@inproceedings{P106.363,
author={Christiaens, Wim and Vandevelde, Bart and Bosman, Erwin and Vanfleteren, Jan},
title={UTCP : 60 µm thick bendable package},
booktitle={International Wafer-Level Packaging Conference, 3rd, Proceedings},
year={2006},
pages={114-119},
address={San Jos��, CA, USA},
}