@inproceedings{P101.138, author={De Pauw, H. and Vanfleteren, J. and De Baets, J. and Van Calster, A.}, title={Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations}, booktitle={Proceedings of the 2001 International Conference and Exhibition on High Density Interconnect and Systems Packaging}, year={2001}, month={4}, pages={302-307}, address={Santa Clara, California}, }