. 6 (2010)
  20. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung Yu Hsu, Francois Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf Van der Sluis and Pieter Timmermans Thermo-mechanical analysis of flexible and stretchable systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings, pp. 7 (2010)
  21. Jeroen Missinne, Geert Van Steenberge, Bram Van Hoe, Erwin Bosman, Christof Debaes, J��rgen Van Erps, Chunxiao Yan, Eleonora Ferraris, Peter Van Daele, Jan Vanfleteren, Hugo Thienpont and Dominiek Reynaerts High density optical pressure sensor foil based on arrays of crossing flexible waveguides PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 7716, pp. 12 (2010)
  22. Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren and Ingrid De Wolf Reliability assessment of stretchable interconnects Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts, pp. (2010)
  23. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa and Jan Vanfleteren Improved stretchable electronics technology for large area applications MRS Spring Meeting, Papers, pp. 7 (2010)
  24. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa and Jan Vanfleteren From single conductive layer to double conductive layer stretchable electronics MRS Spring Meeting, Abstracts, pp. (2010)
  25. Thomas Loeher, David Schuetze, Wim Christiaens, Kristof Dhaenens, Swarnakamal Priyabadini, Andreas Ostmann and Jan Vanfleteren Module miniaturization by ultra thin package stacking 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 1-5 (2010)
  26. Rik Verplancke, Frederick Bossuyt, Tom Sterken and Jan Vanfleteren Thin-film interconnection technology for use in a stretchable cell culture platform MRS Spring Meeting, Abstracts, pp. (2010)
  27. Rik Verplancke, Tom Sterken, Fabrice Axisa and Jan Vanfleteren Development of a thin-film stretchable electrical interconnection technology for biocompatible applications 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 4 (2010)
  28. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Peter Van Daele and Jan Vanfleteren Embedded flexible optical shear sensor IEEE Sensors, pp. 987-990 (2010)
  29. Jonathan Govaerts, Jo Robbelein, Chun Gong, Bartek J Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt, Steven Van Put, Ivan Gordon, Kris Baert and Jan Vanfleteren Performance of a new type of module based on back-contact solar cells Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7773, pp. 10 (2010)
  30. W Dulinski, J Baudot, N Chon-Sen, M Deveaux, M Goffe, K Minoglou, P De Moor, C Mntz, Tom Sterken, J Stroth, Jan Vanfleteren and M Winter Flexible monolithic active pixel sensors embedded in ultra thin polymer film IEEE Nuclear Science Symposium and Medical Imaging Conference, Abstracts, pp. (2010)
  31. Tom Sterken, Frederick Bossuyt, Rik Verplancke, Thomas Vervust, Fabrice Axisa and Jan Vanfleteren Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation MRS Spring Meeting, Abstracts, pp. (2010)
  32. Bram Van Hoe, K. Van Coillie, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Nieuwe benadering voor druksensoren: flexibele artifici��le optische huid , pp. 2 (2009)
  33. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Jan Vanfleteren and Peter Van Daele Fully embedded optical and electrical interconnections in flexible foils 2009 European Microelectronics and Packaging Conference (EMPC), pp. 5 (2009)
  34. Dominique Brosteaux, Evi Lippens, Maria Cornelissen, Etienne Schacht, Riccardo Carta, Philippe Jourand, Robert Puers, Fabrice Axisa, Thomas Vervust, Frederick Bossuyt and Jan Vanfleteren In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), pp. 4880-4883 (2009)
  35. Jeroen Missinne, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Multimode PDMS waveguides fabricated using a hot-embossing technique International Conference on Micro and Nano Engineering, 35th, Abstracts, pp. P-MEMS-18-P-MEMS-18 (2009)
  36. Rik Verplancke and Jan Vanfleteren Stretchable Electrical Interconnections: A Promising Technology for Use in Stretchable Microelectrode Arrays Proceedings 2009 Symposium on Microelectrode Arrays in Tissue Engineering, pp. 20-22 (2009)
  37. Beno��t Huyghe, Jan Vanfleteren and Jan Doutreloigne Design of flexible, low-power and wireless sensor nodes for human posture tracking aiding epileptic seizure detection Annual IEEE conference on Sensors, 8th, Proceedings, pp. 1963-1966 (2009)
  38. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa and Jan Vanfleteren A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2, pp. 697-702 (2009)
  39. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren 3D Integration of ultra-thin functional devices inside standard multilayer flex laminates European Microelectronics and Packaging Conference, Abstracts, pp. ? (2009)
