@inproceedings{P103.030, author={Siau, S. and Degrendele, L. and De Baets, J. and Van Calster, A.}, title={Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask}, booktitle={Proceedings of the 26th International Spring Seminar on Electronics Technology}, year={2003}, month={5}, pages={158-162}, address={Stara Lesna, Slovakije}, }