@inproceedings{P104.262, author={Siau, Sam and Vervaet, Alfons and Van Calster, André and Schacht, Etienne}, title={Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper}, booktitle={Electrochemical Society, 205th Meeting, Abstracts}, year={2004}, pages={1}, publisher={The Electrochemical Society}, address={San Antonio, TX, USA}, }