@inproceedings{P097.029,
author={Vrana, M. and De Baets, J. and Van Calster, A. and Allaert, B.},
title={Flip-chip assembly for chips with gold bumps on high density thick film substrates},
booktitle={Proceeding of the 11th European Microelectronics Conference},
year={1997},
month={5},
pages={175-182},
address={Venice, Italy},
}