@inproceedings{P107.119,
author={Van Erps, J. and Hendrickx, N. and Debaes, C. and Van Daele, P. and Thienpont, H.},
title={Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections},
booktitle={Proceedings of the 16th European Microelectronics and Packaging Conference (EMPC)},
year={2007},
month={6},
pages={70-75},
address={Oulu, Finland},
}