  40. Tom Torfs, Wim Christiaens, Jan Vanfleteren, Wim Huwel, Wim Perdu, RF Yazicioglu, Steven Brebels and Chris Van Hoof Flexible wireless biopotential system with embedded ultra-thin chip Smart Systems Integration Conference, 3rd, Abstracts, pp. ? (2009)
  41. Jonathan Govaerts, Wim Christiaens and Jan Vanfleteren Ultra thin chip packaging (UTCP) : a promising technology for future flexible display interconnection 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, pp. 202-205 (2009)
  42. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren 3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems International Semiconductor Technology Conference and China Semiconductor Technology International Conference, Abstracts, pp. ? (2009)
  43. Jeroen Missinne, Geert Van Steenberge, Bram Van Hoe, Kristof Van Coillie, Tim Van Gijseghem, Peter Dubruel, Jan Vanfleteren and Peter Van Daele An array waveguide sensor for artificial optical skins Proceedings of SPIE Photonics West - Photonics Packaging, Integration, and Interconnects IX, Vol. 7221, pp. 722105-1-722105-9 (2009)
  44. Fabrice Axisa, P Jourand, Evi Lippens, Monika Rymarczyk-Machal, N De Smet, Etienne Schacht, Jan Vanfleteren, R Puers and Maria Cornelissen Design and fabrication of a low cost implantable bladder pressure monitor EMBC: 2009 annual international conference of the IEEE Engineering in Medicine and Biology Society, vols 1 and 2, pp. 4864-4867 (2009)
  45. Benoit Huyghe, Jan Doutreloigne and Jan Vanfleteren 3D orientation tracking based on unscented Kalman filtering of accelerometer and magnetometer data Proceedings of the Sensors Applications Symposium, 2009. SAS 2009. IEEE, pp. 148-152 (2009)
  46. Fabrice Axisa, Frederick Bossuyt, Jeroen Missinne, Rik Verplancke, Thomas Vervust and Jan Vanfleteren Stretchable engineering technologies for the development of advanced stretchable polymeric system Proceedings of the 7th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. (2008)
  47. Erwin Bosman, Geert Van Steenberge, Nina Hendrickx, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Flexible embedded active optical link PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6992, pp. 69920V-1-69920V-10 (2008)
  48. M. Gonzalez, Fabrice Axisa, Frederick Bossuyt, Y. Hsu, B. Vandevelde and Jan Vanfleteren Design and performance of metal conductors for stretchable electronic circuits ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 371-376 (2008)
  49. R Carta, B Jourand, J Hermans, F Thone, Dominique Brosteaux, Fabrice Axisa, Jan Vanfleteren and B Puers Design and implementation of advanced systems on flexible-stretchable technology towards embedding textile International Conference EUROSENSORS, 22nd, Proceedings, pp. ?-? (2008)
  50. Geert Van Steenberge, J. Missine, B. Van Hoe, K. Van Coillie, Jan Vanfleteren and Peter Van Daele Array waveguide sensor Proceedings NEMO Scientific General Networking Meeting, pp. (2008)
  51. Erwin Bosman, Geert Van Steenberge, Wim Christiaens, Nina Hendrickx, Jan Vanfleteren and Peter Van Daele Active optical links embedded in flexible substrates ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, pp. 1150-1157 (2008)
  52. Jan Vanfleteren, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Beno��t Huyghe, Jeroen Missinne, Rik Verplancke and Mario Gonzalez Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology Symposium M, Proceedings (abstracts) MRS Spring Symposium, pp. ?-? (2008)
  53. C Van Hoff, H Neves, A Aarts, F Iker, P Soussan, M Gonzalez, E Beyne, Jan Vanfleteren, R Puers and P De Moor Design and Integration Technology for Miniature Medical Microsystems International Electron Devices Meeting, pp. 319-322 (2008)
  54. Michiel Demey, Marc Leman, Frederick Bossuyt and Jan Vanfleteren The Musical Synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo Proceedings NIME 2008, pp. 372-373 (2008)
  55. Michiel Demey, Marc Leman, Bart Kuyken, Wouter Verstichel, Frederick Bossuyt and Jan Vanfleteren The HOP Sensor: Wirelss Motion Sensor Proceedings of the 8th International Conference of New Interfaces for Musical Expression (NIME), pp. 229-232 (2008)
  56. Nathalie De Geyter, Rino Morent, Fabrice Axisa, Eva De Leersnyder, Christophe Leys, Jan Vanfleteren, nele de smet, Monika Rymarczyk-Machal and Etienne Schacht Medium and atmospheric pressure plasma treatment for improvement of PDMS used for flexible and stretchable electronics Proceedings of the 7th IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics, pp. 3 (2008)
  57. Fabrice Axisa, Frederick Bossuyt, Thomas Vervust and Jan Vanfleteren Laser based fast prototyping methodology of producing stretchable and conformable electronic systems ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 1387-1390 (2008)
