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Vr, 2007-01-12 18:57 — mronsse

Publicaties van Johan De Baets

Publicaties in tijdschriften

  1. David Schaubroeck, Johan De Baets, Tim Desmet, Peter Dubruel, Etienne Schacht, Luc Van Vaeck en Andr�� Van Calster Surface modification of an epoxy resin with polyamines via cyanuric chloride coupling APPLIED SURFACE SCIENCE, Vol. 256(21), pp. 6269-6278 (2010)
  2. Maarten Cauwe en Johan De Baets Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, Vol. 58(12), pp. 3842-3849 (2010)
  3. David Schaubroeck, Johan De Baets, Tim Desmet, Sandra Van Vlierberghe, Etienne Schacht en Andr�� Van Calster Introduction of amino groups on the surface of thin photo definable epoxy resin layers via chemical modification APPLIED SURFACE SCIENCE, Vol. 255(21), pp. 8780-8787 (2009)
  4. J van den Brand, Johan De Baets, T van Mol en A Dietzel Systems-in-foil : devices, fabrication processes and reliability issues MICROELECTRONICS RELIABILITY, Vol. 48(8-9), pp. 1123-1128 (2008)
  5. Maarten Cauwe en Johan De Baets Broadband Material Parameter Characterization for Practical High-speed Interconnects on Printed Circuit Board IEEE Transactions on Advanced Packaging, Vol. 31(3), pp. 649-656 (2008)
  6. Sam Siau, Alfons Vervaet, Lieven Degrendele, Johan De Baets en Andre Van Calster Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers Applied Surface Science(252), pp. 2717��2740 (2006)
  7. Sam Siau, Johan De Baets, Andre Van Calster, Leon Heremans en Sammy Tanghe Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectronics Reliability, Vol. 45(3-4), pp. 675?687 (2005)
  8. B. Manirambona, J. De Baets en A. Vervaet Eximer laser microvia-technology in multichip modules Applied Surface Science(208-209), pp. 171-176 (2003)
  9. S. Zhang, J. De Baets en A. Van Calster A new approach to flip chip on board technology using SMT compatible processes Microelectronics International, Vol. 16(3), pp. 39-42 (1999)
  10. S. Zhang, J. De Baets, M. Vereeken, A. Vervaet en A. Van Calster Stabilizer Concentration and Local Environment: Their Effects on Electroless Nickel Plating of PCB Micropads Journal of the Electrochemical Society, Vol. 146(8), pp. 2870-2875 (1999)
  11. S. Zhang, J. De Baets en A. Van Calster A two-layer high density printed circuit board and its reliability Microelectronics Reliability, Vol. 39, pp. 1337-1341 (1999)
  12. I. Born, D. Detemmerman, M. Vrana, J. De Baets en A. Van Calster Low cost high-density multilayer circuits for MCM-C Microelectronics International, Vol. 16(2), pp. 55-58 (1999)
  13. H. De Smet, J. De Baets, A.M. De Cubber, J. De Vos, A. Van Calster en J. Vanfleteren New model for the characterization and simulation of TFTs in all operating regions Journal of the Society for Information Display, Vol. 3(3), pp. 119-125 (1995)
  14. J. Capon, J. De Baets, A.M. De Cubber, H. De Smet, A. Van Calster en J. Vanfleteren Analysis of Transient Photoconductivity in CdSe:Cu:Cl Thin Films Physica Status Solidi A-Applied Research, Vol. 142(1), pp. (1994)
  15. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren Geometric Design of Lensless Photoconductive Cotact-type Image Sensors Journal of the Society for Information Display, Vol. 1(2), pp. 233-241 (1993)
  16. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu A Polymer-Network Liquid-Crystal Poly-CdSe-TFT Active-Matrix Display Journal of the Society for Information Display, Vol. 1(2), pp. 189-194 (1993)
  17. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A Lensless Contact-type Image Sensor Based on a CdSe Photoconductive Array Sensors and Actuators A-Physical, Vol. 37-38, pp. 546-551 (1993)
  18. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en J. Vanfleteren Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge Journal of the Society for Information Display, Vol. 1/4(4), pp. 423-428 (1993)
