@inproceedings{P104.262,
author={Siau, Sam and Vervaet, Alfons and Van Calster, André and Schacht, Etienne},
title={Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper},
booktitle={Electrochemical Society, 205th Meeting, Abstracts},
year={2004},
pages={1},
publisher={The Electrochemical Society},
address={San Antonio, TX, USA},
}