@inproceedings{P107.031, author={Vermeersch, Bjorn and De Mey, Gilbert}, title={A Fixed-Angle Heat Spreading Model for Dynamic Thermal Characterization of Rear-Cooled Substrates}, booktitle={Proc. 23rd Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007), San Jose, California (USA), 18 - 22 March}, year={2007}, month={3}, pages={95-101}, publisher={IEEE}, address={Piscataway}, }