@inproceedings{P097.029, author={Vrana, M. and De Baets, J. and Van Calster, A. and Allaert, B.}, title={Flip-chip assembly for chips with gold bumps on high density thick film substrates}, booktitle={Proceeding of the 11th European Microelectronics Conference}, year={1997}, month={5}, pages={175-182}, address={Venice, Italy}, }