@inproceedings{P101.224, author={Thienpont, Hugo and BAUKENS, V and VOLCKAERTS, B and Ottevaere, Heidi and DEBAES, C and VERVAEKE, M and Tuteleers, Pascal and VYNCK, P and HERMANNE, A and HANNEY, M and Brunfaut, Marnik and Van Campenhout, Jan and Veretennicoff, Irina}, title={Low-cost MOEM interconnect modules for Tb/s.cm(2) aggregate bandwidth to Silicon chips}, booktitle={DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001}, year={2001}, volume={4408}, pages={6-18}, }