Begin › .

.

Vr, 2007-01-12 18:57 — mronsse

Publicaties van K Allaert

Publicaties in tijdschriften

  1. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Advancing Microelectronics, Vol. 27(5), pp. 28-30 (2000)
  2. M. Vrana, A. Van Calster, R. Vanden Berghe en K. Allaert Interconnection Technology for Advanced High density Thick Films Microelectronics International(41), pp. 5-8 (1996)
  3. M. Vrana, A. Van Calster, D. Vanicky, W. Delbare, R. Vanden Berghe, S. De Molder en K. Allaert Photoimageable Thick Films for Multichip Modules Microelectronics International(36), pp. 16-18 (1995)
  4. B. De Meulemeester, A. Van Calster, A. De Bruycker en K. Allaert Fabrication of High Density Multi-Chip Modules with Standard IC Production Equipment Hybrid Circuits(30), pp. 27-30 (1993)
  5. K. Allaert, A. Van Calster, H. Loos en A. Lequesne A Comparision Between Silicon Nitride Films Made by PCVD of N2-SiH4/Ar and N2-SiH4/He Journal of the Electrochemical Society, Vol. 132(7), pp. 1763-1766 (1984)

Conferentiepublicaties

  1. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 65-70 (2000)
  2. S. Zhang, J. De Baets, A. Van Calster, D. Corlatan, P. De Langhe en K. Allaert Photovia technology: Some important aspects for reliability Proceedings of Imaps `99, pp. 240-245 (1999)
  3. S. Zhang, M. Vereeken, J. De Baets, A. Van Calster, J. Peeters en K. Allaert The realisation of photo-via technology using multiposit as a photo imageable dielectric Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac `98), pp. 62-65 (1998)
  4. S. Zhang, M. Vereecken, J. De Baets, A. Van Calster, A. Vervaet, J. Peeters en K. Allaert Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly Printed Circuit Board Technology, pp. (1997)
  5. J. Vanfleteren, A. Van Calster, K. Sabbe, M. De Caluwe, A. Dravet, P. Kertesz, S. Secher, K. Deckelmann, J. Wiese, E. Cortes, M. Lopez, G. Schols, K. Allaert, P. Vetter en M. Forrest Development of an adhesive TAB joining technology Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, pp. 24-26 (1996)
  6. M. Vrana, A. Van Calster, R. Vanden Berghe en K. Allaert Interconnection technology for advanced high density thick films Proceedings of the 10th European Microelectronics Conference, pp. 190-198 (1995)
  7. A. Dravet, S. Sechez, A. Van Calster, J. De Baets, J. Vanfleteren, K. Allaert, P. Vetter, M. Forrest, G. Schols, K. Deckelmann, J. Wiese en E. Cortes A new cost-effective TAB technology for small and medium volumes Proceedings of the 10th European Microelectronics Conference, pp. 547-558 (1995)
  8. J. Vanfleteren, J. De Baets, A. Van Calster, A. Dravet, K. Deckelman, J. Wiese, W. Schmitt, K. Allaert, P. Vetter, G. Schols en E. Cortes Anisotropic Conductive Adhesives for high density interconnections in Liquid Crystal Displays Proceedings of the Conference on Adhesives in Electronics, pp. (1994)
  9. A. Van Calster, J. De Baets, J. Vanfleteren, A. Dravet, K. Allaert, E. Cortes, K. Deckelman en G. Schols Anisotropic Conductive Adhesives for High Density Interconnections Proceedings of the 1st Eur. Conference on Electron. Packaging Techn., pp. 66-68 (1994)
  10. G. De Pestel, W. Delbare, K. Allaert, T. Qingsheng, J. Vandewege, J. Verbeke en M. Vrana Multifibre electro-optical modules compatible with the fibre in board technology LEOS`94 Conference, pp. 2 pp. (1994)
  11. G. De Pestel, W. Delbare, K. Allaert, A. Ambrosy, T. Qingsheng, J. Vandewege, J. Verbeke en M. Vrana Multifibre electro-optical modules compatible with the fibre in board technology Proceedings of the LEOS Conference, pp. (1994)
  12. M. Vrana, A. Van Calster, D. Vanicky, W. Delbare, R. Vanden Berghe, S. Demolder en K. Allaert Photo-imageable thick films for multichip modules International Conference on electronic Technologies, pp. 41-45 (1994)
  13. Vanden Berghe R, S. Demolder, M. Saille, K. Allaert, A. De Bruycker, A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Failure Mechanisms in Dielectrics Proceedings of the 8th European Hybrid Microelectronics Conference, pp. 157-164 (1993)
  14. K. Allaert, A. Van Calster en A. Vervaet P.C.V.D. SIN Conformal Coatings for the Improvement of the Reliability of Wire Bonded Chips International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp. (1986)
  15. K. Allaert, A. Van Calster en A. Vervaet Evaluation of PCVD silicon nitride as total passivation layer for chips Proceedings of the 5th VLSI Packaging Workshop, pp. 26 (1986)
  16. K. Allaert, A. Van Calster en A. Vervaet Evaluation of PCVD Silicon Nitride as a Total Passivation Layer for Chips 5th VLSI Packaging Workshop, pp. 26 (1986)
  17. K. Allaert en A. Van Calster Evaluation of P.C.V.D. Silicon Nitride as a Thin Film Isolator, as a Cross Over Dielectric Film and as a Passivation Layer Proceedings 3th Int. Conference on Plasma Etching and Plasma Deposition, pp. 239-243 (1985)
  18. K. Allaert en A. Van Calster The Influence of the Deposition and Annealing Temperature on Plasma Enhanced Chemical Vapour Deposition of Si3N4 The 6th International Conference on Thin Films, pp. (1984)
  19. H.E. Maes, G. Heyns, J. Remmeric, M. Hinoul, H. Loos, A. Van Calster, A. Lequesne en K. Allaert Comparative Study of plasma nitrides for IC passivation Proceedings 1983, Meeting Electrochemical Society, pp. 177 (1983)

Andere publicaties

  1. Koen Allaert Karakterisatie van P.E.C.V.D. Siliciumnitride en Toepassing als totale Passivatielaag voor Chips. Doctoraatsproefschrift Faculteit Toegepaste Wetenschappen, Universiteit Gent, pp. (1987)
  2. K. Allaert en J. Mercier Ontwerp van een N-Mos OpAmp in Dunne Film (2 exemplaren) Afstudeerwerk FTW, RUG, pp. (1981)
  3. K. Allaert en J. Mercier Ontwerp van een N-MOS opamp in dunne film Verhandeling ingediend voor de prijs van de KBVE 1981, pp. (1981)