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Vr, 2007-01-12 18:57 — mronsse

Publicaties van M Gonzalez

Publicaties in tijdschriften

  1. Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, Yung-Yu Hsu, Thomas Vervust, Ingrid De Wolf en Michal Jablonski Printed circuit board technology inspired stretchable circuits MRS BULLETIN, Vol. 37(3), pp. 254-260 (2012)
  2. Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf en Michal Jablonski SCB and SMI : two stretchable circuit technologies, based on standard printed circuit board processes CIRCUIT WORLD, Vol. 38(4), pp. 232-242 (2012)
  3. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis en PHM Timmermans Design and implementation of flexible and stretchable systems MICROELECTRONICS RELIABILITY, Vol. 51(6), pp. 1069-1076 (2011)
  4. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects THIN SOLID FILMS, Vol. 519(7), pp. 2225-2234 (2011)
  5. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Polyimide-enhanced stretchable interconnects : design, fabrication, and characterization IEEE TRANSACTIONS ON ELECTRON DEVICES, Vol. 58(8), pp. 2680-2688 (2011)
  6. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde en Ingrid De Wolf Design and analysis of a novel fine pitch and highly stretchable interconnect MICROELECTRONICS INTERNATIONAL, Vol. 27(1), pp. 33-38 (2010)
  7. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 20(7), pp. 11 (2010)
  8. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect JOURNAL OF MATERIALS RESEARCH, Vol. 24(12), pp. 3573-3582 (2009)
  9. Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde en Jan Vanfleteren Design of metal interconnects for stretchable electronic circuits MICROELECTRONICS RELIABILITY, Vol. 48(6), pp. 825-832 (2008)
  10. Dominique Brosteaux, Fabrice Axisa, Mario Gonzalez en Jan Vanfleteren Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits IEEE Electron Device Letters, Vol. 28(7), pp. 552-554 (2007)
  11. E. Parton, M. Gonzalez, R. Labie, B. Vandevelde, J. Vanfleteren en P. Ratchev Packaging research goes lead-free Printed Circuit Europe, pp. 38-41 (2003)

Conferentiepublicaties

  1. Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Reliability assessment of stretchable interconnects Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts, pp. (2010)
  2. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung Yu Hsu, Francois Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf Van der Sluis en Pieter Timmermans Thermo-mechanical analysis of flexible and stretchable systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings, pp. 7 (2010)
  3. Jonathan Govaerts, Jo Robbelein, Chun Gong, Bartek J Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt, Steven Van Put, Ivan Gordon, Kris Baert en Jan Vanfleteren Performance of a new type of module based on back-contact solar cells Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7773, pp. 10 (2010)
  4. C Van Hoff, H Neves, A Aarts, F Iker, P Soussan, M Gonzalez, E Beyne, Jan Vanfleteren, R Puers en P De Moor Design and Integration Technology for Miniature Medical Microsystems International Electron Devices Meeting, pp. 319-322 (2008)
  5. M. Gonzalez, Fabrice Axisa, Frederick Bossuyt, Y. Hsu, B. Vandevelde en Jan Vanfleteren Design and performance of metal conductors for stretchable electronic circuits ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 371-376 (2008)
  6. Jan Vanfleteren, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Beno��t Huyghe, Jeroen Missinne, Rik Verplancke en Mario Gonzalez Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology Symposium M, Proceedings (abstracts) MRS Spring Symposium, pp. ?-? (2008)
  7. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, N. De Smet, E. Schacht, M. Rymarczyk-Machal en J. Vanfleteren Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 6592-6595 (2007)
  8. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Low cost elastic and conformable electronic circuits and assembies using MID in stretchable polymer Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 691-696 (2007)
  9. M. Gonzalez, F. Axisa, M. Vanden Bulcke, D. Brosteaux, B. Vandevelde en J. Vanfleteren Design of metal interconnects for stretchable electronic circuits using finite element analysis Proceedings of IEEE EuroSimE, pp. 110-115 (2007)
  10. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann en J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  11. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Elastic and conformable electronic circuits and assembies using MID in polymer Proceedings of the 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 280-286 (2007)
  12. F Axisa, I Backers, D Brosteaux, M Gonzalez, M Vanden Bulcke, K Baert, D Gevaert en J Vanfleteren A new technology for elastic electronic circuits and assemblies for biomedical applications Proceedings of IMAPS Nordic, pp. 189-198 (2006)
  13. Dominique Brosteaux, Fabrice Axisa, Jan Vanfleteren, Nadine Carchon en M Gonzalez Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology MRS Spring meeting, pp. (2006)
  14. M. Gonzalez, B. Vandevelde, Jan Vanfleteren en D. Manessis Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 440-445 (2005)