  58. Jonathan Govaerts and Jan Vanfleteren Assembly of Ultra-Thin Chip Packages (UTCPs) for Enhanced Flexibility of Flexible Displays Proceedings of the 2nd Electronics Systemintegration Technology, Vol. 1, pp. 309-314 (2008)
  59. Jonathan Govaerts, Wim Christiaens, Erwin Bosman and Jan Vanfleteren Multiple Chip Integration for Flat Flexible Electronics Proceedings of the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. 1-5 (digitaal) (2008)
  60. Wim Christiaens, Tom Torfs, Wim Huwel and Jan Vanfleteren Functionality and Reliability Testing of Bendable Ultrathin Chip Packages Proceedings of IMAPS Nordic, pp. 230 (2008)
  61. Wim Christiaens, Erwin Bosman, Wim Huwel, Wim Perdu and Jan Vanfleteren Flexible polyimide based ultra-thin chip package (UTCP) International workshop on Flexible and Stretchable Electronics, 1st, Abstracts, pp. ? (2007)
  62. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, N. De Smet, E. Schacht, M. Rymarczyk-Machal and J. Vanfleteren Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 6592-6595 (2007)
  63. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, J. Vanfleteren, B. Hermans and R. Puers Biomedical stretchable systems using MID based stretchable electronics technology Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 5687-5690 (2007)
  64. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke and J. Vanfleteren Low cost elastic and conformable electronic circuits and assembies using MID in stretchable polymer Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 691-696 (2007)
  65. B. Vandevelde, L. Chen, S. Brebels, W. Christiaens and J. Vanfleteren Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 25-30 (2007)
  66. W. Christiaens, H. Burkard, J. Link and J. Vanfleteren Integration of thin flexible RF structures into flexible PCB Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 621-626 (2007)
  67. M. Gonzalez, F. Axisa, M. Vanden Bulcke, D. Brosteaux, B. Vandevelde and J. Vanfleteren Design of metal interconnects for stretchable electronic circuits using finite element analysis Proceedings of IEEE EuroSimE, pp. 110-115 (2007)
  68. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann and J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  69. W. Christiaens, T. Loeher, M. Feil, B. Vandevelde and J. Vanfleteren Embedding of active components in multilayer flex boards Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  70. J. Vanfleteren, H. De Smet, J. De Baets and A. Van Calster Advanced substrates and packages for wearable electronics and sensors Proceedings of Opening Symposium Microsystem Technology Lab High School Zeeland, pp. (2007)
  71. B. Vandecasteele, J. Govaerts and J. Vanfleteren Embedding of thinned chips in plastic substrates Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 30-35 (2007)
  72. W. Christiaens, B. Vandevelde, S. Brebels and J. Vanfleteren Polyimide based embedding technology for RF structures and active components Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 22-29 (2007)
  73. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke and J. Vanfleteren Elastic and conformable electronic circuits and assembies using MID in polymer Proceedings of the 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 280-286 (2007)
  74. Erwin Bosman, Wim Christiaens, Peter Geerinck, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical interconnections embedded in flexible substrates Proceedings of the 7th UGent PhD symposium, pp. 69- (2006)
  75. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates - art. no. 618506 MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, pp. 18506-18506 (2006)
  76. Wim Christiaens, Bart Vandevelde, Erwin Bosman and Jan Vanfleteren UTCP : 60 ��m thick bendable package International Wafer-Level Packaging Conference, 3rd, Proceedings, pp. 114-119 (2006)
  77. Wim Christiaens, Bart Vandevelde and Jan Vanfleteren (Flat) Ultra-thin chip package Meeting of the Symposium on Polymers for Microelectronics, 12th, Abstracts, pp. ? (2006)
  78. T LOHER, D MANESSIS, R HEINRICH, B SCHMIED, Jan Vanfleteren, Johan De Baets, A OSTMANN and H REICHL Stretchable electronic systems EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, pp. 271-276 (2006)
  79. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Wim Christiaens, Jan Vanfleteren and Peter Van Daele Optical Interconnections embedded in flexible substrates Proceedings Symposium IEEE/LEOS Benelux Chapter, pp. 229-232 (2006)
  80. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren and Peter Van Daele Optical connections on flexible substrates Proceedings of SPIE Photonics Europe Conference, Vol. 6185, pp. 618506/1-618506/8 (2006)
