Publicaties van A Ostmann

Conferentiepublicaties

1. Thomas Loeher, David Schuetze, Wim Christiaens, Kristof Dhaenens, Swarnakamal Priyabadini, Andreas Ostmann en Jan Vanfleteren Module miniaturization by ultra thin package stacking 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 1-5 (2010)
2. Andreas Ostmann, Dionysios Manessis, Johannes Stahr, Mark Beesley, Maarten Cauwe en Johan De Baets Industrial and technical aspects of chip embedding technology ESTC 2008 : 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 315-320 (2008)
3. J. De Baets, G. Willems, A. Ostmann, A. Kriechbaum en H. Kostner Cost modelling for embedded component technology Proceedings of the 16th European Microelectronics and Packaging Conference & Exhibitions, pp. 341-344 (2007)
4. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann en J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
5. T LOHER, D MANESSIS, R HEINRICH, B SCHMIED, Jan Vanfleteren, Johan De Baets, A OSTMANN en H REICHL Stretchable electronic systems EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, pp. 271-276 (2006)
6. Bjorn Vandecasteele, Jan Vanfleteren, D. Manessis, A. Ostmann, H-W. Hagedorn en J. Wiese Lead-free flip chip: a comparison between lead-free solder and adhesives Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 434-439 (2005)
7. Andreas Ostmann, Johan De Baets, Arno Kriechbaum, Hannes Kostner en Alexander Neumann Technology for Embedding Active Dies Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 101-106 (2005)
8. J. De Baets, M. Vereeken, A. Van Calster, D. Corlatan, E. Raedschelders, P. De Langhe, G. Patra, M. Morrell, C. Haley, G. Schols, A. Ostmann en D. Mathelin HIPERPRINT: a board technology for high-frequency applications Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 326-332 (2000)