This paper describes a complete technology family for parallel optical interconnect systems. Key features are the two-dimensional on-chip optical access and the development of a complete optical pathway. This covers both chip-to-chip links on a single boards, chip-to-chip links over an optical backpanel, and even system-to-system interconnects. Therefore it is a scalable technology. The design of all parts of the link, and the integration of parallel optical interconnect systems in the design flow of electronic systems is presented in this paper.