@inproceedings{P106.358,
author={Christiaens, Wim and Bosman, Erwin and VANFLETEREN, J},
title={Ultra-thin chip package using embedding in spin-on polyimides},
booktitle={Proceedings of the 4th European Microelectronics and Packaging Symposium (EMPS)},
year={2006},
pages={125-128},
}