The adhesion of plated metal layers to epoxy polymer surfaces is of prime importance for the reliability of interconnections inmicroelectronics. An increase in the roughness of the polymer surface, caused by chemical treatment, plays an important part inthe adhesion strength of plated metal layers by increasing the total area of interaction between both layers. This kinetic study ofthe influence of chemical treatments on the surface of the polymer consists of two parts. In Part I the kinetics of sweller treatmentsand of the solvent were examined in detail and a kinetic model for the influence of sweller and solvent was developed. In thissecond part the kinetics of the formation of roughness at the polymer surface due to oxidative liquid treatments is examined. Akinetic model is developed based on experimental studies, compromising the combined effects of sweller-oxidizer treatments andthe influence of diffusion of the different components. A number of examples are given and verified by experiment. The roughnessof the treated polymer samples is measured experimentally by atomic force microscopy. Time-dependant mass measurements wereused to record mass changes due to diffusion and reaction.