@inproceedings{P100.167,
author={Vanfleteren, J. and Stoukatch, S. and Vandecasteele, B. and Van Calster, A. and Criel, S. and Willems, G. and De Langhe, P. and Vandam, L. and Allaert, K.},
title={Mixed assembly on PCB using a novel flip-chip technology},
booktitle={Proceedings of the European Microelectronics Pacakaging an Interconnection Symposium (IMAPS-Europe)},
year={2000},
month={6},
pages={65-70},
address={Prague},
}