@article{P105.002,
author={Siau, Sam and De Baets, Johan and Van Calster, Andre and Heremans, Leon and Tanghe, Sammy},
title={Processing quality results for electroless/electroplating of

high-aspect ratio plated through holes in industrially

produced printed circuit boards.},
journal={Microelectronics Reliability},
year={2005},
month={3},
volume={45},
number={3-4},
pages={675?687},
editor={Andre Van Calster},
publisher={Elsevier Ltd.},
}