@inproceedings{P099.071, author={Vanfleteren, J. and De Baets, J. and Van Calster, A. and Schols, G. and Pergoot, N. and Jarvinen, E. and Aintila, A.}, title={Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies}, booktitle={Proceedings of the 12th European Microelectronics & Packaging Conference}, year={1999}, month={6}, pages={399-404}, publisher={Imaps-Europe}, address={Harrogate}, }