  19. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin Film Transistors for the Adressing of Liquid Crystal Displays Molecular Materials, Vol. 1, pp. 189-301 (1992)
  20. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Sensors and Actuators A-Physical, Vol. 32(1-3), pp. 437-441 (1992)
  21. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren The Electrical Performance of a Complementary CdSe:In/Ge:Cu Thin Film Transistor Technology for Flat Panel Displays Solid-State Electronics, Vol. 34(2), pp. 143-147 (1990)
  22. A. Van Calster, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Transistori a Film Sottile per Indicatori a Schermo Piatto Alta Frequenza Riv. di. Elett., Vol. II(1), pp. 3 - 8 (1990)
  23. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren The Influence of Low Copper-Doping Concentrations on the Recrystallisation Process in and the Electrical Properties of Germanium in Ge:Cu Thin Film Transistors Thin Solid Films(189), pp. 235-245 (1990)
  24. I. De Rycke, A. Van Calster, J. Vanfleteren, J. De Baets, J. Doutreloigne, H. De Smet en P. Vetter 2-MHz Clocked LCD Drivers on Glass IEEE Journal of Solid-State Circuits, Vol. 25(2), pp. 531-538 (1989)
  25. J. De Baets, J. Vanfleteren, I. De Rycke, J. Doutreloigne, A. Van Calster en P. De Visschere High-Voltage Polycrystalline CdSe Thin-Film Transistors IEEE Transactions on Electron Devices, Vol. 37(3), pp. 636-639 (1989)
  26. A. Van Calster, J. Vanfleteren, I. De Rycke en J. De Baets On the Field Effect in Polycristalline Thin-Film Transistors Applied Physics, Vol. 64(6), pp. 3282-3286 (1988)
  27. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets en J. Vanfleteren Polycrystalline CdSe films for thin film transistors Journal of Crystal Growth, Vol. 86, pp. 924-928 (1988)
  28. A. Van Calster, I. De Rycke, A. Vervaet, J. De Baets en J. Vanfleteren A New Technology for Fast Switching Circuits on Glass IEEE Electron Device Letters, Vol. EDL-8(10), pp. 477-479 (1987)

Conferentiepublicaties

  1. Maarten Cauwe, Bjorn Vandecasteele, Johan De Baets, Jeroen van den Brand, Roel Kusters en Ashok Sridhar A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels 4th Electronics System Integration Technologies Conference 2012, Proceedings, pp. 1-6 (2012)
  2. Maarten Cauwe, Bjorn Vandecasteele, An Gielen, Johan De Baets, Jeroen van den Brand en Roel Kusters Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils European Microelectronics and Packaging Conference, 18th, Proceedings, pp. 559-564 (2011)
  3. David Schaubroeck, Emilie Van den Eeckhout, Johan De Baets, Peter Dubruel, Luc Van Vaeck en André Van Calster Surface modification of a photo definable epoxy resin with polydopamine to improve adhesion with electroless deposited copper Polymer surface modification : eigth international symposium : final program, pp. 18-18 (2011)
  4. Dimitris Karnakis, Geert Van Steenberge, An Gielen, Johan De Baets en Jeroen van den Brand Mechanistic aspects of selective laser patterning of multilayered thin-film structures in OLED fabrication Proceedings of LOPE-C 2010, pp. 5 (2010)
  5. David Schaubroeck, Johan De Baets, Etienne Schacht en Andr�� Van Calster Chemical modification of a photo definable epoxy resin to improve adhesion with electroless copper International Symposium on Polymer Surface Modification, 7th, Book of abstracts, pp. 30-30 (2009)
  6. Rajesh Mandamparambil, Henri Fledderus, Jeroen van den Brand, Milan Saalmink, Roel Kusters, Tomas Podprocky, Geert Van Steenberge, Johan De Baets en Andreas Dietzel A comparative study of via drilling and scribing on PEN and PET substrates for flexible electronic applications using excimer and Nd:YAG laser sources 2009 FLEXIBLE ELECTRONICS & DISPLAYS CONFERENCE AND EXHIBIITON, pp. 21-27 (2009)
  7. Andreas Ostmann, Dionysios Manessis, Johannes Stahr, Mark Beesley, Maarten Cauwe en Johan De Baets Industrial and technical aspects of chip embedding technology ESTC 2008 : 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 315-320 (2008)
