@article{P110.041,
author={Govaerts, Jonathan and Bosman, Erwin and Christiaens, Wim and Vanfleteren, Jan},
title={Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology},
journal={IEEE TRANSACTIONS ON ADVANCED PACKAGING},
year={2010},
volume={33},
number={1},
pages={72-78},
}