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Vr, 2007-01-12 18:57 — mronsse

Publicaties van J Vanfleteren

Publicaties in tijdschriften

  1. Amir Jahanshahi, Mario Gonzalez, Jeroen van den Brand, Frederick Bossuyt, Thomas Vervust, Rik Verplancke en Jan Vanfleteren Stretchable circuits with horseshoe shaped conductors JAPANESE JOURNAL OF APPLIED PHYSICS, Vol. 52, pp. 7 (2013)
  2. Swarnakamal Priyabadini, Tom Sterken, Luc Van Hoorebeke en Jan Vanfleteren 3D stacking of ultra-thin chip packages : an innovative packaging and interconnection technology IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY(99), pp. 1-9 (2013)
  3. Pietro Salvo, Robrecht Raedt, Evelien Carrette, David Schaubroeck, Jan Vanfleteren en Ludwig Cardon A 3D printed dry electrode for ECG-EEG recording SENSORS AND ACTUATORS A-PHYSICAL, pp. (2012)
  4. Amir Jahanshahi, Fabrice Axisa en Jan Vanfleteren Fabrication of a biocompatible flexible electroosmosis micropump MICROFLUIDICS AND NANOFLUIDICS, pp. (2012)
  5. Jan Vanfleteren, Thomas Loeher, Mario Gonzalez, Frederick Bossuyt, Thomas Vervust, Ingrid De Wolf en Michal Jablonski SCB and SMI : two stretchable circuit technologies, based on standard printed circuit board processes CIRCUIT WORLD, Vol. 38(4), pp. 232-242 (2012)
  6. Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, Yung-Yu Hsu, Thomas Vervust, Ingrid De Wolf en Michal Jablonski Printed circuit board technology inspired stretchable circuits MRS BULLETIN, Vol. 37(3), pp. 254-260 (2012)
  7. Benoît Huyghe, Pietro Salvo, Jan Doutreloigne en Jan Vanfleteren Feasibility study and performance analysis of a gyroless orientation tracker IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, Vol. 61(8), pp. 2274-2282 (2012)
  8. Maarten Rockelé, Duy-Vu Pham, Jürgen Steiger, Silviu Botnaras, Dennis Weber, Jan Vanfleteren, Tom Sterken, Dieter Cuypers, Soeren Steudel, Kris Myny, Sarah Schols, Bas van der Putten, Jan Genoe en Paul Heremans Solution-processed and low-temperature metal oxide n-channel thin-film transistors and low-voltage complementary circuitry on large-area flexible polyimide foil JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, Vol. 20(9), pp. 499-507 (2012)
  9. Pietro Salvo, Rik Verplancke, Frederick Bossuyt, Daniel Latta, Bjorn Vandecasteele, Chengxun Liu en Jan Vanfleteren Adhesive bonding by SU-8 transfer for assembling microfluidic devices MICROFLUIDICS AND NANOFLUIDICS, Vol. 13(6), pp. 987-991 (2012)
  10. Rik Verplancke, Frederick Bossuyt, Dieter Cuypers en Jan Vanfleteren Thin-film stretchable electronics technology based on meandering interconnections : fabrication and mechanical performance JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 22(1), pp. 9 (2012)
  11. Tom De Nies, Thomas Vervust, Michiel Demey, Marc Leman, Jan Vanfleteren en Rik Van de Walle Synchronizing music and movement with BeatLED : an interactive musical social game JOURNAL OF NEW MUSIC RESEARCH, Vol. 41(4), pp. 351-363 (2012)
  12. Amir Jahanshahi, Pietro Salvo en Jan Vanfleteren Reliable stretchable gold interconnects in biocompatible elastomers JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, Vol. 50(11), pp. 773-776 (2012)
  13. Liang Wang, Tom Sterken, Maarten Cauwe, Dieter Cuypers en Jan Vanfleteren Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, Vol. 2(7), pp. 1099-1106 (2012)
  14. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele en Jan Vanfleteren Two axis optoelectronic tactile shear stress sensor SENSORS AND ACTUATORS A-PHYSICAL, Vol. 186, pp. 63-68 (2012)
  15. Divya Kurup, Maria Lucia Scarpello, Günter Vermeeren, Wout Joseph, Kristof Dhaenens, Fabrice Axisa, Luc Martens, Dries Vande Ginste, Hendrik Rogier en Jan Vanfleteren In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas EURASIP JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING, pp. 9 (2011)
  16. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects THIN SOLID FILMS, Vol. 519(7), pp. 2225-2234 (2011)
  17. Iaci M Pereira, Fabrice Axisa, Rodrigo L Oréfice, Jan Vanfleteren en Hercules P Neves Shape-memory anchoring system for bladder sensors JOURNAL OF BIOMEDICAL MATERIALS RESEARCH PART B-APPLIED BIOMATERIALS, Vol. 96B(2), pp. 369-375 (2011)
  18. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Polyimide-enhanced stretchable interconnects : design, fabrication, and characterization IEEE TRANSACTIONS ON ELECTRON DEVICES, Vol. 58(8), pp. 2680-2688 (2011)
  19. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis en PHM Timmermans Design and implementation of flexible and stretchable systems MICROELECTRONICS RELIABILITY, Vol. 51(6), pp. 1069-1076 (2011)
  20. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele en Jan Vanfleteren Flexible shear sensor based on embedded optoelectronic components IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 23(12), pp. 771-773 (2011)
  21. Maria Lucia Scarpello, Divya Kurup, Hendrik Rogier, Dries Vande Ginste, Fabrice Axisa, Jan Vanfleteren, Wout Joseph, Luc Martens en Günter Vermeeren Design of an implantable slot dipole conformal flexible antenna for biomedical applications IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, Vol. 59(10), pp. 3556-3564 (2011)
  22. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde en Ingrid De Wolf Design and analysis of a novel fine pitch and highly stretchable interconnect MICROELECTRONICS INTERNATIONAL, Vol. 27(1), pp. 33-38 (2010)
  23. Jonathan Govaerts, Erwin Bosman, Wim Christiaens en Jan Vanfleteren Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 33(1), pp. 72-78 (2010)
  24. Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Vol. 20(7), pp. 11 (2010)
  25. Erwin Bosman, Geert Van Steenberge, Bram Van Hoe, Jeroen Missinne, Jan Vanfleteren en Peter Van Daele Highly reliable flexible active optical links IEEE PHOTONICS TECHNOLOGY LETTERS, Vol. 22(5), pp. 287-289 (2010)
  26. André Van Calster en Jan Vanfleteren 3-D simulation of compound thin-film transistors JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, Vol. 18(12), pp. 1021-1028 (2010)
  27. Wim Christiaens, Erwin Bosman en Jan Vanfleteren UTCP : a novel polyimide-based ultra-thin chip packaging technology IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, Vol. 33(4), pp. 754-760 (2010)
  28. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne en Jan Vanfleteren Improved passive-matrix multiplexability with a modular display and UTCP technology DISPLAYS, Vol. 30(2), pp. 71-76 (2009)
  29. Nathalie De Geyter, Rino Morent, Tinneke Jacobs, Fabrice Axisa, Leon Gengembre, Christophe Leys, Jan Vanfleteren en Edmond Payen Remote atmospheric pressure DC glow discharge treatment for adhesion improvement of PDMS PLASMA PROCESSES AND POLYMERS, Vol. 6(suppl. 1), pp. S406-S411 (2009)
  30. Els Parton, Wim Christiaens en Jan Vanfleteren Embedded chips redefine miniaturization PRINTED CIRCUIT DESIGN & FAB, Vol. 26(7), pp. 37-39 (2009)
  31. Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren en Ingrid De Wolf In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect JOURNAL OF MATERIALS RESEARCH, Vol. 24(12), pp. 3573-3582 (2009)
  32. Pieter Bauwens, Ann Mont��, Wim Christiaens, Jan Doutreloigne en Jan Vanfleteren Improved Passive-Matrix Multiplexability with a Modular Display and UTCP Technology Displays, Vol. 30(2), pp. 71-76 (2009)
  33. Jonathan Govaerts, Wim Christiaens, Erwin Bosman en Jan Vanfleteren Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates IEEE Transactions on Advanced Packaging, Vol. 32(1), pp. 77-83 (2009)
  34. Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde en Jan Vanfleteren Design of metal interconnects for stretchable electronic circuits MICROELECTRONICS RELIABILITY, Vol. 48(6), pp. 825-832 (2008)
