@inproceedings{P114.444, author={Vandevelde, Bart and Labie, Riet and Willems, Geert and Degrendele, Lieven and Cauwe, Maarten and De Baets, Johan}, title={Reduced 2nd level solder joint life time of low-CTE mold compound packages}, booktitle={5th Electronic Materials, Processes and Packaging for Space, Proceedings}, year={2014}, pages={7}, address={Noordwijk, The Netherlands}, }