@inproceedings{P106.363, author={Christiaens, Wim and Vandevelde, Bart and Bosman, Erwin and Vanfleteren, Jan}, title={UTCP : 60 µm thick bendable package}, booktitle={International Wafer-Level Packaging Conference, 3rd, Proceedings}, year={2006}, pages={114-119}, address={San Jos��, CA, USA}, }