  35. Beno��t Huyghe, Hendrik Rogier, Jan Vanfleteren en Fabrice Axisa Design and Manufacturing of Stretchable High-Frequency Interconnects IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 31(4), pp. 802-808 (2008)
  36. Jonathan Govaerts, Bjorn Vandecasteele en Jan Vanfleteren Interconnecting drivers to flexible displays Journal of the SID, Vol. 16(7), pp. 765-775 (2008)
  37. Wim Christiaens, Thomas Loeher, Barbare Pahl, Michael Feil, Bart Vandevelde en Jan Vanfleteren Embedding and Assembly of Ultrathin Chips in Multilayer Flex Boards Circuit World, Vol. 34(3), pp. 3-8 (2008)
  38. Rino Morent, Nathalie De Geyter, Fabrice Axisa, Nele De Smet, L GENGEMBRE, Eva De Leersnyder, Christophe Leys, Jan Vanfleteren, Monika Rymarczyk-Machal, Etienne Schacht en E PAYEN Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics JOURNAL OF PHYSICS D-APPLIED PHYSICS, Vol. 40(23), pp. 7392-7401 (2007)
  39. Dominique Brosteaux, Fabrice Axisa, Mario Gonzalez en Jan Vanfleteren Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits IEEE Electron Device Letters, Vol. 28(7), pp. 552-554 (2007)
  40. D Depret, H Rogier, K Dhaenens en J Vanfleteren Flexible-substrate low-cost construction of a coplanar-waveguide aperture-coupled microstrip patch antenna Microwave and Optical Technology Letters, Vol. 49(5), pp. 1071-1074 (2007)
  41. K Baert, B Gyselinckx, T Torfs, V Leonov, F Yazicioglu, S Brebels, S Brebels, S Donnay, J Vanfleteren, E Beyne en C Van Hoof Technologies for highly miniaturized autonomous sensor networks Microelectronics Journal, Vol. 37, pp. 1563-1568 (2006)
  42. W Christiaens, E Bosman en J Vanfleteren Ultra-thin chip package using embedding in spin-on polyimides GOOD-DIE newsletter(19), pp. 41-44 (2006)
  43. M Cauwe, W Christiaens, J Vanfleteren en J De Baets Embedding active components as a 3D packaging solution Advancing Microelectronics(15), pp. 15-19 (2006)
  44. E. Parton, M. Gonzalez, R. Labie, B. Vandevelde, J. Vanfleteren en P. Ratchev Packaging research goes lead-free Printed Circuit Europe, pp. 38-41 (2003)
  45. F. Bruyneel, H. De Smet, J. Vanfleteren en A. Van Calster Response to Comment on the paper `Method for Measuring the cell gap in liquid-crystal displays` Optical Engineering, Vol. 42(8), pp. 2466 (2003)
  46. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren en B. Vandecasteele Comparison of different flex materials in high density flip chip on flex applications Microelectronics Reliability, Vol. 43(3), pp. 445-451 (2003)
  47. F. Bruyneel, H. De Smet, J. Vanfleteren en A. Van Calster Cell gap optimization and alignment effects in reflective PDLC microdisplays Liquid Crystals, Vol. 40(28), pp. 1245-1252 (2001)
  48. F. Bruyneel, H. De Smet, J. Vanfleteren en A. Van Calster Method for measuring the cell gap in liquid-crystal displays Optical Engineering, Vol. 40(2), pp. 259-267 (2001)
  49. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Advancing Microelectronics, Vol. 27(5), pp. 28-30 (2000)
  50. H. De Pauw, H. De Smet, J. Vanfleteren, J. Lernout en A. Van Calster Extension of a multilayer interconnection technology in MCM-Si with opto-electronic facilities Microelectronics Reliability, Vol. 40, pp. 163-170 (2000)
  51. J. Lernout, J. Vanfleteren, A. Van Calster en G. Schols A five-layer thin film MCM-Si design using oxynitride dielectrics Microelectronics International, Vol. 15(1), pp. 39-42 (1998)
  52. H. De Smet, J. De Baets, A.M. De Cubber, J. De Vos, A. Van Calster en J. Vanfleteren New model for the characterization and simulation of TFTs in all operating regions Journal of the Society for Information Display, Vol. 3(3), pp. 119-125 (1995)
  53. J. Capon, J. De Baets, A.M. De Cubber, H. De Smet, A. Van Calster en J. Vanfleteren Analysis of Transient Photoconductivity in CdSe:Cu:Cl Thin Films Physica Status Solidi A-Applied Research, Vol. 142(1), pp. (1994)
  54. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A Lensless Contact-type Image Sensor Based on a CdSe Photoconductive Array Sensors and Actuators A-Physical, Vol. 37-38, pp. 546-551 (1993)
  55. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren Geometric Design of Lensless Photoconductive Cotact-type Image Sensors Journal of the Society for Information Display, Vol. 1(2), pp. 233-241 (1993)
  56. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu A Polymer-Network Liquid-Crystal Poly-CdSe-TFT Active-Matrix Display Journal of the Society for Information Display, Vol. 1(2), pp. 189-194 (1993)
  57. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en J. Vanfleteren Active matrix with integrated drivers on soda-lime glass using poly-CdSe and poly-Ge Journal of the Society for Information Display, Vol. 1/4(4), pp. 423-428 (1993)
  58. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin Film Transistors for the Adressing of Liquid Crystal Displays Molecular Materials, Vol. 1, pp. 189-301 (1992)
  59. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Sensors and Actuators A-Physical, Vol. 32(1-3), pp. 437-441 (1992)
  60. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren The Electrical Performance of a Complementary CdSe:In/Ge:Cu Thin Film Transistor Technology for Flat Panel Displays Solid-State Electronics, Vol. 34(2), pp. 143-147 (1990)
  61. A. Van Calster, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Transistori a Film Sottile per Indicatori a Schermo Piatto Alta Frequenza Riv. di. Elett., Vol. II(1), pp. 3 - 8 (1990)
  62. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren The Influence of Low Copper-Doping Concentrations on the Recrystallisation Process in and the Electrical Properties of Germanium in Ge:Cu Thin Film Transistors Thin Solid Films(189), pp. 235-245 (1990)
  63. I. De Rycke, A. Van Calster, J. Vanfleteren, J. De Baets, J. Doutreloigne, H. De Smet en P. Vetter 2-MHz Clocked LCD Drivers on Glass IEEE Journal of Solid-State Circuits, Vol. 25(2), pp. 531-538 (1989)
  64. J. De Baets, J. Vanfleteren, I. De Rycke, J. Doutreloigne, A. Van Calster en P. De Visschere High-Voltage Polycrystalline CdSe Thin-Film Transistors IEEE Transactions on Electron Devices, Vol. 37(3), pp. 636-639 (1989)
  65. A. Van Calster, J. Vanfleteren, I. De Rycke en J. De Baets On the Field Effect in Polycristalline Thin-Film Transistors Applied Physics, Vol. 64(6), pp. 3282-3286 (1988)
  66. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets en J. Vanfleteren Polycrystalline CdSe films for thin film transistors Journal of Crystal Growth, Vol. 86, pp. 924-928 (1988)
  67. A. Van Calster, I. De Rycke, A. Vervaet, J. De Baets en J. Vanfleteren A New Technology for Fast Switching Circuits on Glass IEEE Electron Device Letters, Vol. EDL-8(10), pp. 477-479 (1987)
  68. J. Vanfleteren en A. Van Calster A Comparative Study of Evaporated Al2O3, SiO2 and SiO2:Al2O3 Thin Films Thin Solid Films, Vol. 139, pp. 89-94 (1985)
  69. J. Vanfleteren en A. Van Calster A Four-Vacuum-Cycle Lift-Off Process for the Polycristalline CdSe Thin-Film Transistor IEEE Electron Device Letters, Vol. EDL-6(1), pp. 11-13 (1984)

Conferentiepublicaties

  1. Swarnakamal Priyabadini, Tom Sterken, Maaike Op de Beeck en Jan Vanfleteren Photo-definable polyimide-based flat UTCP technology for 3D-stacking application Smart systems integration 2013, pp. 8 (2013)
  2. Rik Verplancke, Amir Jahanshahi, Tom Sterken, Dieter Cuypers en Jan Vanfleteren Thin-film based stretchable electronics technologies Smart systems integration 2013, pp. 8 (2013)
  3. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge en Jan Vanfleteren Foil-based optical technology platform for optochemical sensors PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8264(0R-1), pp. 82640R-1-82640R-9 (2012)
