INA-OCMC 2012

Full Title: 
6th International Workshop on Interconnection Network Architectures: On-Chip, Multi-Chip
Event Date: 
Sun, 2012-01-22
Part of: 
HiPEAC 2012
Important dates
Paper submission date: 
Wed, 2011-10-05
Notification date: 
Tue, 2011-11-15
Organizers:

General Chairs
- Davide Bertozzi, University of Ferrara, Italy 
- Tor Skeie, Simula Research Labs, Norway 

Program Chairs
- Cyriel Mickenberg, IBM Zurich, Switzerland 
- Giorgos Dimitrakopoulos, Univ. of West Macedonia, Greece 

Publications Chair
- Alessandro Strano, University of Ferrara, Italy 

Publicity Chair
- Gaspar Mora, Intel, USA

Special Session Chair
- Maurizio Palesi, Kore University, Italy 

Steering Committe
- Jose Duato, Techn. University of Valencia, Spain 
- Manolis Katevenis, FORTH-ICS, Greece 

When interconnecting different end-nodes in both on-chip and multi-chip 
processing architectures, the communication infrastructure plays a dominant 
role in determining overall system metrics such as performance, reliability 
and often even area and power.  On the other hand, each application domain 
poses its own design constraints that the interconnect fabric has to cope 
with, thus leading to well differentiated architecture design principles. 
Ultimately, careful engineering of the interconnection network is at the core 
of the successful development of both on-chip and multi-chip processing 
architectures.

Original papers describing new and previously unpublished results are 
solicited on all aspects of interconnection network architectures.
Topics of interest include but are not limited to:

    * Networks-on-Chip (NoC)
    * Multi-Chip Interconn. Networks, including Cluster Interconnects
    * "Commodity Switches" as general-purpose building blocks
    * Switching, buffering, and routing architectures
    * Flow control and congestion management in switching fabrics
    * Virtualization
    * Topology exploration
    * Timing, synchronous/asynchronous communication
    * Reliability, availability, fault tolerance
    * Area/power versus functionality/QoS support in NoC architectures
    * Design space exploration
    * NoC physical link design
    * NoC testing and verification
    * Programming models for NoC-centric systems

Submissions from EU projects in progress as well as seminal work and new ideas 
to stimulate advances in the field are also encouraged. The program committee 
recognizes that such papers may contain fewer experimental results than papers 
in established areas.

Paper submission:

Electronic paper submission requires a full paper, up to 4 double-column 
ACM format pages, including figures and references. Please use the following 
template when preparing your manuscript:
http://www.acm.org/sigs/publications/proceedings-templates
Papers should include title, authors and affiliation. The work will be 
evaluated by the program committee based on scientific merit, innovation, 
relevance, and presentation. The submission procedure will be through the 
EasyChair web-page (https://www.easychair.org/conferences/?conf=inaocmc2012)
Accepted papers will be published in the ACM digital library.

Important dates:

Submission deadline: October 5th, 2011.
Notification of acceptance: November 15th, 2011.
Workshop: January 22rd, 2012

Technical Program Committee: 

- Federico Silla, UPV, Spain
- Sudhakar Yalamanchili, Georgia Tech, USA
- Federico Angiolini, iNOCS, Switzerland
- Maurizio Palesi, Kore University, Italy
- Eitan Zahavi, Mellanox, Israel
- Janusz Kleban, Poznan University of Technology, Polland
- Kees Goosens, TUE, Netherlands
- Marcello Coppola, ST, France
- Pedro Javier Garcia, UCLM, Spain
- Jose Angel Gregorio Monasterio, Univ. of Cantabria, Spain
- Jose Luis Sanchez Garcia, UCLM, Spain
- Partha Kundu, Juniper Networks, USA
- Paco Gilabert, UPV, Spain
- Vassos Soteriou, CUT, Cyprus
- Natalie Enright Jerger, Univ. of Toronto, Canada
- Paul Ampadu, Univ. of Rochester, USA
- Steven Nowick, Columbia University, USA
- David Atienza, EPFL, Switzerland 
- Nikos Chrysos, IBM Research Zurich, Switzerland 
- Soeren Sonntag, Intel Mobile Communications, Germany
- Jaan Raik, Tallin University of Technology, Estonia
- Hiroki Matsutani, Keio University, Japan


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