@inproceedings{P103.030,
author={Siau, S. and Degrendele, L. and De Baets, J. and Van Calster, A.},
title={Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask},
booktitle={Proceedings of the 26th International Spring Seminar on Electronics Technology},
year={2003},
month={5},
pages={158-162},
address={Stara Lesna, Slovakije},
}