  4. Rik Verplancke, Tom Sterken, Dieter Cuypers en Jan Vanfleteren Thinned dies in a stretchable package ESTC 2012 : 4th electronics system integration technologies conference, pp. 5 (2012)
  5. Sanjeev Naithani, Rajesh Mandamparambil, Ferdie van Assche, David Schaubroeck, Henri Fleddreus, An Prenen, Geert Van Steenberge en Jan Vanfleteren Influence of barrier absorption properties on laser patterning thin organic films PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8435, pp. 843505-1-843505-9 (2012)
  6. Swarnakamal Priyabadini, Tom Sterken, Liang Wang, Kristof Dhaenens, BART VANDECASTEELE, Steven Van Put, Andreas Erik Petersen en Jan Vanfleteren An approach to produce a stack of photo definable polyimide based flat UTCPs 4th Electronics System Integration Technologies Conference 2012, Proceedings, pp. PA6_2-1-PA6_2-4 (2012)
  7. Michal Jablonski, Jan Vanfleteren, Thomas Vervust en Frederick Bossuyt Short, stretchable molded interconnect reliability under 10% cyclic elongation 4th Electronics System Integration Technology Conferences, Proceedings, pp. 4 (2012)
  8. Amir Jahanshahi, Pietro Salvo en Jan Vanfleteren Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers 34th Annual International Conference of the Engineering in Medicine and Biology Society, Proceedings, pp. 6007-6010 (2012)
  9. Tom Sterken, Filip Vermeiren, Piers Tremlett, Wim Christiaens en Jan Vanfleteren Embedding thinned chip in flexible PCBs ESTC 2012 : 4th electronics system integration technologies conference, pp. 4 (2012)
  10. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Rik Verplancke, Geert Van Steenberge, Sandeep Kalathimekkad, Peter Van Daele en Jan Vanfleteren Ultra thin optical tactile shear sensor PROCEDIA ENGINEERING, Vol. 25, pp. 1393-1396 (2012)
  11. Tom Sterken, Maaike Op de Beeck, Filip Vermeiren, Tom Torfs, Liang Wang, Swarnakamal Priyabadini, Kristof Dhaenens, Dieter Cuypers en Jan Vanfleteren High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP) IMAPS 2012 : proceedings of the 45th international symposium on microelectronics, pp. 940-945 (2012)
  12. Sandeep Kalathimekkad, Jeroen Missinne, Juan Diego Arias Espinoza, Bram Van Hoe, Erwin Bosman, Edsger Smits, Rajesh Mandamparambil, Geert Van Steenberge en Jan Vanfleteren Fluorescence-based optochemical sensor on flexible foils PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 8439(0Y-1), pp. 84390Y-1-84390Y-9 (2012)
  13. Swarnakamal Priyabadini, An Gielen, Kristof Dhaenens, Wim Christiaens, Steven Van Put, Gerhard Kunkel, Anders Erik Petersen en Jan Vanfleteren 3D-stacking of UTCPs as a module miniaturization technology 44th International Symposium on Microelectronics, Proceedings, pp. 463-468 (2011)
  14. Maarten Rockelé, Duy-Vu Pham, Jürgen Steiger, Silviu Botnaras, Dennis Weber, Jan Vanfleteren, Tom Sterken, Dieter Cuypers, Soeren Steudel, Kris Myny, Sarah Schols, Bas van der Putten, Jan Genoe en Paul Heremans Low-temperature and low-voltage, solution-processed metal oxide n-TFTs and flexible circuitry on large-area polyimide foil IDW : proceedings of the international display workshops, pp. 1267-1270 (2011)
  15. Tom Sterken, Jan Vanfleteren, Frederick Bossuyt, Steven Brebels, Wim Christiaens, Thomas Vervust, Michal Jablonski, Sheila Dunphy, Filip Vermeiren, Yung-yu Hsu, Tom Torfs en Maaike Opdebeeck A Reliable and comfortable package for wearable medical devices Microelectronic packaging for medical and Hi-Rel devices, Abstracts, pp. (2011)
  16. Tom Sterken, Jan Vanfleteren, Tom Torfs, Maaike Op de Beeck, Frederick Bossuyt en Chris Van Hoof Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system 2011 Annual international conference of the IEEE Engineering in Medicine and Biology Society (EMBS), pp. 6886-6889 (2011)
  17. Amir Jahanshahi, Fabrice Axisa en Jan Vanfleteren Fabrication of an implantable stretchable electro-osmosis pump Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7929, pp. 8 (2011)
  18. Tom De Nies, Thomas Vervust, Michiel Demey, Rik Van de Walle, Jan Vanfleteren en Marc Leman beatLED : the social gaming partyshirt Sound and music computing conference, proceedings, pp. 526-532 (2011)
  19. Jeroen Missinne, Erwin Bosman, Bram Van Hoe, Geert Van Steenberge, Peter Van Daele en Jan Vanfleteren Embedded flexible optical shear sensor IEEE Sensors, pp. 987-990 (2010)
  20. Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung Yu Hsu, Francois Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf Van der Sluis en Pieter Timmermans Thermo-mechanical analysis of flexible and stretchable systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 11th International conference, Proceedings, pp. 7 (2010)
  21. Thomas Vervust, Frederick Bossuyt, Fabrice Axisa en Jan Vanfleteren Stretchable and washable electronics for embedding in textiles MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, Vol. 1271E, pp. 6 (2010)
  22. Rik Verplancke, Tom Sterken, Fabrice Axisa en Jan Vanfleteren Development of a thin-film stretchable electrical interconnection technology for biocompatible applications 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 4 (2010)
  23. W Dulinski, J Baudot, N Chon-Sen, M Deveaux, M Goffe, K Minoglou, P De Moor, C Mntz, Tom Sterken, J Stroth, Jan Vanfleteren en M Winter Flexible monolithic active pixel sensors embedded in ultra thin polymer film IEEE Nuclear Science Symposium and Medical Imaging Conference, Abstracts, pp. (2010)
  24. Rik Verplancke, Frederick Bossuyt, Tom Sterken en Jan Vanfleteren Thin-film interconnection technology for use in a stretchable cell culture platform MRS Spring Meeting, Abstracts, pp. (2010)
  25. Thomas Loeher, David Schuetze, Wim Christiaens, Kristof Dhaenens, Swarnakamal Priyabadini, Andreas Ostmann en Jan Vanfleteren Module miniaturization by ultra thin package stacking 2010 3rd electronic system-integration technology conference (ESTC 2010), pp. 1-5 (2010)
  26. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren From single conductive layer to double conductive layer stretchable electronics MRS Spring Meeting, Abstracts, pp. (2010)
  27. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren Improved stretchable electronics technology for large area applications MRS Spring Meeting, Papers, pp. 7 (2010)
  28. Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren en Ingrid De Wolf Reliability assessment of stretchable interconnects Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts, pp. (2010)
  29. Jeroen Missinne, Geert Van Steenberge, Bram Van Hoe, Erwin Bosman, Christof Debaes, J��rgen Van Erps, Chunxiao Yan, Eleonora Ferraris, Peter Van Daele, Jan Vanfleteren, Hugo Thienpont en Dominiek Reynaerts High density optical pressure sensor foil based on arrays of crossing flexible waveguides PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, Vol. 7716, pp. 12 (2010)
  30. Jonathan Govaerts, Jo Robbelein, Chun Gong, Bartek J Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt, Steven Van Put, Ivan Gordon, Kris Baert en Jan Vanfleteren Performance of a new type of module based on back-contact solar cells Proceedings of SPIE, the International Society for Optical Engineering, Vol. 7773, pp. 10 (2010)
  31. Tom Sterken, Frederick Bossuyt, Rik Verplancke, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren Lifetime of stretchable meander-shaped copper conductors in PDMS subjected to cyclic elongation MRS Spring Meeting, Abstracts, pp. (2010)
  32. Frederick Bossuyt, Thomas Vervust, Fabrice Axisa en Jan Vanfleteren A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2, pp. 697-702 (2009)
