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Vr, 2007-01-12 18:57 — mronsse

Publicaties van F Bossuyt

Publicaties in tijdschriften

  1. Amir Jahanshahi, Mario Gonzalez, Jeroen van den Brand, Frederick Bossuyt, Thomas Vervust, Rik Verplancke en Jan Vanfleteren Stretchable circuits with horseshoe shaped conductors JAPANESE JOURNAL OF APPLIED PHYSICS, Vol. 52, pp. 7 (2013)
  2. Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, Yung-Yu Hsu, Thomas Vervust, Ingrid De Wolf en Michal Jablonski Printed circuit board technology inspired stretchable circuits MRS BULLETIN, Vol. 37(3), pp. 254-260 (2012)
  3. Pietro Salvo, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu en Jan Vanfleteren Adhesive bonding by SU-8 transfer for assembling microfluidic devices MICROFLUIDICS AND NANOFLUIDICS, Vol. 13(6), pp. 987-991 (2012)
  4. Rik Verplancke, Frederick Bossuyt, Dieter Cuypers en Jan Vanfleteren Thin-film stretchable electronics technology based on meandering interconnections : fabrication and mechanical performance JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 22(1), pp. 9 (2012)
  5. Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf en Michal Jablonski SCB and SMI : two stretchable circuit technologies, based on standard printed circuit board processes CIRCUIT WORLD, Vol. 38(4), pp. 232-242 (2012)
  6. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis en PHM Timmermans Design and implementation of flexible and stretchable systems MICROELECTRONICS RELIABILITY, Vol. 51(6), pp. 1069-1076 (2011)
  7. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Polyimide-enhanced stretchable interconnects : design, fabrication, and characterization IEEE TRANSACTIONS ON ELECTRON DEVICES, Vol. 58(8), pp. 2680-2688 (2011)
  8. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects THIN SOLID FILMS, Vol. 519(7), pp. 2225-2234 (2011)
  9. Frederick Bossuyt, Jürgen Günther, Thomas Löher, Manuel Seckel, Tom Sterken en Hans de Vries Cyclic endurance reliability of stretchable electronic substrates MICROELECTRONICS RELIABILITY, pp. (2010)
  10. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 20(7), pp. 11 (2010)
  11. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde en Ingrid De Wolf Design and analysis of a novel fine pitch and highly stretchable interconnect MICROELECTRONICS INTERNATIONAL, Vol. 27(1), pp. 33-38 (2010)
  12. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect JOURNAL OF MATERIALS RESEARCH, Vol. 24(12), pp. 3573-3582 (2009)
  13. K DEWITTE, J VERVISCH, Patrick Puissant, Lieva Van Langenhove en Frederick Bossuyt De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine. UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE, Vol. (3, pp. 27-29 (2002)
  14. Lieva Van Langenhove, J VERVISCH, K DEWITTE en Frederick Bossuyt De luchtindex als richtwaarde voor de verweefbaarheid van garens op de luchtstraalweefmachine. UNITEX. TWEEMAANDELIJKS TIJDSCHRIFT VOOR DE TEXTIELINDUSTRIE, pp. 15-19 (2001)