  81. Dominique Brosteaux, Fabrice Axisa, Jan Vanfleteren, Nadine Carchon and M Gonzalez Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology MRS Spring meeting, pp. (2006)
  82. Wim Christiaens, Michael Feil, Thomas Loeher and Jan Vanfleteren Embedded ultra-thin chips in flex Flexible Electronic Systems Forum, Abstracts, pp. ? (2005)
  83. Jonathan Govaerts and Jan Vanfleteren Electrical Interconnection by Means of Conductive Adhesives and Inks Proceedings of the 6th UGent-FirW Doctoraatssymposium, pp. 58 (2005)
  84. Jan Vanfleteren FP5-CSG-IMECAT: Introduction and Highlights of an EC funded Project on Lead-Free Materials and Assembly Development Technologies Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 419-422 (2005)
  85. M. Gonzalez, B. Vandevelde, Jan Vanfleteren and D. Manessis Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 440-445 (2005)
  86. Tom Bert, Jan Vanfleteren, Bjorn Vandecasteele, Stefaan Maeyaert, Jan Doutreloigne, Jonathan Govaerts, Herbert De Smet and Andre Van Calster Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates Proceedings of Flexible Displays and Electronics (FDE) 2005, pp. 1-14 (2005)
  87. Bjorn Vandecasteele, Jan Vanfleteren, D. Manessis, A. Ostmann, H-W. Hagedorn and J. Wiese Lead-free flip chip: a comparison between lead-free solder and adhesives Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 434-439 (2005)
  88. Jarmo Maattanen, Bjorn Vandecasteele, Jan Vanfleteren and Yannick de Maquille Tiheiden joustaville alustoille tehtyjen kaantosiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies Proceedings of Elektroniikan Valmistus 2004; Elektroniikan tuotanto-ja pakkaustekniikan konferenssii, pp. 89-93 (2004)
  89. Bjorn Vandecasteele, Jarmo Maattanen, Tomas Podprocky and Jan Vanfleteren Low temperature flip chip attachment for flexible display applications Proceedings of the International Conference on Electronics Packaging, pp. 307-312 (2004)
  90. Herbert De Pauw, Johan De Baets, Jan Vanfleteren and Andr�� Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, pp. 169-176 (2003)
  91. H. De Pauw, J. De Baets, J. Vanfleteren and A. Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, pp. 35192 (2003)
  92. B. Vandecasteele, T. Podprocky, J. Vanfleteren and J. Maattanen Low temperature flip chip with adhesives on PES Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 319-324 (2003)
  93. B. Vandecasteele, J. Vanfleteren, J. Maattanen, T. Laitinen and Y. de Maquille Results of a high density flip chip on flex reliability test program Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 1-6 (2003)
  94. J. Vanfleteren, B. Vandecasteele and T. Podprocky Low temperature flip-chip process using ICA and NCA (Isotropically and Non-Conductive Adhesive) for flexible displays application Proceedings of the 4th Electronics Packaging Technology Conference, pp. 139-143 (2002)
  95. B. P. Braeckman, J. Dambre and J. Vanfleteren Modeling age-dependent decline of metabolic rate in Caenorhabditis elegans Molecular Genetics of Aging Meeting, Cold Spring Harbor, New York, US, pp. (2002)
  96. H. De Pauw, J. De Baets, J. Vanfleteren and A. Van Calster An O/E measurement probe based on an optics-extended MCM-D motherboard technology Proceedings of the 35th International Symposium on Microelectronics (IMAPS), pp. 936-941 (2002)
  97. J. Vanfleteren, B. Vandecasteele and T. Podprocky A new adhesive flip-chip technology for low temperature andhigh density electronic assembly 1st POLYSCENE Workshop, pp. (2002)
  98. J. Vanfleteren, B. Vandecasteele, S. Raevens, J. Maattanen and P. Perttula Reduced temperature flip-chip technologies on flexible display substrates using adhesives Proceedings of the 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 92-95 (2002)
  99. B. Vandecasteele, T. Podprocky and J. Vanfleteren High density flip chip with adhesives on ceramics Proceedings of the European Microelectronics Packaging an Interconnection Symposium (IMAPS), pp. 175-180 (2002)
  100. J. Vanfleteren, B. Vandecasteele and T. Podprocky Low cost adhesive flip-chip assembly technology using a combination of ICA and NCA Presented at GOOD-DIE International Workshop, pp. (2002)
  101. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren and B. Vandecasteele Reliability of different flex materials in high density flip chip on flex applications Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC), pp. 224-229 (2001)
  102. Z. Illyefalvi-Vitez, R. Berenyi, P. Gordon, J. Pinkola, M. Ruszinko and J. Vanfleteren Laser via generation into flexible substrates Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC), pp. 230-235 (2001)
  103. F. Bruyneel, H. De Smet, J. Vanfleteren and A. Van Calster Assembly of reflective PDLC microdisplays 2001 International Symposium Digest of Technical Papers, Vol. 17, pp. 442-445 (2001)