  33. Fabrice Axisa, P Jourand, Evi Lippens, Monika Rymarczyk-Machal, N De Smet, Etienne Schacht, Jan Vanfleteren, R Puers en Maria Cornelissen Design and fabrication of a low cost implantable bladder pressure monitor EMBC: 2009 annual international conference of the IEEE Engineering in Medicine and Biology Society, vols 1 and 2, pp. 4864-4867 (2009)
  34. Beno��t Huyghe, Jan Vanfleteren en Jan Doutreloigne Design of flexible, low-power and wireless sensor nodes for human posture tracking aiding epileptic seizure detection Annual IEEE conference on Sensors, 8th, Proceedings, pp. 1963-1966 (2009)
  35. Rik Verplancke en Jan Vanfleteren Stretchable Electrical Interconnections: A Promising Technology for Use in Stretchable Microelectrode Arrays Proceedings 2009 Symposium on Microelectrode Arrays in Tissue Engineering, pp. 20-22 (2009)
  36. Jeroen Missinne, Geert Van Steenberge, Jan Vanfleteren en Peter Van Daele Multimode PDMS waveguides fabricated using a hot-embossing technique International Conference on Micro and Nano Engineering, 35th, Abstracts, pp. P-MEMS-18-P-MEMS-18 (2009)
  37. Dominique Brosteaux, Evi Lippens, Maria Cornelissen, Etienne Schacht, Riccardo Carta, Philippe Jourand, Robert Puers, Fabrice Axisa, Thomas Vervust, Frederick Bossuyt en Jan Vanfleteren In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronics 2009 31st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), pp. 4880-4883 (2009)
  38. Jeroen Missinne, Geert Van Steenberge, Bram Van Hoe, Kristof Van Coillie, Tim Van Gijseghem, Peter Dubruel, Jan Vanfleteren en Peter Van Daele An array waveguide sensor for artificial optical skins Proceedings of SPIE Photonics West - Photonics Packaging, Integration, and Interconnects IX, Vol. 7221, pp. 722105-1-722105-9 (2009)
  39. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof en Jan Vanfleteren 3D Integration of ultra-thin functional devices inside standard multilayer flex laminates European Microelectronics and Packaging Conference, Abstracts, pp. ? (2009)
  40. Tom Torfs, Wim Christiaens, Jan Vanfleteren, Wim Huwel, Wim Perdu, RF Yazicioglu, Steven Brebels en Chris Van Hoof Flexible wireless biopotential system with embedded ultra-thin chip Smart Systems Integration Conference, 3rd, Abstracts, pp. ? (2009)
  41. Bram Van Hoe, K. Van Coillie, Geert Van Steenberge, Jan Vanfleteren en Peter Van Daele Nieuwe benadering voor druksensoren: flexibele artifici��le optische huid , pp. 2 (2009)
  42. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Jan Vanfleteren en Peter Van Daele Fully embedded optical and electrical interconnections in flexible foils 2009 European Microelectronics and Packaging Conference (EMPC), pp. 5 (2009)
  43. Wim Christiaens, Tom Torfs, Wim Huwel, Chris Van Hoof en Jan Vanfleteren 3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems International Semiconductor Technology Conference and China Semiconductor Technology International Conference, Abstracts, pp. ? (2009)
  44. Jonathan Govaerts, Wim Christiaens en Jan Vanfleteren Ultra thin chip packaging (UTCP) : a promising technology for future flexible display interconnection 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III, pp. 202-205 (2009)
  45. Benoit Huyghe, Jan Doutreloigne en Jan Vanfleteren 3D orientation tracking based on unscented Kalman filtering of accelerometer and magnetometer data Proceedings of the Sensors Applications Symposium, 2009. SAS 2009. IEEE, pp. 148-152 (2009)
  46. Erwin Bosman, Geert Van Steenberge, Nina Hendrickx, Wim Christiaens, Jan Vanfleteren en Peter Van Daele Flexible embedded active optical link PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE), Vol. 6992, pp. 69920V-1-69920V-10 (2008)
  47. M. Gonzalez, Fabrice Axisa, Frederick Bossuyt, Y. Hsu, B. Vandevelde en Jan Vanfleteren Design and performance of metal conductors for stretchable electronic circuits ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 371-376 (2008)
  48. Fabrice Axisa, Frederick Bossuyt, Thomas Vervust en Jan Vanfleteren Laser based fast prototyping methodology of producing stretchable and conformable electronic systems ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, pp. 1387-1390 (2008)
  49. Nathalie De Geyter, Rino Morent, Fabrice Axisa, Eva De Leersnyder, Christophe Leys, Jan Vanfleteren, nele de smet, Monika Rymarczyk-Machal en Etienne Schacht Medium and atmospheric pressure plasma treatment for improvement of PDMS used for flexible and stretchable electronics Proceedings of the 7th IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics, pp. 3 (2008)
  50. Michiel Demey, Marc Leman, Bart Kuyken, Wouter Verstichel, Frederick Bossuyt en Jan Vanfleteren The HOP Sensor: Wirelss Motion Sensor Proceedings of the 8th International Conference of New Interfaces for Musical Expression (NIME), pp. 229-232 (2008)
  51. Michiel Demey, Marc Leman, Frederick Bossuyt en Jan Vanfleteren The Musical Synchrotron: using wireless motion sensors to study how social interaction affects synchronization with musical tempo Proceedings NIME 2008, pp. 372-373 (2008)
  52. Fabrice Axisa, Frederick Bossuyt, Jeroen Missinne, Rik Verplancke, Thomas Vervust en Jan Vanfleteren Stretchable engineering technologies for the development of advanced stretchable polymeric system Proceedings of the 7th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. (2008)
  53. Jan Vanfleteren, Fabrice Axisa, Dominique Brosteaux, Frederick Bossuyt, Eva De Leersnyder, Thomas Vervust, Beno��t Huyghe, Jeroen Missinne, Rik Verplancke en Mario Gonzalez Elastic electronic circuits and systems using Moulded Interconnect Device (MID) technology Symposium M, Proceedings (abstracts) MRS Spring Symposium, pp. ?-? (2008)
  54. Erwin Bosman, Geert Van Steenberge, Wim Christiaens, Nina Hendrickx, Jan Vanfleteren en Peter Van Daele Active optical links embedded in flexible substrates ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, pp. 1150-1157 (2008)
  55. Geert Van Steenberge, J. Missine, B. Van Hoe, K. Van Coillie, Jan Vanfleteren en Peter Van Daele Array waveguide sensor Proceedings NEMO Scientific General Networking Meeting, pp. (2008)
  56. R Carta, B Jourand, J Hermans, F Thone, Dominique Brosteaux, Fabrice Axisa, Jan Vanfleteren en B Puers Design and implementation of advanced systems on flexible-stretchable technology towards embedding textile International Conference EUROSENSORS, 22nd, Proceedings, pp. ?-? (2008)
  57. C Van Hoff, H Neves, A Aarts, F Iker, P Soussan, M Gonzalez, E Beyne, Jan Vanfleteren, R Puers en P De Moor Design and Integration Technology for Miniature Medical Microsystems International Electron Devices Meeting, pp. 319-322 (2008)
  58. Jonathan Govaerts en Jan Vanfleteren Assembly of Ultra-Thin Chip Packages (UTCPs) for Enhanced Flexibility of Flexible Displays Proceedings of the 2nd Electronics Systemintegration Technology, Vol. 1, pp. 309-314 (2008)
  59. Jonathan Govaerts, Wim Christiaens, Erwin Bosman en Jan Vanfleteren Multiple Chip Integration for Flat Flexible Electronics Proceedings of the 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), pp. 1-5 (digitaal) (2008)
  60. Wim Christiaens, Tom Torfs, Wim Huwel en Jan Vanfleteren Functionality and Reliability Testing of Bendable Ultrathin Chip Packages Proceedings of IMAPS Nordic, pp. 230 (2008)
  61. Wim Christiaens, Erwin Bosman, Wim Huwel, Wim Perdu en Jan Vanfleteren Flexible polyimide based ultra-thin chip package (UTCP) International workshop on Flexible and Stretchable Electronics, 1st, Abstracts, pp. ? (2007)
  62. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, J. Vanfleteren, B. Hermans en R. Puers Biomedical stretchable systems using MID based stretchable electronics technology Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 5687-5690 (2007)