Conferentiepublicaties

  1. Michal Jablonski, Jan Vanfleteren, Thomas Vervust en Frederick Bossuyt Short, stretchable molded interconnect reliability under 10% cyclic elongation 4th Electronics System Integration Technology Conferences, Proceedings, pp. 4 (2012)
  2. Tom Sterken, Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Yung-yu Hsu, Tom Torfs en Maaike Opdebeeck A Reliable and comfortable package for wearable medical devices Microelectronic packaging for medical and Hi-Rel devices, Abstracts, pp. (2011)
  3. Tom Sterken, Jan Vanfleteren, Tom Torfs, Maaike Op de Beeck, Frederick Bossuyt en Chris Van Hoof Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system 2011 Annual international conference of the IEEE Engineering in Medicine and Biology Society (EMBS), pp. 6886-6889 (2011)
  4. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren Improved stretchable electronics technology for large area applications MRS Spring Meeting, Papers, pp. 7 (2010)
  5. Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Reliability assessment of stretchable interconnects Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts, pp. (2010)
  6. Rik Verplancke, Frederick Bossuyt, Tom Sterken en Jan Vanfleteren Thin-film interconnection technology for use in a stretchable cell culture platform MRS Spring Meeting, Abstracts, pp. (2010)
  7. Jonathan Govaerts, Jo Robbelein, Chun Gong, Bartek J Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt, Steven Van Put, Ivan Gordon, Kris Baert en Jan Vanfleteren Performance of a new type of module based on back-contact solar cells Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7773, pp. 10 (2010)
  8. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren From single conductive layer to double conductive layer stretchable electronics MRS Spring Meeting, Abstracts, pp. (2010)
  9. Tom Sterken, Frederick Bossuyt, Rik Verplancke, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation MRS Spring Meeting, Abstracts, pp. (2010)
  10. Thomas Vervust, Frederick Bossuyt, Fabrice Axisa en Jan Vanfleteren Stretchable and washable electronics for embedding in textiles MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, Vol. 1271E, pp. 6 (2010)
  11. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung Yu Hsu, Francois Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf Van der Sluis en Pieter Timmermans Thermo-mechanical analysis of flexible and stretchable systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings, pp. 7 (2010)
  12. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2, pp. 697-702 (2009)
  13. Dominique Brosteaux, Evi Lippens, Maria Cornelissen, Etienne Schacht, Riccardo Carta, Philippe Jourand, Robert Puers, Fabrice Axisa, Thomas Vervust, Frederick Bossuyt en Jan Vanfleteren In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), pp. 4880-4883 (2009)
  14. M. Gonzalez, Fabrice Axisa, Frederick Bossuyt, Y. Hsu, B. Vandevelde en Jan Vanfleteren Design and performance of metal conductors for stretchable electronic circuits ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 371-376 (2008)
  15. Michiel Demey, Marc Leman, Bart Kuyken, Wouter Verstichel, Frederick Bossuyt en Jan Vanfleteren The HOP Sensor: Wirelss Motion Sensor Proceedings of the 8th International Conference of New Interfaces for Musical Expression (NIME), pp. 229-232 (2008)
  16. Michiel Demey, Marc Leman, Frederick Bossuyt en Jan Vanfleteren The Musical Synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo Proceedings NIME 2008, pp. 372-373 (2008)
  17. Fabrice Axisa, Frederick Bossuyt, Jeroen Missinne, Rik Verplancke, Thomas Vervust en Jan Vanfleteren Stretchable engineering technologies for the development of advanced stretchable polymeric system Proceedings of the 7th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. (2008)
  18. Jan Vanfleteren, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Beno��t Huyghe, Jeroen Missinne, Rik Verplancke en Mario Gonzalez Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology Symposium M, Proceedings (abstracts) MRS Spring Symposium, pp. ?-? (2008)
  19. Fabrice Axisa, Frederick Bossuyt, Thomas Vervust en Jan Vanfleteren Laser based fast prototyping methodology of producing stretchable and conformable electronic systems ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 1387-1390 (2008)
  20. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, J. Vanfleteren, B. Hermans en R. Puers Biomedical stretchable systems using MID based stretchable electronics technology Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 5687-5690 (2007)
  21. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, N. De Smet, E. Schacht, M. Rymarczyk-Machal en J. Vanfleteren Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 6592-6595 (2007)
  22. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Low cost elastic and conformable electronic circuits and assembies using MID in stretchable polymer Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 691-696 (2007)
  23. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Elastic and conformable electronic circuits and assembies using MID in polymer Proceedings of the 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 280-286 (2007)

Andere publicaties

  1. Frederick Bossuyt Novel technologies for elastic microsystems : development, characterization and applications pp. (2011)