@inproceedings{P107.118,
author={Hendrickx, N. and Van Erps, J. and Thienpont, H. and Van Daele, P.},
title={Inter-plane coupling structures for pcb-integrated multilayer optical interconnections},
booktitle={Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)},
year={2007},
month={6},
pages={65-69},
address={Oulu, Finland},
}