  8. J. De Baets, G. Willems, A. Ostmann, A. Kriechbaum en H. Kostner Cost modelling for embedded component technology Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibitions, pp. 341-344 (2007)
  9. M. Cauwe en J. De Baets High-frequency modeling and measurements of tracks running on top of active components embedded in printed circuit boards Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 335-340 (2007)
  10. J. Vanfleteren, H. De Smet, J. De Baets en A. Van Calster Advanced substrates and packages for wearable electronics and sensors Proceedings of Opening Symposium Microsystem Technology Lab High School Zeeland, pp. (2007)
  11. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann en J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  12. T LOHER, D MANESSIS, R HEINRICH, B SCHMIED, Jan Vanfleteren, Johan De Baets, A OSTMANN en H REICHL Stretchable electronic systems EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, pp. 271-276 (2006)
  13. Bert De Roo, Alfons Vervaet, Etienne Schacht, An Gielen, Johan De Baets en Andre Van Calster Improvement of copper adhesion by chemical modification of epoxy surfaces 7e FirW Doctoraatssymposium, pp. 1-2 (2006)
  14. Pieter Samyn, Jan Quintelier, Johan De Baets en Alessandro Ledda Image processing techniques for characterisation of polymer wear debris Proc.of International Conference on Condition Monitoring, pp. 423-432 (2005)
  15. Andreas Ostmann, Johan De Baets, Arno Kriechbaum, Hannes Kostner en Alexander Neumann Technology for Embedding Active Dies Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 101-106 (2005)
  16. Ronny Bockstaele, Michiel De Wilde, Wim Meeus, Hendrik Sergeant, Olivier Rits, Jan Van Campenhout, Johan De Baets, Peter Van Daele, Francois Dorgeuille, Sven Eitel, Michaela Klemenc, Richard Annen, Jan Van Koetsem, Jacques Goudeau, Baudoin Bareel, Reto Fries, Peter Straub, Francois Marion, Julien Routin en Roel Baets Chip-to-chip parallel optical interconnects over optical backpanels based on arrays of multimode waveguides Proceedings of the 9th Annual Symposium of the IEEE/LEOS Benelux Chapter - 2004 - ISBN 9076546061, pp. 61-64 (2004)
  17. Herbert De Pauw, Nadine Carchon, Johan De Baets en Andre Van Calster Redistribution on wafer: an alternative, cost-efficient approach Proceedings of the 37th International Symposium on Microelectronics, pp. (2004)
  18. Ronny Bockstaele, Michiel De Wilde, Wim Meeus, Olivier Rits, Hannes Lambrecht, Jan Van Campenhout, Johan De Baets, Peter Van Daele, Eric van den Berg, Michaela Clemenc, Sven Eitel, Richard Annen, Jan Van Koetsem, Gilles Widawski, Jacques Goudeau, Baudouin Bareel, Patrick Le Moine, Reto Fries, Peter Straub en Roel Baets A parallel optical interconnect link with on-chip optical access Proceedings of SPIE: Micro-Optics, VCSELs, and Photonic Interconnects, Vol. 5453, pp. 124-133 (2004)
  19. Herbert De Pauw, Johan De Baets, Jan Vanfleteren en Andr�� Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, pp. 169-176 (2003)
  20. Tomas Podprocky, Bjorn Vandecasteele, Johan De Baets, Andr�� Van Calster en J BANSKY Integration of thick film resitors in a multilayer structure 26TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, CONFERENCE PROCEEDINGS, pp. 137-140 (2003)
  21. H. De Pauw, J. De Baets, J. Vanfleteren en A. Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, pp. 35192 (2003)
  22. T. Podprocky, B. Vandecasteele, J. De Baets en A. Van Calster Thick film inductors for RF applications Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 138-142 (2003)
  23. B. Manirambona, J. De Baets en A. Vervaet Optimization of microvia-technology using an excimer laser for application in microelectronics E-MRS 2003 Spring Meeting, Book of Abstracts, pp. APPL H-IX.4 (2003)
