@inproceedings{P116.308, author={Plovie, Bart and Yang, Yang and Guillaume, Joren and Dunphy, Sheila and Dhaenens, Kristof and Van Put, Steven and Vervust, Thomas and Bossuyt, Frederick and Vanfleteren, Jan}, title={One-time deformable thermoplastic devices based on flexible circuit board technology}, booktitle={2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)}, year={2016}, publisher={Institute of Electrical and Electronics Engineers (IEEE)}, address={Taipei}, }