@inproceedings{P116.308,
author={Plovie, Bart and Yang, Yang and Guillaume, Joren and Dunphy, Sheila and Dhaenens, Kristof and Van Put, Steven and Vervust, Thomas and Bossuyt, Frederick and Vanfleteren, Jan},
title={One-time deformable thermoplastic devices based on flexible circuit board technology},
booktitle={2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)},
year={2016},
publisher={Institute of Electrical and Electronics Engineers (IEEE)},
address={Taipei},
}