@inproceedings{P114.444,
author={Vandevelde, Bart and Labie, Riet and Willems, Geert and Degrendele, Lieven and Cauwe, Maarten and De Baets, Johan},
title={Reduced 2nd level solder joint life time of low-CTE mold compound packages},
booktitle={5th Electronic Materials, Processes and Packaging for Space, Proceedings},
year={2014},
pages={7},
address={Noordwijk, The Netherlands},
}