@inproceedings{P105.148,
author={De Mey, Gilbert and Vermeersch, Bjorn and Kawka, Piotr},
title={Thermal Impedance Simulations of Electronic Packages},
booktitle={Proceedings of the 12th International Conference on Mixed Design and Integrated Circuits and Systems (MIXDES 2005)},
year={2005},
month={6},
volume={1},
pages={267-269},
editor={Napieralski, A.},
address={Krakow, Poland},
}