  24. S. Siau, L. Degrendele, J. De Baets en A. Van Calster Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 158-162 (2003)
  25. T. Podprocky, B. Vandecasteele, J. De Baets en A. Van Calster Integration of Thick Film resistors in a multilayer structure Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 137-140 (2003)
  26. H. De Pauw, J. De Baets, J. Vanfleteren en A. Van Calster An O/E measurement probe based on an optics-extended MCM-D motherboard technology Proceedings of the 35th International Symposium on Microelectronics (IMAPS), pp. 936-941 (2002)
  27. B. Manirambona, J. De Baets en A. Vervaet Excimer laser microvia technology in MCMs E-MRS 2002 Spring Meeting : Scientific Programme / Book of Abstracts, pp. D-29 (2002)
  28. J. De Baets, M. Vereeken en A. Van Calster Reliability of a board technology for high-frequency applications Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, pp. 271-275 (2001)
  29. H. De Pauw, J. Vanfleteren, J. De Baets en A. Van Calster Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations Proceedings of the 2001 International Conference and Exhibition on High Density Interconnect and Systems Packaging, pp. 302-307 (2001)
  30. S. Harris, G. Patra, G. Schols, D. Mathelin, D. Corlatan, E. Raedschelder, P. De Langhe, J. De Baets, M. Vereeken, A. Van Calster, M. Morrell, C. Haley en A. Ostman Standard SMT process for flip-chip assembly on FR4 substrate Proceedings of the technical conference (IPC SMEMA Council APEX), pp. IP1-1 1 IP1-1 13 (2001)
  31. J. De Baets, M. Vereeken, A. Van Calster, D. Corlatan, E. Raedschelders, P. De Langhe, G. Patra, M. Morrell, C. Haley, G. Schols, A. Ostmann en D. Mathelin HIPERPRINT: a board technology for high-frequency applications Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 326-332 (2000)
  32. I. Popov, A. Van Calster, J. De Baets en H. De Pauw Implementation of the system of experiment design and taboo search into SiON thin film technology Book of abstracts of the third SIAM conference on mathematical aspects of materials science, pp. 44 (2000)
  33. S. Zhang, J. De Baets, A. Van Calster, D. Corlatan, P. De Langhe en K. Allaert Photovia technology: Some important aspects for reliability Proceedings of Imaps `99, pp. 240-245 (1999)
  34. S. Zhang, J. De Baets en A. Van Calster A new approach of flip chip on board technology using SMT compatible processes Proceedings of the 12th European Microelectronics & Packaging Conference, pp. 111-117 (1999)
  35. J. Vanfleteren, J. De Baets, A. Van Calster, G. Schols, N. Pergoot, E. Jarvinen en A. Aintila Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies Proceedings of the 12th European Microelectronics & Packaging Conference, pp. 399-404 (1999)
  36. I. Born, D. Detemmerman, J. De Baets en A. Van Calster Low Cost High-Density Multilayer Circuits for MCM-C Proceedings of the fifth European Conference on MultiChip Modules, pp. 21-26 (1999)
  37. S. Zhang, M. Vereeken, J. De Baets en A. Van Calster The fabrication and reliability of a photovia test vehicle for MCM-L applications Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 53-58 (1998)
  38. M. Vrana, J. De Baets, A. Van Calster, I. Born en D. Detemmerman High density thick film multilayers with Ag-based conductors Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 789-794 (1998)
  39. S. Zhang, M. Vereeken, J. De Baets, A. Van Calster, J. Peeters en K. Allaert The realisation of photo-via technology using multiposit as a photo imageable dielectric Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac `98), pp. 62-65 (1998)
  40. M. Vrana, J. De Baets, A. Van Calster, I. Born en D. Detemmerman Low cost high density multilayer interconnection technology Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac `98), pp. 129-133 (1998)