  104. J. Vanfleteren, B. Vandecasteele, T. Podprocky and P. Jacobs Low temperatue flip-chip assembly for biomedical applications Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, pp. 213-216 (2001)
  105. H. De Pauw, J. Vanfleteren, J. De Baets and A. Van Calster Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations Proceedings of the 2001 International Conference and Exhibition on High Density Interconnect and Systems Packaging, pp. 302-307 (2001)
  106. F. Bruyneel, H. De Smet, J. Vanfleteren, A. Van Calster, T. Fujisawa and M. Aizawa Characteristics of PNLC in reflective displays Proceedings of the 20th International Display Research Conference (IDRC), pp. 217-220 (2000)
  107. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam and K. Allaert Mixed assembly on PCB using a novel flip-chip technology Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 65-70 (2000)
  108. S. Stoukatch, S. Zhang, J. Vanfleteren, M. Vereeken, A. Van Calster and B. Vandecasteele Electroless Nickel plating bath composition and replenishment for microvia plating processes Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 447-452 (2000)
  109. J. Vanfleteren, A. Vervaet and A. Van Calster Highlights of the DACTEL project: Development of Adhesive Chip Technologies for Dedicated Electronic Applications Proceedings of the 23rd International Spring Seminar on Electronics Technology, pp. 315-318 (2000)
  110. H. De Pauw, J. Vanfleteren, H. De Smet, S. Zhang and A. Van Calster An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology Proceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 557-562 (2000)
  111. H. De Pauw, J. Vanfleteren, H. De Smet, S. Zhang and A. Van Calster A hybrid thin-film laser driver module for RF frequency with a full-custom C07 analog driver amplifier Proceedings of Imaps `99, pp. 195-200 (1999)
  112. J. Vanfleteren, J. De Baets, A. Van Calster, G. Schols, N. Pergoot, E. Jarvinen and A. Aintila Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies Proceedings of the 12th European Microelectronics & Packaging Conference, pp. 399-404 (1999)
  113. G. Van Doorselaer, N. Carchon, J. Van den Steen, D. Cuypers, J. Vanfleteren, H. De Smet and A. Van Calster A silicon based reflective polymer dispersed LC display for portable low power applications Proceedings of the IS&T/SPIE Conference on Liquid Crystal Materials, Devices, and Appications VII, Vol. 3635, pp. 95-102 (1999)
  114. J. De Vos, S. Stoukatch, H. De Pauw, H. De Smet, I. Popov, J. Vanfleteren and A. Van Calster Active matrix vacuum fluorescent display with CdSe:In TFTS Proceedings of the 194th meeting of the Electrochemical Society (Thin Film Transistor Technologies IV), Vol. 98-22, pp. (1998)
  115. J. De Vos, S. Stoukatch, H. De Pauw, H. De Smet, I. Popov, J. Vanfleteren and A. Van Calster Active Matrix Vacuum Fluorescent Display with CdSe:In TFTs Meeting Abstracts, The 194th meeting of The Electrochemical Society, Inc., Vol. 98-2, pp. 716 (1998)
  116. D. Wojciechowski, J. Vanfleteren, E. Reese and H-W. Hagedorn New adhesives for high density flip-chip interconnection Proceedings of the International Symposium on Microelectronics, pp. 224-229 (1998)
  117. H. De Pauw, H. De Smet, J. Vanfleteren, J. Lernout and A. Van Calster Multilayer motherboard technology in MCM-Si with opto-electronic features Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 347-352 (1998)
  118. G. Van Doorselaer, B. Dobbelaere, M. Vrana, X. Xie, N. Carchon, J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers and A. Van Calster A paper-white chip-based display MCM package for portable IT products Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 543-547 (1998)
  119. G. Van Doorselaer, N. Carchon, J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers and A. Van Calster Characterisation of a paper-white reflective PDLC microdisplay for portable IT applications Proceedings of the 18th international display research conference (Asia Display `98), pp. 55-58 (1998)
  120. G. Van Doorselaer, N. Carchon, J. Van den Steen, D. Cuypers, J. Vanfleteren, H. De Smet and A. Van Calster A Reflective Polymer Dispersed Information Display made on CMOS Proceedings of the International Congress on Imaging Science ICPS`98, Vol. 2, pp. 222-225 (1998)
  121. J. Lernout, J. Vanfleteren, A. Van Calster, L. Vanwassenhove and P. Van Daele Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac `98), pp. 7-9 (1998)
  122. J. Vanfleteren Flip Chip Attachment using Adhesives Proceedings of the IMAPS-Benelux Spring Event 98, pp. (1998)
  123. J. Van den Steen, N. Carchon, G. Van Doorselaer, C. De Backere, J. De Baets, H. De Smet, J. De Vos, J. Lernout, J. Vanfleteren and A. Van Calster Technology and Circuit Aspects of Reflective PNLC Microdisplays Proceedings of the 1997 International Display Research Conference, pp. 195-198 (1997)
