@inproceedings{P107.119, author={Van Erps, J. and Hendrickx, N. and Debaes, C. and Van Daele, P. and Thienpont, H.}, title={Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections}, booktitle={Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)}, year={2007}, month={6}, pages={70-75}, address={Oulu, Finland}, }