  41. J. Van den Steen, N. Carchon, G. Van Doorselaer, C. De Backere, J. De Baets, H. De Smet, J. De Vos, J. Lernout, J. Vanfleteren en A. Van Calster Technology and Circuit Aspects of Reflective PNLC Microdisplays Proceedings of the 1997 International Display Research Conference, pp. 195-198 (1997)
  42. J. Van den Steen, G. Van Doorselaer, J. De Baets en A. Van Calster Custom Design and System Integration Proceedings of the 20th International Spring Seminar on Electronic Technology, pp. 263-266 (1997)
  43. M. Vrana, J. De Baets, A. Van Calster en B. Allaert Flip-chip assembly for chips with gold bumps on high density thick film substrates Proceeding of the 11th European Microelectronics Conference, pp. 175-182 (1997)
  44. S. Zhang, M. Vereecken, J. De Baets, A. Van Calster, A. Vervaet, J. Peeters en K. Allaert Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly Printed Circuit Board Technology, pp. (1997)
  45. N. Carchon, G. Van Doorselaer, A. M. De Cubber, J. De Baets, A. Van Calster, P. Candry en J. Bruggeman A Poly-CdSe Active matrix for PNLC projection Displays Proceedings of the 3rd symposium on Thin Film Transistor Technologies, Vol. 23, pp. 366-374 (1996)
  46. N. Carchon, G. Van Doorselaer, A. M. De Cubber, J. De Baets, A. Van Calster, P. Candry en J. Bruggeman A Poly-CdSe Active matrix for PNLC projection Displays Meeting abstracts, Vol. 2, pp. 649 (1996)
  47. M. Vrana, J. De Baets, A. Van Calster en D. Wojciechowski An Anisotropic Adhesive Flip-Chip Technology for LCD Drivers Digest of Technical papers, Vol. 27, pp. 929-932 (1996)
  48. D. Wojciechowski, A. Van Calster, M. Vrana, J. De Baets, M. De Caluwe en P. Bosch Flip-chip technology for chip-on-glass applications (LCD) Proceedings of the European Conference on Electronic Packaging Technology, Vol. 173, pp. 47-50 (1996)
  49. J. De Baets, A. Van Calster, J. Van Den Steen, G. Van Doorselaer, D. Wojciechowski, G. Schols en J. Witters Design of an x-Si active matrix for high resolution reflective displays Proceedings of the 15th International Display Research Conference, pp. 477-479 (1995)
  50. A. Dravet, S. Sechez, A. Van Calster, J. De Baets, J. Vanfleteren, K. Allaert, P. Vetter, M. Forrest, G. Schols, K. Deckelmann, J. Wiese en E. Cortes A new cost-effective TAB technology for small and medium volumes Proceedings of the 10th European Microelectronics Conference, pp. 547-558 (1995)
  51. A. Van Calster, J. De Baets, J. Vanfleteren, A. Dravet, K. Allaert, E. Cortes, K. Deckelman en G. Schols Anisotropic Conductive Adhesives for High Density Interconnections Proceedings of the 1st Eur. Conference on Electron. Packaging Techn., pp. 66-68 (1994)
  52. J. Vanfleteren, J. De Baets, A. Van Calster, A. Dravet, K. Deckelman, J. Wiese, W. Schmitt, K. Allaert, P. Vetter, G. Schols en E. Cortes Anisotropic Conductive Adhesives for high density interconnections in Liquid Crystal Displays Proceedings of the Conference on Adhesives in Electronics, pp. (1994)
  53. J. De Baets, A. Van Calster, A. De Cubber, H. De Smet en J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Proceedings of the Electrochemical Society, Vol. 94-35, pp. 228 - 232 (1994)
  54. A. Van Calster, A. De Cubber, J. De Baets, H. De Smet en J. Vanfleteren A simplified 3-step fabrication scheme for high mobility AMLCD panels Proceedings of the 14th International Display Research Conference, pp. 289-290 (1994)
  55. J. De Baets, A. Van Calster, A.M. De Cubber, H. De Smet en J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Extended abstracts of the Fall meeting of the Electrochemical Society, Vol. 94-2, pp. 693-694 (1994)
  56. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Conference book of abstracts, Eurosensors V, pp. 257 (1993)
  57. J. De Baets, J. Capon, A.M. De Cubber, H. De Smet, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa, M. Aizawa en H. Takatsu Hysteresis Phenomena in Active Matrix Adressed Polymer Network Liquid Crystal Displays Proceedings of the 13th Int. Display Research Conference, pp. 117-120 (1993)
