@inproceedings{P101.138,
author={De Pauw, H. and Vanfleteren, J. and De Baets, J. and Van Calster, A.},
title={Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations},
booktitle={Proceedings of the 2001 International Conference and Exhibition on High Density Interconnect and Systems Packaging},
year={2001},
month={4},
pages={302-307},
address={Santa Clara, California},
}