  63. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, N. De Smet, E. Schacht, M. Rymarczyk-Machal en J. Vanfleteren Low cost, biocompatible elastic and conformable electronic technologies using MID in stretchable polymer Proceedings of the 29th Annual International Conference of the IEEE EMBS, pp. 6592-6595 (2007)
  64. N De Geyter, R Morent, F Axisa, E De Leersnyder, C Leys, J Vanfleteren, N De Smet, M Rymarczyk-Machal en E Schacht Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics Proceedings of the 3rd International Congress on Cold Atmospheric Pressure Plasmas: Sources and Applications, pp. 17-20 (2007)
  65. E Bosman, P Geerinck, W Christiaens, G Van Steenberge, J Vanfleteren en P Van Daele Multimode optical interconnections embedded in flexible electronics Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 155-160 (2007)
  66. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Low cost elastic and conformable electronic circuits and assembies using MID in stretchable polymer Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 691-696 (2007)
  67. E Bosman, G Van Steenberge, P Geerinck, W Christiaens, J Vanfleteren en P Van Daele Embedding of optical interconnections in flexible electronics Proceedings of the 57th Electronic Components and Technology Conference (ECTC), pp. 1281-1287 (2007)
  68. W. Christiaens, H. Burkard, J. Link en J. Vanfleteren Integration of thin flexible RF structures into flexible PCB Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 621-626 (2007)
  69. B. Vandevelde, L. Chen, S. Brebels, W. Christiaens en J. Vanfleteren Embedding of chips in flex: a global optimisation from thermal, mechanical and electrical RF perspective Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC), pp. 25-30 (2007)
  70. M. Gonzalez, F. Axisa, M. Vanden Bulcke, D. Brosteaux, B. Vandevelde en J. Vanfleteren Design of metal interconnects for stretchable electronic circuits using finite element analysis Proceedings of IEEE EuroSimE, pp. 110-115 (2007)
  71. J. Vanfleteren, H. De Smet, J. De Baets en A. Van Calster Advanced substrates and packages for wearable electronics and sensors Proceedings of Opening Symposium Microsystem Technology Lab High School Zeeland, pp. (2007)
  72. W. Christiaens, T. Loeher, M. Feil, B. Vandevelde en J. Vanfleteren Embedding of active components in multilayer flex boards Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  73. J. De Baets, F. Axisa, D. Brosteaux, M. Gonzalez, T. Loeher, D. Manessis, R. Heinrich, B. Schmied, A. Ostmann en J. Vanfleteren Stretchable conductor technology for elastic electronic systems Proceedings of IMAPS MicroTech 2007, pp. Ongepag. (2007)
  74. W. Christiaens, B. Vandevelde, S. Brebels en J. Vanfleteren Polyimide based embedding technology for RF structures and active components Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 22-29 (2007)
  75. B. Vandecasteele, J. Govaerts en J. Vanfleteren Embedding of thinned chips in plastic substrates Proceedings of the 12 annual SMTA Pan Pacific Microelectronics Symposium, pp. 30-35 (2007)
  76. F. Axisa, D. Brosteaux, E. De Leersnyder, F. Bossuyt, M. Gonzalez, M. Vanden Bulcke en J. Vanfleteren Elastic and conformable electronic circuits and assembies using MID in polymer Proceedings of the 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 280-286 (2007)
  77. Erwin Bosman, Wim Christiaens, Peter Geerinck, Geert Van Steenberge, Jan Vanfleteren en Peter Van Daele Optical interconnections embedded in flexible substrates Proceedings of the 7th UGent PhD symposium, pp. 69- (2006)
  78. T LOHER, D MANESSIS, R HEINRICH, B SCHMIED, Jan Vanfleteren, Johan De Baets, A OSTMANN en H REICHL Stretchable electronic systems EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, pp. 271-276 (2006)
  79. Wim Christiaens, Erwin Bosman en J VANFLETEREN Ultra-thin chip package using embedding in spin-on polyimides Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 125-128 (2006)
  80. Wim Christiaens, Bart Vandevelde, Erwin Bosman en Jan Vanfleteren UTCP : 60 ��m thick bendable package International Wafer-Level Packaging Conference, 3rd, Proceedings, pp. 114-119 (2006)
  81. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren en Peter Van Daele Optical connections on flexible substrates - art. no. 618506 MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, pp. 18506-18506 (2006)
  82. Wim Christiaens, Bart Vandevelde en Jan Vanfleteren (Flat) Ultra-thin chip package Meeting of the Symposium on Polymers for Microelectronics, 12th, Abstracts, pp. ? (2006)
  83. Erwin Bosman, Geert Van Steenberge, Peter Geerinck, Wim Christiaens, Jan Vanfleteren en Peter Van Daele Optical Interconnections embedded in flexible substrates Proceedings Symposium IEEE/LEOS Benelux Chapter, pp. 229-232 (2006)
  84. B Vandecasteele, K Dhaenens, W Christiaens, L Degrendele, M Steel, A Van Liere en J Vanfleteren A flexible polyimide based circuit for rapid heating of small objects Proceedings of IMAPS Nordic, pp. 70-74 (2006)
  85. F Axisa, I Backers, D Brosteaux, M Gonzalez, M Vanden Bulcke, K Baert, D Gevaert en J Vanfleteren A new technology for elastic electronic circuits and assemblies for biomedical applications Proceedings of IMAPS Nordic, pp. 189-198 (2006)
  86. W Christiaens, B Vandevelde en J Vanfleteren Ultra-thin chip package (UTCP) for flexible electronics applications Proceedings of IMAPS Nordic, pp. 7-11 (2006)
  87. B Vandevelde, C Chen, J.P. Sommer, W Christiaens, B Vandecasteele, J Vanfleteren, R Rehtiniemi en A Arslan Embedding of chips in flex and rigid substrates: impact on thermal and mechanical performance Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 147-152 (2006)
  88. Dominique Brosteaux, Fabrice Axisa, Jan Vanfleteren, Nadine Carchon en M Gonzalez Elastic interconnects for stretchable electronic circuits using MID (moulded interconnect device) technology MRS Spring meeting, pp. (2006)
  89. Erwin Bosman, Peter Geerinck, Wim Christiaens, Geert Van Steenberge, Jan Vanfleteren en Peter Van Daele Optical connections on flexible substrates Proceedings of SPIE Photonics Europe Conference, Vol. 6185, pp. 618506/1-618506/8 (2006)
  90. W Christiaens, E Bosman en J Vanfleteren Ultra-thin chip package using embedding in spin-on polyimides Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS), pp. 125-128 (2006)
  91. Wim Christiaens, Michael Feil, Thomas Loeher en Jan Vanfleteren Embedded ultra-thin chips in flex Flexible Electronic Systems Forum, Abstracts, pp. ? (2005)
  92. Jonathan Govaerts en Jan Vanfleteren Electrical Interconnection by Means of Conductive Adhesives and Inks Proceedings of the 6th UGent-FirW Doctoraatssymposium, pp. 58 (2005)
  93. Tom Bert, Jan Vanfleteren, Bjorn Vandecasteele, Stefaan Maeyaert, Jan Doutreloigne, Jonathan Govaerts, Herbert De Smet en Andre Van Calster Advanced Technologies in Fabrication and Interconnection of Flexible Displays and Substrates Proceedings of Flexible Displays and Electronics (FDE) 2005, pp. 1-14 (2005)
  94. Jan Vanfleteren FP5-CSG-IMECAT: Introduction and Highlights of an EC funded Project on Lead-Free Materials and Assembly Development Technologies Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 419-422 (2005)
  95. M. Gonzalez, B. Vandevelde, Jan Vanfleteren en D. Manessis Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 440-445 (2005)
  96. Bjorn Vandecasteele, Jan Vanfleteren, D. Manessis, A. Ostmann, H-W. Hagedorn en J. Wiese Lead-free flip chip: a comparison between lead-free solder and adhesives Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition, pp. 434-439 (2005)