  58. A. Van Calster, J. De Baets, A.M. De Cubber, J. Capon, H. De Smet en J. Vanfleteren On the Physical Properties of a New HVTFT Design Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  59. H. De Smet, J. Capon, J. De Baets, A.M. De Cubber, A. Van Calster en J. Vanfleteren Generalised TFT-Model for 4-Quadrant Simulations Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  60. A. Van Calster, J. De Baets, A.M. De Cubber, H. De Smet, J. Capon, J. Vanfleteren, J. Farell en M. Westcott Thin Film Technologies for High Density Active Matrix Adressed Displays Proceedings of the 9th European Hybrid Microelectronics Conference, pp. 84-90 (1993)
  61. Vanden Berghe R, S. Demolder, M. Saille, K. Allaert, A. De Bruycker, A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Failure Mechanisms in Dielectrics Proceedings of the 8th European Hybrid Microelectronics Conference, pp. 157-164 (1993)
  62. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Silicon Oxynitride Layers for Device Passivation Symp. of The Electrochemical Society, in Thin Film Transistor Technologies, Vol. 92-2, pp. 454-455 (1992)
  63. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A Lensless Contact-Type Image Sensor Based on a CdSe Photoconductive Array Proceedings of Eurosensors IV Conference, pp. 287-288 (1992)
  64. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, G. Nachtergaele en S. Demolder Silicon Oxynitride Layers for Device Passivation Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 192-199 (1992)
  65. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 296-306 (1992)
  66. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en J. Vanfleteren Active Matrix with Integrated Drivers on Soda-Lime Glass using Poly-CdSe and Poly-Ge Proceedings of Japan Display `92, pp. 225-228 (1992)
  67. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Displays Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  68. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Silicon oxynitride layers for device passivation Book of abstracts vo the Thin Film Transistor Technologies Symposium, Vol. 92-2, pp. 454-455 (1992)
  69. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Symp. of The Electrochemical Society, Thin Film Transistor Technologies, pp. 471-472 (1992)
  70. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active matrix design for polymer network liquid crystal projection displays Book of abstracts of the Thin Film Transistor Technologies Symposium, pp. 471-472 (1992)
  71. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A lensless contact-type image sensor based on de CdSe photoconductive array Eurosensors VI Conference book of abstracts, pp. 287-288 (1992)
  72. J. Farell, M. Westcott, A. Van Calster, J. De Baets, I. De Rycke, J. Capon, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin Film Cadmium Selenide Technology in Large Area Active Matrix High Resolution Displays Proceedings of the ESSDERC `92, pp. 187-190 (1992)
  73. A. Van Calster, J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren On the Ohmic Contact Formation in Poly-CdSe Thin Films Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  74. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Unification of Poly-CdSe Active Matrix and Poly-CdSe/poly-Ge Integrated Driver Technology Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  75. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe CdSe TFT active matrix addressed electroluminescent displays Proceedings of the 3rd Winter Workshop AMLCDs, pp. (1992)
  76. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu A Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Display Proceedings of the International Display Research Conference, pp. 215 - 218 (1991)
