@article{P107.245,
author={Kawka, Piotr and De Mey, Gilbert and Vermeersch, Bjorn},
title={Thermal Characterization of Electronic Packages using the Nyquist Plot of the Thermal Impedance},
journal={IEEE Transactions on Components and Packaging Technologies},
year={2007},
month={12},
volume={30},
number={4},
pages={660-665},
}