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Vr, 2007-01-12 18:57 — mronsse

Publicaties van B Vandecasteele

Publicaties in tijdschriften

  1. Pietro Salvo, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu en Jan Vanfleteren Adhesive bonding by SU-8 transfer for assembling microfluidic devices MICROFLUIDICS AND NANOFLUIDICS, Vol. 13(6), pp. 987-991 (2012)
  2. Jonathan Govaerts, Bjorn Vandecasteele en Jan Vanfleteren Interconnecting drivers to flexible displays Journal of the SID, Vol. 16(7), pp. 765-775 (2008)
  3. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren en B. Vandecasteele Comparison of different flex materials in high density flip chip on flex applications Microelectronics Reliability, Vol. 43(3), pp. 445-451 (2003)
  4. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Advancing Microelectronics, Vol. 27(5), pp. 28-30 (2000)

Conferentiepublicaties

  1. Maarten Cauwe, Bjorn Vandecasteele, Johan De Baets, Jeroen van den Brand, Roel Kusters en Ashok Sridhar A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels 4th Electronics System Integration Technologies Conference 2012, Proceedings, pp. 1-6 (2012)
  2. Swarnakamal Priyabadini, Tom Sterken, Liang Wang, Kristof Dhaenens, BART VANDECASTEELE, Steven Van Put, Andreas Erik Petersen en Jan Vanfleteren An approach to produce a stack of photo definable polyimide based flat UTCPs 4th Electronics System Integration Technologies Conference 2012, Proceedings, pp. PA6_2-1-PA6_2-4 (2012)
  3. Maarten Cauwe, Bjorn Vandecasteele, An Gielen, Johan De Baets, Jeroen van den Brand en Roel Kusters Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils European Microelectronics and Packaging Conference, 18th, Proceedings, pp. 559-564 (2011)
  4. B. Vandecasteele, J. Govaerts en J. Vanfleteren Embedding of thinned chips in plastic substrates Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 30-35 (2007)
  5. B Vandecasteele, K Dhaenens, W Christiaens, L Degrendele, M Steel, A Van Liere en J Vanfleteren A flexible polyimide based circuit for rapid heating of small objects Proceedings of IMAPS Nordic, pp. 70-74 (2006)
  6. B Vandevelde, C Chen, J.P. Sommer, W Christiaens, B Vandecasteele, J Vanfleteren, R Rehtiniemi en A Arslan Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 147-152 (2006)
  7. Tom Bert, Jan Vanfleteren, Bjorn Vandecasteele, Stefaan Maeyaert, Jan Doutreloigne, Jonathan Govaerts, Herbert De Smet en Andre Van Calster Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates Proceedings of Flexible Displays and Electronics (FDE) 2005, pp. 1-14 (2005)
  8. Bjorn Vandecasteele, Jan Vanfleteren, D. Manessis, A. Ostmann, H-W. Hagedorn en J. Wiese Lead-free flip chip: a comparison between lead-free solder and adhesives Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 434-439 (2005)
  9. Jarmo Maattanen, Bjorn Vandecasteele, Jan Vanfleteren en Yannick de Maquille Tiheiden joustaville alustoille tehtyjen kaantosiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies Proceedings of Elektroniikan Valmistus 2004; Elektroniikan tuotanto-ja pakkaustekniikan konferenssii, pp. 89-93 (2004)
  10. Bjorn Vandecasteele, Jarmo Maattanen, Tomas Podprocky en Jan Vanfleteren Low temperature flip chip attachment for flexible display applications Proceedings of the International Conference on Electronics Packaging, pp. 307-312 (2004)
  11. Tomas Podprocky, Bjorn Vandecasteele, Johan De Baets, Andr�� Van Calster en J BANSKY Integration of thick film resitors in a multilayer structure 26TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, CONFERENCE PROCEEDINGS, pp. 137-140 (2003)
  12. B. Vandecasteele, T. Podprocky, J. Vanfleteren en J. Maattanen Low temperature flip chip with adhesives on PES Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 319-324 (2003)
  13. T. Podprocky, B. Vandecasteele, J. De Baets en A. Van Calster Thick film inductors for RF applications Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 138-142 (2003)
  14. B. Vandecasteele, J. Vanfleteren, J. Maattanen, T. Laitinen en Y. de Maquille Results of a high density flip chip on flex reliability test program Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 1-6 (2003)
  15. T. Podprocky, B. Vandecasteele, J. De Baets en A. Van Calster Integration of Thick Film resistors in a multilayer structure Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 137-140 (2003)
  16. J. Vanfleteren, B. Vandecasteele en T. Podprocky Low temperature flip-chip process using ICA and NCA (Isotropically and Non-Conductive Adhesive) for flexible displays application Proceedings of the 4th Electronics Packaging Technology Conference, pp. 139-143 (2002)
  17. J. Vanfleteren, B. Vandecasteele, S. Raevens, J. Maattanen en P. Perttula Reduced temperature flip-chip technologies on flexible display substrates using adhesives Proceedings of the 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 92-95 (2002)
  18. J. Vanfleteren, B. Vandecasteele en T. Podprocky A new adhesive flip-chip technology for low temperature andhigh density electronic assembly 1st POLYSCENE Workshop, pp. (2002)
  19. B. Vandecasteele, T. Podprocky en J. Vanfleteren High density flip chip with adhesives on ceramics Proceedings of the European Microelectronics Packaging an Interconnection Symposium (IMAPS), pp. 175-180 (2002)
  20. J. Vanfleteren, B. Vandecasteele en T. Podprocky Low cost adhesive flip-chip assembly technology using a combination of ICA and NCA Presented at GOOD-DIE International Workshop, pp. (2002)
  21. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren en B. Vandecasteele Reliability of different flex materials in high density flip chip on flex applications Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC), pp. 224-229 (2001)
  22. J. Vanfleteren, B. Vandecasteele, T. Podprocky en P. Jacobs Low temperatue flip-chip assembly for biomedical applications Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, pp. 213-216 (2001)
  23. S. Stoukatch, S. Zhang, J. Vanfleteren, M. Vereeken, A. Van Calster en B. Vandecasteele Electroless Nickel plating bath composition and replenishment for microvia plating processes Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 447-452 (2000)
  24. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 65-70 (2000)

Andere publicaties

  1. B. Vandecasteele Flip-Chips met adhesieven Stageverslag KIHO, pp. (1999)