@inproceedings{P099.071,
author={Vanfleteren, J. and De Baets, J. and Van Calster, A. and Schols, G. and Pergoot, N. and Jarvinen, E. and Aintila, A.},
title={Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies},
booktitle={Proceedings of the 12th European Microelectronics & Packaging Conference},
year={1999},
month={6},
pages={399-404},
publisher={Imaps-Europe},
address={Harrogate},
}