@inproceedings{P100.167, author={Vanfleteren, J. and Stoukatch, S. and Vandecasteele, B. and Van Calster, A. and Criel, S. and Willems, G. and De Langhe, P. and Vandam, L. and Allaert, K.}, title={Mixed assembly on PCB using a novel flip-chip technology}, booktitle={Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe)}, year={2000}, month={6}, pages={65-70}, address={Prague}, }