@inproceedings{P107.031,
author={Vermeersch, Bjorn and De Mey, Gilbert},
title={A Fixed-Angle Heat Spreading Model for Dynamic Thermal Characterization of Rear-Cooled Substrates},
booktitle={Proc. 23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007), San Jose, California (USA), 18 - 22 March},
year={2007},
month={3},
pages={95-101},
publisher={IEEE},
address={Piscataway},
}