@inproceedings{P101.224,
author={Thienpont, Hugo and BAUKENS, V and VOLCKAERTS, B and Ottevaere, Heidi and DEBAES, C and VERVAEKE, M and Tuteleers, Pascal and VYNCK, P and HERMANNE, A and HANNEY, M and Brunfaut, Marnik and Van Campenhout, Jan and Veretennicoff, Irina},
title={Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips},
booktitle={DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001},
year={2001},
volume={4408},
pages={6-18},
}