  124. J. Lernout, J. Vanfleteren, A. Van Calster and G. Schols A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics Proceedings of the 11th European Microelectronics Conference, pp. 637-640 (1997)
  125. E. Reese and J. Vanfleteren Fine Pitch Interconnection using Anisotropic Conducting Adhesives Proceedings of the 11th European Microelectronics Conference, pp. 457-464 (1997)
  126. J. Lernout, J. Vanfleteren, A. Van Calster and G. Schols A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics Abstract Book of IMAPS/NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics, pp. (1997)
  127. A. Dravet, P. Kertesz, S. Sechez, A. Van Calster, J. Vanfleteren, M. De Caluwe, K. Deckelmann, J. Wiese and G. Schols A Low-Cost TAB Interconnection technology for LCD Drivers Digest of Technical papers, Vol. 27, pp. 925-928 (1996)
  128. J. Vanfleteren, A. Van Calster, K. Sabbe, M. De Caluwe, A. Dravet, P. Kertesz, S. Secher, K. Deckelmann, J. Wiese, E. Cortes, M. Lopez, G. Schols, K. Allaert, P. Vetter and M. Forrest Development of an adhesive TAB joining technology Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, pp. 24-26 (1996)
  129. A. Dravet, S. Sechez, A. Van Calster, J. De Baets, J. Vanfleteren, K. Allaert, P. Vetter, M. Forrest, G. Schols, K. Deckelmann, J. Wiese and E. Cortes A new cost-effective TAB technology for small and medium volumes Proceedings of the 10th European Microelectronics Conference, pp. 547-558 (1995)
  130. J. Vanfleteren, J. De Baets, A. Van Calster, A. Dravet, K. Deckelman, J. Wiese, W. Schmitt, K. Allaert, P. Vetter, G. Schols and E. Cortes Anisotropic Conductive Adhesives for high density interconnections in Liquid Crystal Displays Proceedings of the Conference on Adhesives in Electronics, pp. (1994)
  131. A. Van Calster, J. De Baets, J. Vanfleteren, A. Dravet, K. Allaert, E. Cortes, K. Deckelman and G. Schols Anisotropic Conductive Adhesives for High Density Interconnections Proceedings of the 1st Eur. Conference on Electron. Packaging Techn., pp. 66-68 (1994)
  132. J. De Baets, A. Van Calster, A.M. De Cubber, H. De Smet and J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Extended abstracts of the Fall meeting of the Electrochemical Society, Vol. 94-2, pp. 693-694 (1994)
  133. A. Van Calster, A. De Cubber, J. De Baets, H. De Smet and J. Vanfleteren A simplified 3-step fabrication scheme for high mobility AMLCD panels Proceedings of the 14th International Display Research Conference, pp. 289-290 (1994)
  134. J. De Baets, A. Van Calster, A. De Cubber, H. De Smet and J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Proceedings of the Electrochemical Society, Vol. 94-35, pp. 228 - 232 (1994)
  135. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Conference book of abstracts, Eurosensors V, pp. 257 (1993)
  136. J. De Baets, J. Capon, A.M. De Cubber, H. De Smet, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa, M. Aizawa and H. Takatsu Hysteresis Phenomena in Active Matrix Adressed Polymer Network Liquid Crystal Displays Proceedings of the 13th Int. Display Research Conference, pp. 117-120 (1993)
  137. H. De Smet, J. Capon, J. De Baets, A.M. De Cubber, A. Van Calster and J. Vanfleteren Generalised TFT-Model for 4-Quadrant Simulations Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  138. A. Van Calster, J. De Baets, A.M. De Cubber, J. Capon, H. De Smet and J. Vanfleteren On the Physical Properties of a New HVTFT Design Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  139. A. Van Calster, J. De Baets, A.M. De Cubber, H. De Smet, J. Capon, J. Vanfleteren, J. Farell and M. Westcott Thin Film Technologies for High Density Active Matrix Adressed Displays Proceedings of the 9th European Hybrid Microelectronics Conference, pp. 84-90 (1993)
  140. Vanden Berghe R, S. Demolder, M. Saille, K. Allaert, A. De Bruycker, A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Failure Mechanisms in Dielectrics Proceedings of the 8th European Hybrid Microelectronics Conference, pp. 157-164 (1993)
  141. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa and H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 296-306 (1992)
  142. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster and J. Vanfleteren Active Matrix with Integrated Drivers on Soda-Lime Glass using Poly-CdSe and Poly-Ge Proceedings of Japan Display `92, pp. 225-228 (1992)
  143. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Silicon Oxynitride Layers for Device Passivation Symp. of The Electrochemical Society, in Thin Film Transistor Technologies, Vol. 92-2, pp. 454-455 (1992)
