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Vr, 2007-01-12 18:57 — mronsse

Publicaties van Sam Siau

Publicaties in tijdschriften

  1. Alfons Vervaet, Johan De Baets, Sam Siau en Boniface Manirambona Optimization of Microvia-Technology using Excimer Laser for Build-up Layer Application in Microelectronics Applied Surface Science, Vol. 252, pp. 8243-8250 (2006)
  2. Sam Siau, Alfons Vervaet, Lieven Degrendele, Johan De Baets en Andre Van Calster Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers Applied Surface Science(252), pp. 2717��2740 (2006)
  3. Sam Siau, Alfons Vervaet, Etienne Schacht, Ulric Demeter en Andre Van Calster Epoxy polymer surface modification through wet-chemical organic surface Thin Solid Films(495), pp. 348-356 (2006)
  4. Sam Siau, Alfons Vervaet, Etienne Schacht, Siska Degrande, Kristof Callewaert en Andre Van Calster Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper Journal of The Electrochemical Society, Vol. 152(9), pp. d136-d150 (2005)
  5. Sam Siau, Alfons Vervaet, Luc Van Vaeck, Etienne Schacht, Ulric Demeter en Andre Van Calster Adhesion Strength of the Epoxy Polymer/Copper Interface for Use in Microelectronics Journal of The Electrochemical Society, Vol. 152(6), pp. c442-c455 (2005)
  6. Sam Siau, Alfons Vervaet, Siska Degrande, Etienne Schacht en Andre Van Calster Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes. Applied Surface Science, Vol. 245(1-4), pp. 353-368 (2005)
  7. Sam Siau, Johan De Baets, Andre Van Calster, Leon Heremans en Sammy Tanghe Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards. Microelectronics Reliability, Vol. 45(3-4), pp. 675?687 (2005)
  8. Sam Siau, Alfons Vervaet, Sylvie Nalines, Etienne Schacht en Andre Van Calster Kinetic Study of Wet Chemical Treatments on the Surface Journal of The Electrochemical Society, Vol. 151(12), pp. c816-c830 (2004)
  9. Sam Siau, Alfons Vervaet, Sylvie Nalines, Etienne Schacht en Andre Van Calster Kinetic Study of Wet Chemical Treatments on the SurfaceRoughness of Epoxy Polymer Layers for Buildup Layers: II. Oxidative Treatment of the Surface Journal of The Electrochemical Society, Vol. 151(12), pp. c831-c849 (2004)
  10. Sam Siau, Alfons Vervaet, Andre Van Calster, Ives Swennen en Etienne Schacht Influence of wet chemical treatments on the evolution of epoxypolymer layer surface roughness for use as a build-up layer. Applied Surface Science, Vol. 237(1-4), pp. 457-462 (2004)
  11. Sam Siau, Alfons Vervaet, Andre Van Calster, Ives Swennen en Etienne Schacht Epoxy Polymer Surface Roughness Modeling Based on Kinetic Studies of Wet Chemical Treatments Journal of The Electrochemical Society, Vol. 151(8), pp. J54-J61 (2004)
  12. S. Siau, A. Vervaet, E. Schacht en A. Van Calster Influence of Chemical Pretreatment of Epoxy Polymers on the Adhesion Strength of Electrochemically Deposited Cu for Use in Electronic Interconnections Journal of the Electrochemical Society, Vol. 151(2), pp. c133-c141 (2004)

Conferentiepublicaties

  1. Sam Siau, Bert De Roo en Alfons Vervaet XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition(Abs.866), pp. 141-152 (2007)
  2. Sam Siau en Alfons Vervaet Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical Reactions ECS Transactions, Vol. 21, pp. 123 -132 (2007)
  3. Sam Siau, Alfons Vervaet, Etienne Schacht en André Van Calster Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society., pp. 348-348 (2005)
  4. Sam Siau, Alfons Vervaet, Andre Van Calster en Daniel Baert The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper. Program of the Fifth International Symposium on Polymer Surface Modification, pp. 22 (2005)
  5. Sam Siau, Alfons Vervaet, Andre Van Calster, Etienne Schacht en Ulric Demeter Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics Proceedings E-MRS 2005 Spring Meeting Strassbourg, pp. E37-E38 (2005)
  6. Sam Siau, Alfons Vervaet, André Van Calster en Etienne Schacht Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper Electrochemical Society, 205th Meeting, Abstracts, pp. 1 (2004)
  7. Sam Siau, Alfons Vervaet, Andr�� Van Calster, Ives Swennen en Etienne Schacht Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as build-up layer Abstracts of the 7th International Conference on Atomically COntrolled Surfaces, Interfaces and Nanostructures, pp. 496-502 (2003)
  8. Sam Siau, Alfons Vervaet, Andre Van Calster en Etienne Schacht Research of novel metal-polymer binding strategies in sequential buildup substrate technology Industry-Ready Innovative Research 1st Flanders Engineering PhD Symposium(Etro12), pp. (2003)
  9. S. Siau, A. Vervaet, A. Van Calster en Swennen Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for usage as build-up layer Abstracts of the 7th international conference on atomically controlled surfaces, interfaces and nanostructures, pp. 496 (2003)
  10. S. Siau, L. Degrendele, J. De Baets en A. Van Calster Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 158-162 (2003)

Andere publicaties

  1. Sam Siau, Alfons Vervaet, Andre Van Calster en Daniel Baert Development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically-deposited copper Adhesion Aspects of Thin Films, ISBN 978 90 6764 455 6, Vol. 3 pp. 157-177 (2007)
  2. Sam Siau Optimalisatie en modellering van chemisch behandelde build-up epoxy lagen / Optimization and modelling of chemically treated build-up epoxy layers Doctoraatsproefschrift Faculteit Toegepaste Wetenschappen, Universiteit Gent, pp. (2005)