  77. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin film transistors for the addressing of liquid crystal displays Summer European Liquid Crystal Conference, pp. (1991)
  78. I. De Rycke, J. De Baets, J. Doutreloigne, A. Van Calster en J. Vanfleteren The realisation and evaluation of poly-CdSe TFT driving circuits International Display Research Conference, pp. 70-73 (1990)
  79. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Designing Complementary Integrated Driver Circuits Proceedings of the 1st. Int. CdSe Workshop, pp. 92-102 (1990)
  80. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe Evaluation of a 64x64 CdSe TFT Adressed ACTFEL Display Demonstrator Proceedings of the 1991 Int. Display Research Conference, pp. 134-136 (1990)
  81. J. Doutreloigne, H. De Smet, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Complementary CdSe:In/Ge:Cu TFT Circuits for Integrated Display Drivers Proceedings of the SID International Display Conference, pp. 316 - 319 (1990)
  82. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en A. Van Calster CdSe TFT Technology at the RU-Gent Laboratory of Electronics Proceedings of the 1th International CdSe Workshop, pp. 16 - 26 (1990)
  83. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Influence of the Processing Parameters of CdSe on TFT Characteristics Proceedings of the 1st. Int. CdSe Workshop, pp. 53-68 (1990)
  84. J. Vanfleteren, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en P. De Visschere Design of a Prototype Active Matrix CdSe TFT Adressed EL Display Eurodisplay `90, pp. 216-219 (1990)
  85. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A Correlation between 1/f Noise and Short-term Drift in Poly CdSe: In Thin Film Transistors Proceedings of the 10th International Conference on Noise in Physical Systems, pp. 511 - 514 (1989)
  86. A Van Calster, J. De Baets, I. De Rycke, J. Doutreloigne, H. De Smet en J. Vanfleteren On the poly-CdSe thin film transistor technology Proceedings of Japan Display, pp. 408-411 (1989)
  87. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A complementary Ge-CdSe TFT technology for flat panel displays TATF book of abstracts, pp. (1989)
  88. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A correlation between 1/f-noise and short-term drift in poly CdSe:In thin film transistors Book of abstracts of the 10th International Conference on Noise in Physical Systems, pp. 313-315 (1989)
  89. J. Vanfleteren, P. De Visschere, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en M. Maenpoa Active Matrix CdSe TFT Addressed Electroluminescent Displays Proceedings of the 1988 International Display research Conference, pp. 74-79 (1988)
  90. J. Vanfleteren, P. Vandenberghe, A. Van Calster, J. De Baets, I. De Rycke, F. Cuypers en P. Jones A Self-Aligned Poly-CdSe Thin Film Transistor Technology for Active Matrix Adressing With Grey Scales Proceedings of the 7th International Display Research Conference, pp. 165 - 168 (1987)
  91. A. Van Calster, A. Vervaet, I. De Rycke en J. De Baets Polycrystalline CdSe films for Thin Film Transistors The Seventh American Conference on Crystal Growth, pp. (1987)
  92. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets en J. Vanfleteren Polycrystalline CdSe Films for Thin Film Transistors The Third International Conference on II-VI Compounds, pp. 397 (1986)

Andere publicaties

  1. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman en Johan De Baets System-in-foil technology Ultra-thin chip technology and applications, pp. 141-157 (2011)
  2. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe CdSe TFT Active Matrix Adressed Electroluminescent Displays Proceedings of the 3rd Winter Worshop AMLCDs, pp. (1992)
  3. A. Van Calster, J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet en J. Doutreloigne CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays Voorgesteld op de `Summer European Liquid Crystal Conference`, pp. (1990)