@inproceedings{P105.148, author={De Mey, Gilbert and Vermeersch, Bjorn and Kawka, Piotr}, title={Thermal Impedance Simulations of Electronic Packages}, booktitle={Proceedings of the 12th International Conference on Mixed Design and Integrated Circuits and Systems (MIXDES 2005)}, year={2005}, month={6}, volume={1}, pages={267-269}, editor={Napieralski, A.}, address={Krakow, Poland}, }