Publicaties van D Manessis

Conferentiepublicaties

1. Andreas Ostmann, Dionysios Manessis, Johannes Stahr, Mark Beesley, Maarten Cauwe en Johan De Baets Industrial and technical aspects of chip embedding technology ESTC 2008 : 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 315-320 (2008)
2. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann en J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
3. T LOHER, D MANESSIS, R HEINRICH, B SCHMIED, Jan Vanfleteren, Johan De Baets, A OSTMANN en H REICHL Stretchable electronic systems EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, pp. 271-276 (2006)
4. M. Gonzalez, B. Vandevelde, Jan Vanfleteren en D. Manessis Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 440-445 (2005)
5. Bjorn Vandecasteele, Jan Vanfleteren, D. Manessis, A. Ostmann, H-W. Hagedorn en J. Wiese Lead-free flip chip: a comparison between lead-free solder and adhesives Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 434-439 (2005)