  97. Jarmo Maattanen, Bjorn Vandecasteele, Jan Vanfleteren en Yannick de Maquille Tiheiden joustaville alustoille tehtyjen kaantosiruliitosten testausohjelma ja tulokset - reliability results of high density flip chip on flex assemblies Proceedings of Elektroniikan Valmistus 2004; Elektroniikan tuotanto-ja pakkaustekniikan konferenssii, pp. 89-93 (2004)
  98. Bjorn Vandecasteele, Jarmo Maattanen, Tomas Podprocky en Jan Vanfleteren Low temperature flip chip attachment for flexible display applications Proceedings of the International Conference on Electronics Packaging, pp. 307-312 (2004)
  99. Herbert De Pauw, Johan De Baets, Jan Vanfleteren en Andr�� Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, pp. 169-176 (2003)
  100. H. De Pauw, J. De Baets, J. Vanfleteren en A. Van Calster Integrated optics in a standard MCM-D motherboard technology demonstrated i O/E measurement probes Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition, pp. 35192 (2003)
  101. B. Vandecasteele, T. Podprocky, J. Vanfleteren en J. Maattanen Low temperature flip chip with adhesives on PES Proceedings of the 14th European Microelectronics and Packaging Conference & Exhibition, pp. 319-324 (2003)
  102. B. Vandecasteele, J. Vanfleteren, J. Maattanen, T. Laitinen en Y. de Maquille Results of a high density flip chip on flex reliability test program Proceedings of the 26th International Spring Seminar on Electronics Technology, pp. 1-6 (2003)
  103. J. Vanfleteren, B. Vandecasteele en T. Podprocky Low temperature flip-chip process using ICA and NCA (Isotropically and Non-Conductive Adhesive) for flexible displays application Proceedings of the 4th Electronics Packaging Technology Conference, pp. 139-143 (2002)
  104. B. P. Braeckman, J. Dambre en J. Vanfleteren Modeling age-dependent decline of metabolic rate in Caenorhabditis elegans Molecular Genetics of Aging Meeting, Cold Spring Harbor, New York, US, pp. (2002)
  105. H. De Pauw, J. De Baets, J. Vanfleteren en A. Van Calster An O/E measurement probe based on an optics-extended MCM-D motherboard technology Proceedings of the 35th International Symposium on Microelectronics (IMAPS), pp. 936-941 (2002)
  106. J. Vanfleteren, B. Vandecasteele en T. Podprocky A new adhesive flip-chip technology for low temperature andhigh density electronic assembly 1st POLYSCENE Workshop, pp. (2002)
  107. J. Vanfleteren, B. Vandecasteele, S. Raevens, J. Maattanen en P. Perttula Reduced temperature flip-chip technologies on flexible display substrates using adhesives Proceedings of the 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 92-95 (2002)
  108. B. Vandecasteele, T. Podprocky en J. Vanfleteren High density flip chip with adhesives on ceramics Proceedings of the European Microelectronics Packaging an Interconnection Symposium (IMAPS), pp. 175-180 (2002)
  109. J. Vanfleteren, B. Vandecasteele en T. Podprocky Low cost adhesive flip-chip assembly technology using a combination of ICA and NCA Presented at GOOD-DIE International Workshop, pp. (2002)
  110. P. Palm, J. Maattanen, Y. De Maquille, A. Picault, J. Vanfleteren en B. Vandecasteele Reliability of different flex materials in high density flip chip on flex applications Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC), pp. 224-229 (2001)
  111. Z. Illyefalvi-Vitez, R. Berenyi, P. Gordon, J. Pinkola, M. Ruszinko en J. Vanfleteren Laser via generation into flexible substrates Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC), pp. 230-235 (2001)
  112. F. Bruyneel, H. De Smet, J. Vanfleteren en A. Van Calster Assembly of reflective PDLC microdisplays 2001 International Symposium Digest of Technical Papers, Vol. 17, pp. 442-445 (2001)
  113. J. Vanfleteren, B. Vandecasteele, T. Podprocky en P. Jacobs Low temperatue flip-chip assembly for biomedical applications Proceedings of the 13th European Microelectronics and Packaging Conference & Exhibition, pp. 213-216 (2001)
  114. H. De Pauw, J. Vanfleteren, J. De Baets en A. Van Calster Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations Proceedings of the 2001 International Conference and Exhibition on High Density Interconnect and Systems Packaging, pp. 302-307 (2001)
  115. F. Bruyneel, H. De Smet, J. Vanfleteren, A. Van Calster, T. Fujisawa en M. Aizawa Characteristics of PNLC in reflective displays Proceedings of the 20th International Display Research Conference (IDRC), pp. 217-220 (2000)
  116. J. Vanfleteren, S. Stoukatch, B. Vandecasteele, A. Van Calster, S. Criel, G. Willems, P. De Langhe, L. Vandam en K. Allaert Mixed assembly on PCB using a novel flip-chip technology Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 65-70 (2000)
  117. S. Stoukatch, S. Zhang, J. Vanfleteren, M. Vereeken, A. Van Calster en B. Vandecasteele Electroless Nickel plating bath composition and replenishment for microvia plating processes Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe), pp. 447-452 (2000)
  118. J. Vanfleteren, A. Vervaet en A. Van Calster Highlights of the DACTEL project: Development of Adhesive Chip Technologies for Dedicated Electronic Applications Proceedings of the 23rd International Spring Seminar on Electronics Technology, pp. 315-318 (2000)
  119. H. De Pauw, J. Vanfleteren, H. De Smet, S. Zhang en A. Van Calster An MCM-D laser driver hybrid with RF amplifier chip, combining advanced FC assembly and novel single chip bumping technology Proceedings of the 2000 International Conference on High-Density Interconnect and Systems Packaging, pp. 557-562 (2000)
  120. H. De Pauw, J. Vanfleteren, H. De Smet, S. Zhang en A. Van Calster A hybrid thin-film laser driver module for RF frequency with a full-custom C07 analog driver amplifier Proceedings of Imaps `99, pp. 195-200 (1999)
  121. J. Vanfleteren, J. De Baets, A. Van Calster, G. Schols, N. Pergoot, E. Jarvinen en A. Aintila Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies Proceedings of the 12th European Microelectronics & Packaging Conference, pp. 399-404 (1999)
  122. G. Van Doorselaer, N. Carchon, J. Van den Steen, D. Cuypers, J. Vanfleteren, H. De Smet en A. Van Calster A silicon based reflective polymer dispersed LC display for portable low power applications Proceedings of the IS&T/SPIE Conference on Liquid Crystal Materials, Devices, and Appications VII, Vol. 3635, pp. 95-102 (1999)
  123. J. De Vos, S. Stoukatch, H. De Pauw, H. De Smet, I. Popov, J. Vanfleteren en A. Van Calster Active matrix vacuum fluorescent display with CdSe:In TFTS Proceedings of the 194th meeting of the Electrochemical Society (Thin Film Transistor Technologies IV), Vol. 98-22, pp. (1998)
  124. J. De Vos, S. Stoukatch, H. De Pauw, H. De Smet, I. Popov, J. Vanfleteren en A. Van Calster Active Matrix Vacuum Fluorescent Display with CdSe:In TFTs Meeting Abstracts, The 194th meeting of The Electrochemical Society, Inc., Vol. 98-2, pp. 716 (1998)
  125. D. Wojciechowski, J. Vanfleteren, E. Reese en H-W. Hagedorn New adhesives for high density flip-chip interconnection Proceedings of the International Symposium on Microelectronics, pp. 224-229 (1998)
  126. H. De Pauw, H. De Smet, J. Vanfleteren, J. Lernout en A. Van Calster Multilayer motherboard technology in MCM-Si with opto-electronic features Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 347-352 (1998)
  127. G. Van Doorselaer, B. Dobbelaere, M. Vrana, X. Xie, N. Carchon, J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers en A. Van Calster A paper-white chip-based display MCM package for portable IT products Proceedings of the International Symposium on Microelectronics (IMAPS `98), pp. 543-547 (1998)
  128. G. Van Doorselaer, N. Carchon, J. Van den Steen, J. Vanfleteren, H. De Smet, D. Cuypers en A. Van Calster Characterisation of a paper-white reflective PDLC microdisplay for portable IT applications Proceedings of the 18th international display research conference (Asia Display `98), pp. 55-58 (1998)
