@inproceedings{P107.118, author={Hendrickx, N. and Van Erps, J. and Thienpont, H. and Van Daele, P.}, title={Inter-plane coupling structures for pcb-integrated multilayer optical interconnections}, booktitle={Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)}, year={2007}, month={6}, pages={65-69}, address={Oulu, Finland}, }