  144. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren A Lensless Contact-Type Image Sensor Based on a CdSe Photoconductive Array Proceedings of Eurosensors IV Conference, pp. 287-288 (1992)
  145. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Displays Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  146. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, G. Nachtergaele and S. Demolder Silicon Oxynitride Layers for Device Passivation Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 192-199 (1992)
  147. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Vanfleteren, T. Fujisawa, H. Ogawa and H. Takatsu Active matrix design for polymer network liquid crystal projection displays Book of abstracts of the Thin Film Transistor Technologies Symposium, pp. 471-472 (1992)
  148. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Silicon oxynitride layers for device passivation Book of abstracts vo the Thin Film Transistor Technologies Symposium, Vol. 92-2, pp. 454-455 (1992)
  149. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa and H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Symp. of The Electrochemical Society, Thin Film Transistor Technologies, pp. 471-472 (1992)
  150. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and J. Vanfleteren A lensless contact-type image sensor based on de CdSe photoconductive array Eurosensors VI Conference book of abstracts, pp. 287-288 (1992)
  151. J. Farell, M. Westcott, A. Van Calster, J. De Baets, I. De Rycke, J. Capon, H. De Smet, J. Doutreloigne and J. Vanfleteren Thin Film Cadmium Selenide Technology in Large Area Active Matrix High Resolution Displays Proceedings of the ESSDERC `92, pp. 187-190 (1992)
  152. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster and J. Vanfleteren Unification of Poly-CdSe Active Matrix and Poly-CdSe/poly-Ge Integrated Driver Technology Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  153. A. Van Calster, J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren On the Ohmic Contact Formation in Poly-CdSe Thin Films Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  154. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen and R. Graeffe CdSe TFT active matrix addressed electroluminescent displays Proceedings of the 3rd Winter Workshop AMLCDs, pp. (1992)
  155. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa and H. Takatsu A Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Display Proceedings of the International Display Research Conference, pp. 215 - 218 (1991)
  156. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Thin film transistors for the addressing of liquid crystal displays Summer European Liquid Crystal Conference, pp. (1991)
  157. J. Doutreloigne, H. De Smet, J. De Baets, I. De Rycke, A. Van Calster and J. Vanfleteren Complementary CdSe:In/Ge:Cu TFT Circuits for Integrated Display Drivers Proceedings of the SID International Display Conference, pp. 316 - 319 (1990)
  158. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster and J. Vanfleteren Designing Complementary Integrated Driver Circuits Proceedings of the 1st. Int. CdSe Workshop, pp. 92-102 (1990)
  159. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen and R. Graeffe Evaluation of a 64x64 CdSe TFT Adressed ACTFEL Display Demonstrator Proceedings of the 1991 Int. Display Research Conference, pp. 134-136 (1990)
  160. I. De Rycke, J. De Baets, J. Doutreloigne, A. Van Calster and J. Vanfleteren The realisation and evaluation of poly-CdSe TFT driving circuits International Display Research Conference, pp. 70-73 (1990)
  161. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne and A. Van Calster CdSe TFT Technology at the RU-Gent Laboratory of Electronics Proceedings of the 1th International CdSe Workshop, pp. 16 - 26 (1990)
  162. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne and J. Vanfleteren Influence of the Processing Parameters of CdSe on TFT Characteristics Proceedings of the 1st. Int. CdSe Workshop, pp. 53-68 (1990)
  163. J. Vanfleteren, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster and P. De Visschere Design of a Prototype Active Matrix CdSe TFT Adressed EL Display Eurodisplay `90, pp. 216-219 (1990)
  164. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster and J. Vanfleteren A complementary Ge-CdSe TFT technology for flat panel displays TATF book of abstracts, pp. (1989)
  165. A Van Calster, J. De Baets, I. De Rycke, J. Doutreloigne, H. De Smet and J. Vanfleteren On the poly-CdSe thin film transistor technology Proceedings of Japan Display, pp. 408-411 (1989)
  166. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster and J. Vanfleteren A Correlation between 1/f Noise and Short-term Drift in Poly CdSe: In Thin Film Transistors Proceedings of the 10th International Conference on Noise in Physical Systems, pp. 511 - 514 (1989)