  129. G. Van Doorselaer, N. Carchon, J. Van den Steen, D. Cuypers, J. Vanfleteren, H. De Smet en A. Van Calster A Reflective Polymer Dispersed Information Display made on CMOS Proceedings of the International Congress on Imaging Science ICPS`98, Vol. 2, pp. 222-225 (1998)
  130. J. Lernout, J. Vanfleteren, A. Van Calster, L. Vanwassenhove en P. Van Daele Design and fabrication of a two layer thin film interconnection system on glass for use in a parallel free-space optical interconnection demonstrator Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac `98), pp. 7-9 (1998)
  131. J. Vanfleteren Flip Chip Attachment using Adhesives Proceedings of the IMAPS-Benelux Spring Event 98, pp. (1998)
  132. J. Van den Steen, N. Carchon, G. Van Doorselaer, C. De Backere, J. De Baets, H. De Smet, J. De Vos, J. Lernout, J. Vanfleteren en A. Van Calster Technology and Circuit Aspects of Reflective PNLC Microdisplays Proceedings of the 1997 International Display Research Conference, pp. 195-198 (1997)
  133. J. Lernout, J. Vanfleteren, A. Van Calster en G. Schols A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics Proceedings of the 11th European Microelectronics Conference, pp. 637-640 (1997)
  134. E. Reese en J. Vanfleteren Fine Pitch Interconnection using Anisotropic Conducting Adhesives Proceedings of the 11th European Microelectronics Conference, pp. 457-464 (1997)
  135. J. Lernout, J. Vanfleteren, A. Van Calster en G. Schols A Five Layer Thin Film MCM-Si Design using Oxynitride Dielectrics Abstract Book of IMAPS/NATO Advanced Research Workshop on Electronic Packaging for High Reliability, Low Cost Electronics, pp. (1997)
  136. A. Dravet, P. Kertesz, S. Sechez, A. Van Calster, J. Vanfleteren, M. De Caluwe, K. Deckelmann, J. Wiese en G. Schols A Low-Cost TAB Interconnection technology for LCD Drivers Digest of Technical papers, Vol. 27, pp. 925-928 (1996)
  137. J. Vanfleteren, A. Van Calster, K. Sabbe, M. De Caluwe, A. Dravet, P. Kertesz, S. Secher, K. Deckelmann, J. Wiese, E. Cortes, M. Lopez, G. Schols, K. Allaert, P. Vetter en M. Forrest Development of an adhesive TAB joining technology Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, pp. 24-26 (1996)
  138. A. Dravet, S. Sechez, A. Van Calster, J. De Baets, J. Vanfleteren, K. Allaert, P. Vetter, M. Forrest, G. Schols, K. Deckelmann, J. Wiese en E. Cortes A new cost-effective TAB technology for small and medium volumes Proceedings of the 10th European Microelectronics Conference, pp. 547-558 (1995)
  139. J. Vanfleteren, J. De Baets, A. Van Calster, A. Dravet, K. Deckelman, J. Wiese, W. Schmitt, K. Allaert, P. Vetter, G. Schols en E. Cortes Anisotropic Conductive Adhesives for high density interconnections in Liquid Crystal Displays Proceedings of the Conference on Adhesives in Electronics, pp. (1994)
  140. A. Van Calster, J. De Baets, J. Vanfleteren, A. Dravet, K. Allaert, E. Cortes, K. Deckelman en G. Schols Anisotropic Conductive Adhesives for High Density Interconnections Proceedings of the 1st Eur. Conference on Electron. Packaging Techn., pp. 66-68 (1994)
  141. J. De Baets, A. Van Calster, A.M. De Cubber, H. De Smet en J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Extended abstracts of the Fall meeting of the Electrochemical Society, Vol. 94-2, pp. 693-694 (1994)
  142. A. Van Calster, A. De Cubber, J. De Baets, H. De Smet en J. Vanfleteren A simplified 3-step fabrication scheme for high mobility AMLCD panels Proceedings of the 14th International Display Research Conference, pp. 289-290 (1994)
  143. J. De Baets, A. Van Calster, A. De Cubber, H. De Smet en J. Vanfleteren Modelling Poly-CdSe TFTs for AMLCD Proceedings of the Electrochemical Society, Vol. 94-35, pp. 228 - 232 (1994)
  144. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren CdSe Based Thin Film Integrated Optical Sensors Conference book of abstracts, Eurosensors V, pp. 257 (1993)
  145. J. De Baets, J. Capon, A.M. De Cubber, H. De Smet, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa, M. Aizawa en H. Takatsu Hysteresis Phenomena in Active Matrix Adressed Polymer Network Liquid Crystal Displays Proceedings of the 13th Int. Display Research Conference, pp. 117-120 (1993)
  146. H. De Smet, J. Capon, J. De Baets, A.M. De Cubber, A. Van Calster en J. Vanfleteren Generalised TFT-Model for 4-Quadrant Simulations Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  147. A. Van Calster, J. De Baets, A.M. De Cubber, J. Capon, H. De Smet en J. Vanfleteren On the Physical Properties of a New HVTFT Design Proceedings of the 3th Int. CdSe Workshop, pp. (1993)
  148. A. Van Calster, J. De Baets, A.M. De Cubber, H. De Smet, J. Capon, J. Vanfleteren, J. Farell en M. Westcott Thin Film Technologies for High Density Active Matrix Adressed Displays Proceedings of the 9th European Hybrid Microelectronics Conference, pp. 84-90 (1993)
  149. Vanden Berghe R, S. Demolder, M. Saille, K. Allaert, A. De Bruycker, A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Failure Mechanisms in Dielectrics Proceedings of the 8th European Hybrid Microelectronics Conference, pp. 157-164 (1993)
  150. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 296-306 (1992)
  151. H. De Smet, J. Capon, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en J. Vanfleteren Active Matrix with Integrated Drivers on Soda-Lime Glass using Poly-CdSe and Poly-Ge Proceedings of Japan Display `92, pp. 225-228 (1992)
  152. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Silicon Oxynitride Layers for Device Passivation Symp. of The Electrochemical Society, in Thin Film Transistor Technologies, Vol. 92-2, pp. 454-455 (1992)
  153. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A Lensless Contact-Type Image Sensor Based on a CdSe Photoconductive Array Proceedings of Eurosensors IV Conference, pp. 287-288 (1992)
  154. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Displays Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  155. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, G. Nachtergaele en S. Demolder Silicon Oxynitride Layers for Device Passivation Proceedings of the 1st TFTT Symposium, Vol. 92-24, pp. 192-199 (1992)
  156. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active matrix design for polymer network liquid crystal projection displays Book of abstracts of the Thin Film Transistor Technologies Symposium, pp. 471-472 (1992)
  157. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Silicon oxynitride layers for device passivation Book of abstracts vo the Thin Film Transistor Technologies Symposium, Vol. 92-2, pp. 454-455 (1992)
  158. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu Active Matrix Design for Polymer Network Liquid Crystal Projection Displays Symp. of The Electrochemical Society, Thin Film Transistor Technologies, pp. 471-472 (1992)
  159. J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en J. Vanfleteren A lensless contact-type image sensor based on de CdSe photoconductive array Eurosensors VI Conference book of abstracts, pp. 287-288 (1992)
  160. J. Farell, M. Westcott, A. Van Calster, J. De Baets, I. De Rycke, J. Capon, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin Film Cadmium Selenide Technology in Large Area Active Matrix High Resolution Displays Proceedings of the ESSDERC `92, pp. 187-190 (1992)
  161. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Unification of Poly-CdSe Active Matrix and Poly-CdSe/poly-Ge Integrated Driver Technology Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  162. A. Van Calster, J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren On the Ohmic Contact Formation in Poly-CdSe Thin Films Proceedings of the 2nd Int. CdSe Workshop, pp. (1992)
