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Vr, 2007-01-12 18:57 — mronsse

Publicaties van A NAPIERALSKI

Publicaties in tijdschriften

  1. Marcin Janicki, Jedrzej Banaszczyk, Gilbert De Mey, Marek Kaminski, Bjorn Vermeersch en Andrzej Napieralski Dynamic thermal modelling of a power integrated circuit with the application of structure functions MICROELECTRONICS JOURNAL, Vol. 40(7), pp. 1135-1140 (2009)
  2. Gilbert De Mey, M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch, A Napieralski en Michel De Paepe Chimney effect on natural convection cooling of a transistor mounted on a cooling fin JOURNAL OF ELECTRONIC PACKAGING, Vol. 131(1), pp. (2009)
  3. Gilbert De Mey, J Pilarski, M Wojcik, M Lasota, Jedrzej Banaszczyk, Bjorn Vermeersch en Andrzej Napieralski Influence of interface materials on the thermal impedance of electronic packages International Communications in Heat and Mass Transfer, Vol. 36(3), pp. 210-212 (2009)
  4. Gilbert De Mey, M Wojcik, J Pilarski, M Lasota, Jedrzej Banaszczyk, Bjorn Vermeersch, Andrzej Napieralski en Michel De Paepe Chimney effect on natural convection cooling of a transistor mounted on a cooling fin Journal of Electronic Packaging, Vol. 131, pp. 014501 /1-3 (2009)
  5. Marcin Janicki, Gilbert De Mey en Andrzej Napieralski Thermal analysis of layered electronic circuits with Green's functions MICROELECTRONICS JOURNAL, Vol. 38(2), pp. 177-184 (2007)
  6. Gilbert De Mey, Bjorn Vermeersch, Jedrzej Banaszczyk, Tomasz Swiatczak, Boguslaw Wiecek, Marcin Janicki en Andrzej Napieralski Thermal impedances of thin plates International Journal of Heat and Mass Transfer, Vol. 50(21/22), pp. 4457-4460 (2007)
  7. P. Kawka, G. De Mey en A. Napieralski Pomier termiznego stanu przejsciowego jako metoda obliczania aktywnej powierzchni krzemu Elektronika, Vol. 2004(1), pp. 33-35 (2004)
  8. M JANICKI, Gilbert De Mey en A NAPIERALSKI Application of Green's functions for analysis of transient thermal states in electronic circuits MICROELECTRONICS JOURNAL, Vol. 33(9), pp. 733-738 (2002)
  9. M. Janicki, G. De Mey en A. Napieralski Application of Green`s functions for analysis of transient thermal states in electronic circuits Microelectronics Journal, Vol. 33(9), pp. 733-738 (2002)
  10. M. Janicki, G. De Mey en A. Napieralski Transient thermal analysis of multilayered structures using Green`s functions Microelectronics Reliability, Vol. 42(7), pp. 1059-1064 (2002)

Conferentiepublicaties

  1. Bjorn Vermeersch, Gilbert De Mey, M Wojcik, J Pilarski, M Lasota, Jedrzej Banaszczyk, Andrzej Napieralski en Michel De Paepe Chimney effect on natural convection cooling of electronic components IMAPS Advanced Technology Workshop on Thermal Management, pp. Ongepag. (1-6) (2008)
  2. Marcin Janicki, Bjorn Vermeersch, Jedrzej Banaszczyk, Marec Kaminski, Gilbert De Mey en Andrzej Napieralski Assessment of die attach quality by analysis of circuit thermal response spectrum Proceedings of the 14th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2008), pp. 43-46 (2008)
  3. Marcin Janicki, Stefan Kinderman, Piotr Pietrzak, Bjorn Vermeersch, Jedrzej Banaszczyk, Gilbert De Mey en Andrzej Napieralski Determining thermal simulation data from transient measurements Proceedings of the 24th IEEE Annual Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 24), Vol. 24, pp. 198-202 (2008)
  4. Marcin Janicki, Jedrzej Banaszczyk, Gilbert De Mey, Marek Kaminski, Bjorn Vermeersch en Andrzej Napieralski Application of structure functions for the investigation of forced air cooling Proceedings of the 13th International Conference on Thermal Investigations of ICs and Systems (THERMINIC 2007), pp. 2-5 (2007)
  5. Jedrzej Banaszczyk, Marcin Janicki, Bjorn Vermeersch, Gilbert De Mey en Andrzej Napieralski Application of advanced thermal analysis method for investigation of internal package structure Proc. 14th International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES 2007), pp. 553-558 (2007)
  6. Jedrzej Banaszczyk, Gilbert De Mey, Marcin Janicki, Andrzej Napieralski, Bjorn Vermeersch en Piotr Kawka Dynamic thermal analysis of a power amplifier Proceedings of the 12th International Workshop on Thermal Investigation of ICs and Systems (Therminic 2006), Vol. 1, pp. 128-132 (2006)
  7. Piotr Kawka, Gilbert De Mey en A. Napieralski Electronic Package Thermal Description By Dielectric Polarization Theory Proceedings of the 11th International Conference Mixed Design of Integrated Circuits and Systems MIXDES 2004, pp. 287-290 (2004)
  8. P. Kawka, G. De Mey en A. Napieralski Transient Thermal Measurement for Silicon Active Area Calculations Proceedings of the 10th International Conference Mixed Design of Integrated Circuits and Systems MIXDES, Vol. 10, pp. 383-386 (2003)
  9. P. Kawka, G. De Mey en A. Napieralski Transient thermal measurement as a non-invasive method for electronic chip layout investigation 6th National Congress on Theoretical and Applied Mechanics, Vol. 6, pp. op CD-ROM (2003)
  10. P. Kawka, G. De Mey en A. Napieralski Transient Thermal Measurement as a Tool for Packages Thermal Description ANCME 2003 The 2nd International Workshop on Advances in Numerical Computation Methods in Electromagnetism, Vol. 2, pp. 53-58 (2003)
  11. G. De Mey, P. Kawka en A. Napieralski Thermal characterisation of packages by inverse heating IMAPS Symposium proceedings, pp. 105-108 (2002)
  12. P. Kawka, G. De Mey en A. Napieralski Transient thermal measurements of integrated circuits based on inverse heating MIXDES 2002 conference proceedings, pp. (2002)
  13. M JANICKI, P KAWKA, Gilbert De Mey en A NAPIERALSKI Thermal measurements of IGBT power module EXPERIENCE OF DESIGNING AND APPLICATION OF CAD SYSTEMS IN MICROELECTRONICS, pp. 37-40 (2001)
  14. M. Janicki, P. Kawka, G. De Mey en A. Napieralski IGBT Hybrid Module Thermal Measurements and Simulations Proceedings of the 8th International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2001, Vol. 8, pp. 249-252 (2001)
  15. W. Wojciak, A. De Vos en A. Napieralski Integrated CMOS sensor with voltage output proportional to the absolute temperature Proceedings of the 2nd Advanced training Course: Mixed Design of VLSI Circuits, pp. 349 - 354 (1995)