This contribution describes an efficient process flow\r\nfor production of one-time deformable electronic devices based\r\non standard circuit board technology and demonstrates multiple\r\ndevices fabricated using this technique. The described technology\r\nhas the potential to streamline and simplify the production of\r\ncomplex user interfaces which typically require extensive\r\nmechanical design and many components. The employed\r\ntechnique allows for the production of complex 3D shapes\r\nwithout the need to modify existing circuit board manufacturing\r\nequipment or processes significantly. To achieve this the device is\r\nmanufactured in a flat state, encapsulated in a thermoplastic\r\npolymer laminate and deformed afterwards. This allows the\r\nusage of standard electronic components in surface mount\r\npackages, which are assembled using lead-free high-temperature\r\nsolder. The circuit is deformed using a high-volume cost-effective\r\nthermoforming approach, where the encapsulating polymer is\r\nheated above its glass transition temperature and forced against\r\na mold where it is allowed to cool down again. To enable\r\nsignificant out-of-plane deformations stretchable meandering\r\ninterconnects are used, which were traditionally developed for\r\ndynamically stretchable devices. Fabrication of the circuit starts\r\nusing a standard flexible copper clad laminate which is processed\r\nusing the default techniques, the resulting circuit is then attached\r\nto a carrier board coated with a reusable high-temperature\r\npressure sensitive adhesive. The interconnect and circuit outline\r\nis then defined using laser routing or punching, cutting the\r\nflexible circuit without damaging the carrier. The residuals not\r\npart of the circuit are removed, in a process akin to protective\r\nfilm removal, and solder paste is stencil printed on the circuit.\r\nAfterwards components are placed using a pick-and-place\r\nmachine and the boards are reflow soldered. After functional\r\ntesting and repair (if necessary) the circuits are placed in a\r\nvacuum press with a thermoplastic laminate, consisting of a\r\nthermoplastic elastomer and a rigid thermoplastic sheet. During\r\nthis lamination the components are protected by a highly\r\nconforming press pad. Because the adhesion between the\r\nelastomer and the circuit far exceeds that between the circuit and\r\nthe carrier the circuit is released readily as the thermoplastic\r\nlaminate is peeled away. The resulting laminate is built up\r\nfurther using thermoplastic films and sheets, and finally\r\ndeformed using a vacuum forming machine. The resulting\r\ndevice, which is trimmed to remove the clamping edges, can then\r\nbe mounted in the final assembly. The advantages of this\r\napproach are demonstrated using a series of test vehicles,\r\ndemonstrating the integration of complex circuits, connectors,\r\nand power circuitry. Finally, a series of design considerations\r\nthat became apparent after initial reliability testing are\r\ndiscussed, together with the resulting design rules.