  163. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe CdSe TFT active matrix addressed electroluminescent displays Proceedings of the 3rd Winter Workshop AMLCDs, pp. (1992)
  164. J. De Baets, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, J. Vanfleteren, T. Fujisawa, H. Ogawa en H. Takatsu A Polymer Network Liquid Crystal Poly-CdSe TFT Active Matrix Display Proceedings of the International Display Research Conference, pp. 215 - 218 (1991)
  165. A. Van Calster, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Thin film transistors for the addressing of liquid crystal displays Summer European Liquid Crystal Conference, pp. (1991)
  166. J. Doutreloigne, H. De Smet, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Complementary CdSe:In/Ge:Cu TFT Circuits for Integrated Display Drivers Proceedings of the SID International Display Conference, pp. 316 - 319 (1990)
  167. H. De Smet, J. Doutreloigne, J. Capon, J. De Baets, I. De Rycke, A. Van Calster en J. Vanfleteren Designing Complementary Integrated Driver Circuits Proceedings of the 1st. Int. CdSe Workshop, pp. 92-102 (1990)
  168. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe Evaluation of a 64x64 CdSe TFT Adressed ACTFEL Display Demonstrator Proceedings of the 1991 Int. Display Research Conference, pp. 134-136 (1990)
  169. I. De Rycke, J. De Baets, J. Doutreloigne, A. Van Calster en J. Vanfleteren The realisation and evaluation of poly-CdSe TFT driving circuits International Display Research Conference, pp. 70-73 (1990)
  170. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne en A. Van Calster CdSe TFT Technology at the RU-Gent Laboratory of Electronics Proceedings of the 1th International CdSe Workshop, pp. 16 - 26 (1990)
  171. J. De Baets, A. Van Calster, J. Capon, I. De Rycke, H. De Smet, J. Doutreloigne en J. Vanfleteren Influence of the Processing Parameters of CdSe on TFT Characteristics Proceedings of the 1st. Int. CdSe Workshop, pp. 53-68 (1990)
  172. J. Vanfleteren, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster en P. De Visschere Design of a Prototype Active Matrix CdSe TFT Adressed EL Display Eurodisplay `90, pp. 216-219 (1990)
  173. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A complementary Ge-CdSe TFT technology for flat panel displays TATF book of abstracts, pp. (1989)
  174. A Van Calster, J. De Baets, I. De Rycke, J. Doutreloigne, H. De Smet en J. Vanfleteren On the poly-CdSe thin film transistor technology Proceedings of Japan Display, pp. 408-411 (1989)
  175. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A Correlation between 1/f Noise and Short-term Drift in Poly CdSe: In Thin Film Transistors Proceedings of the 10th International Conference on Noise in Physical Systems, pp. 511 - 514 (1989)
  176. J. Doutreloigne, J. De Baets, I. De Rycke, H. De Smet, A. Van Calster en J. Vanfleteren A correlation between 1/f-noise and short-term drift in poly CdSe:In thin film transistors Book of abstracts of the 10th International Conference on Noise in Physical Systems, pp. 313-315 (1989)
  177. J. Vanfleteren, P. De Visschere, J. De Baets, I. De Rycke, J. Doutreloigne, A. Van Calster en M. Maenpoa Active Matrix CdSe TFT Addressed Electroluminescent Displays Proceedings of the 1988 International Display research Conference, pp. 74-79 (1988)
  178. J. Vanfleteren, P. Vandenberghe, A. Van Calster, J. De Baets, I. De Rycke, F. Cuypers en P. Jones A Self-Aligned Poly-CdSe Thin Film Transistor Technology for Active Matrix Adressing With Grey Scales Proceedings of the 7th International Display Research Conference, pp. 165 - 168 (1987)
  179. I. De Rycke, A. Van Calster, J. Vanfleteren en A. De Clercq The Design and Simulation of Poly-CdSe TFT Driving Circuits for High Resolution LC Displays Conference Record 1986 International Display Research Conference, pp. 304-307 (1986)
  180. A. Van Calster, A. Vervaet, I. De Rycke, J. De Baets en J. Vanfleteren Polycrystalline CdSe Films for Thin Film Transistors The Third International Conference on II-VI Compounds, pp. 397 (1986)
  181. J. Vanfleteren, A. Van Calster en H.J. Pauwels Shift Registers with Polycristalline CdSe Thin Film Transistors for the Addressing of LC Displays Conference Record of the 1985 International Display Research Conference, pp. 72-75 (1985)

Andere publicaties

  1. Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren, Wim Christiaens, Erwin Bosman en Johan De Baets System-in-foil technology Ultra-thin chip technology and applications, pp. 141-157 (2011)
  2. J. Van Campenhout, A. Van Calster, M. Brunfaut, J. Depreitere, H. Neefs, J. Vanfleteren, H. Van Marck, D. Stroobandt en C. Das Massaal parallelle informatieverwerking op basis van hybried geintegreerde Si VLSI en III-V opto-elektronische componenten Jaarverslag 1994 ( Deel II ) Samenwerkingsproject IMEC - RUG, pp. 1-16 (1994)
  3. J. Van Campenhout, A. Van Calster, M. Brunfaut, J. Depreitere, H. Neefs, J. Vanfleteren, H. Van Marck en C. Das Massaal parallelle informatieverwerking op basis van hybried geintegreerde Si VLSI en III-V opto-elektronische componenten Jaarverslag 1993 ( Deel II ) Samenwerkingsproject IMEC - RUG, pp. 1-13 (1993)
  4. J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet, J. Doutreloigne, A. Van Calster, P. De Visschere, K. Sallmen en R. Graeffe CdSe TFT Active Matrix Adressed Electroluminescent Displays Proceedings of the 3rd Winter Worshop AMLCDs, pp. (1992)
  5. A. Van Calster, J. Vanfleteren, J. Capon, J. De Baets, I. De Rycke, H. De Smet en J. Doutreloigne CdSe Thin Film Transistors for the Adressing of Liquid Crystal Displays Voorgesteld op de `Summer European Liquid Crystal Conference`, pp. (1990)
  6. A. Van Calster en J. Vanfleteren De CdSe Dunne Film Transistor Technologie voor Vlakke Beeldschermen, Werk Ingediend bij het N.F.W.O. met het oog op het behalen van de Tweejaarlijkse Prijs BARCO-INDUSTRIES N.V., pp. (1988)
  7. A. Van Calster en J. Vanfleteren The CdSe Thin Film Transistor Technology for Flat Panels Displays, Work Submitted at the National Fund for Scientific Research to obtain the Bi-annual Prize BARCO-INDUSTRIES N.V., pp. (1988)
  8. LEM-BARCO., J. Vanfleteren, H. Pauwels, A. De Clercq, P. Vetter, L. Kindt, F. Cuypers, J. Vanfleteren, H.J. Pauwels, A. De Clercq, P. Vetter, L. Kindt en F. Cuypers Programma voor Onderzoek op Alternatieve Display Technieken : Vloeibare Kristal Beeldschermen met Hoge Informatie Inhoud, IWONL Projekt VL 1/4 -3469/072, Onderzoeksverslag 2de Jaar., pp. (1987)
  9. Jan Vanfleteren Digitale Schakelingen met Poly-CdSe Dunne Film Transistoren. Doctoraatsproefschrift Faculteit Toegepaste Wetenschappen, Universiteit Gent, pp. (1987)
  10. A. De Clercq, P. Vandenberghe, F. Cuypers, J. Vanfleteren en L. Kindt Vloeibare Kristal Beeldschermen met Hoge Informatie Inhoud Programma voor Onderzoek op Alternatieve Display Technieken, IWONL Project VL 1/4-3469/072, Onderzoeksverslag 1e jaar, Oktober 1986., pp. (1986)
  11. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag derde mandaat IWONL, pp. (1985)
  12. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag tweede mandaat IWONL, pp. (1984)
  13. M.C. Vanwormhoudt, H.J. Pauwels, A. Van Calster en J. Vanfleteren Onderzoek en Ontwikkeling van Analoge en Digitale Dunne Film Transistor Circuiten, Verslag FKFO projekt F 6/15, Krediet Nr 2.0029.82, pp. (1983)
  14. J. Vanfleteren De Studie en Realisatie van Digitale Schakelingen in Dunne-Film Technologie, Verslag eerste mandaat IWONL, pp. (1983)
  15. J. Vanfleteren Stroom- en Capaciteitsmetingen op Cu2S-CdS Zonnecellen Afstudeerwerk FTW, RUG, pp. (1981)