  167. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster and J. Vanfleteren A correlation between 1/f-noise and short-term drift in poly CdSe:In thin film transistors Book of abstracts of the 10th International Conference on Noise in Physical Systems, pp. 313-315 (1989)
  168. J. Vanfleteren, P. De Visschere, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster and M. Maenpoa Active Matrix CdSe TFT Addressed Electroluminescent Displays Proceedings of the 1988 International Display research Conference, pp. 74-79 (1988)
  169. J. Vanfleteren, P. Vandenberghe, A. Van Calster, J. De Baets, I. De Rycke, F. Cuypers and P. Jones A Self-Aligned Poly-CdSe Thin Film Transistor Technology for Active Matrix Adressing With Grey Scales Proceedings of the 7th International Display Research Conference, pp. 165 - 168 (1987)
  170. I. De Rycke, A. Van Calster, J. Vanfleteren and A. De Clercq The Design and Simulation of Poly-CdSe TFT Driving Circuits for High Resolution LC Displays Conference Record 1986 International Display Research Conference, pp. 304-307 (1986)
  171. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets and J. Vanfleteren Polycrystalline CdSe Films for Thin Film Transistors The Third International Conference on II-VI Compounds, pp. 397 (1986)
  172. J. Vanfleteren, A. Van Calster and H.J. Pauwels Shift Registers with Polycristalline CdSe Thin Film Transistors for the Addressing of LC Displays Conference Record of the 1985 International Display Research Conference, pp. 72-75 (1985)

Other publications

  1. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman and Johan De Baets System-in-foil technology Ultra-thin chip technology and applications, pp. 141-157 (2011)
  2. J. Van Campenhout, A. Van Calster, M. Brunfaut, J. Depreitere, H. Neefs, J. Vanfleteren, H. Van Marck, D. Stroobandt and C. Das Massaal parallelle informatieverwerking op basis van hybried geintegreerde Si VLSI en III-V opto-elektronische componenten Jaarverslag 1994 ( Deel II ) Samenwerkingsproject IMEC - RUG, pp. 1-16 (1994)
  3. J. Van Campenhout, A. Van Calster, M. Brunfaut, J. Depreitere, H. Neefs, J. Vanfleteren, H. Van Marck and C. Das Massaal parallelle informatieverwerking op basis van hybried geintegreerde Si VLSI en III-V opto-elektronische componenten Jaarverslag 1993 ( Deel II ) Samenwerkingsproject IMEC - RUG, pp. 1-13 (1993)
  4. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen and R. Graeffe CdSe TFT Active Matrix Adressed Electroluminescent Displays Proceedings of the 3rd Winter Worshop AMLCDs, pp. (1992)
  5. A. Van Calster, J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet and J. Doutreloigne CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays Voorgesteld op de `Summer European Liquid Crystal Conference`, pp. (1990)
  6. A. Van Calster and J. Vanfleteren De CdSe Dunne Film Transistor Technologie voor Vlakke Beeldschermen, Werk Ingediend bij het N.F.W.O. met het oog op het behalen van de Tweejaarlijkse Prijs BARCO-INDUSTRIES N.V., pp. (1988)
  7. A. Van Calster and J. Vanfleteren The CdSe Thin Film Transistor Technology for Flat Panels Displays, Work Submitted at the National Fund for Scientific Research to obtain the Bi-annual Prize BARCO-INDUSTRIES N.V., pp. (1988)
  8. LEM-BARCO., J. Vanfleteren, H. Pauwels, A. De Clercq, P. Vetter, L. Kindt, F. Cuypers, J. Vanfleteren, H.J. Pauwels, A. De Clercq, P. Vetter, L. Kindt and F. Cuypers Programma voor Onderzoek op Alternatieve Display Technieken : Vloeibare Kristal Beeldschermen met Hoge Informatie Inhoud, IWONL Projekt VL 1/4 -3469/072, Onderzoeksverslag 2de Jaar., pp. (1987)
  9. Jan Vanfleteren Digitale Schakelingen met Poly-CdSe Dunne Film Transistoren. Doctoraatsproefschrift Faculteit Toegepaste Wetenschappen, Universiteit Gent, pp. (1987)
  10. A. De Clercq, P. Vandenberghe, F. Cuypers, J. Vanfleteren and L. Kindt Vloeibare Kristal Beeldschermen met Hoge Informatie Inhoud Programma voor Onderzoek op Alternatieve Display Technieken, IWONL Project VL 1/4-3469/072, Onderzoeksverslag 1e jaar, Oktober 1986., pp. (1986)
  11. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag derde mandaat IWONL, pp. (1985)
  12. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag tweede mandaat IWONL, pp. (1984)
  13. M.C. Vanwormhoudt, H.J. Pauwels, A. Van Calster and J. Vanfleteren Onderzoek en Ontwikkeling van Analoge en Digitale Dunne Film Transistor Circuiten, Verslag FKFO projekt F 6/15, Krediet Nr 2.0029.82, pp. (1983)
  14. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag eerste mandaat IWONL, pp. (1983)
  15. J. Vanfleteren Stroom- en Capaciteitsmetingen op Cu2S-CdS Zonnecellen Afstudeerwerk FTW, RUG, pp. (1981)